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Home | Applications | Electronics Cooling   » Electronics Cooling (Home)   » Demo/Info Request   » News   » Technical papers   » Testimonials » FLOTHERM Achieves 95% Customer Satisfaction in New Survey » Cool running, New Electronics magazine (UK), 10 June 2008 » Thermal Simulation Speeds Design of Versatile Vertical/Horizontal Heatsink Dan Mendoza, Packaging Engineer AEG Electric Tools GmbH Creates Cool Power Tools Faster with EFD.Lab Flow Simulation Thales Air Systems Division Selects EFD.Pro Engineering Fluid Dynamics Software Embedded in Pro/ENGINEER Hewlett-Packard Keeps Processors Cool New Standards, Techniques for Package Thermal Modeling, Semiconductor International, June 2007 Certifying Design of Video Control Cabinet for 747 In-Flight Entertainment System Flow Simulation Helps Solve Power LED Overheating Problem in One Day AMCC Uses Flotherm & Flopack to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance Thales Air Systems Division Dialight PLC Chooses EFD.Pro Engineering Fluid Dynamics Software for Pro/ENGINEER EFD Meshing Technology White Paper "Avoiding meltdown", Machine Design, August 2007 The Changing Role of CFD in Electronics Thermal Design Targeted Airflow - EFD.Lab Used for Flow Simulation at Océ Analysis of a Heat Pipe Assisted Heat Sink Thermal limits of flip chip package-experimentally validated, CFD supported case studies Thermal design of telecommunications mini cabinet Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications Investigating Limits in Naturally Cooled Systems Using FLOTHERM An Experimental Assessment of Compact Thermal Models for the Prediction of Board-Mounted Electronic Component Heat Transfer Turbulence Modelling and it's Impact on CFD Predictions for Cooling of Electronic Components Optimizing Thermal Performance of a Dictionary Size Multimedia Projector Webinar: Anti-Moisture Methodology for Electronics Enclosures in Harsh Storage Environments Simulation Helps Solve Difficult Thermal Challenge in Tower Mounted Amplifier Webinar: Automating Semiconductor Package Thermal Characterization and Design "Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System" Trevor Moody, Antares Sharp Laboratories Selects EFD.V5 Engineering Fluid Dynamics Software for CATIA V5 Hot Predictions, New Electronics, July 2007 Intersil Gains Competitive Advantage Through Thermal Analysis NVIDIA Optimizes Thermal Design of Graphics and Digital Media Processors Using FLOTHERM Joint Flomerics/Cadence solution helps Cisco bring next-generation switch to market Ascom Use FLOTHERM to Perfect Novel Heat Sink Design & Make Telecom Power Supply Products Smaller FLOTHERM helps keep in-car DVD players cool Hewlett-Packard Keeps Processors Cool with FLOTHERM One Cool Machine Thermacore Develops Cooling Solutions for High Power IGBTs and MOSFETs Using FLOTHERM Harris Corporation Optimizes Power-HFET Devices Using FLOTHERM FLOTHERM and T3Ster Help Imbera Develop New Integrated Module Board (IMB) Technology RFMD Optimizes High Power Device Testing Chamber with FLOTHERM Tekelec Incorporates Emerging Requirements for Telecom Switching Equipment Using FLOTHERM Eaton Hits Thermal Targets on First Prototype with FLOTHERM FLOTHERM Helps Tecnobit Ensure Reliability of Avionics Equipment Alcatel Solves Thermal Issues Early with FLOTHERM Novel Approach Offers Significant Improvements in Thermal Interface Material Performance Thales Avionics Uses Thermal Design Services from FLOMERICS to Certify Design of Video Control Cabinet for 747 In-Flight Entertainment System Heat Exchanger Cold Plate Flomerics Releases Flotherm Version 7 with Unrivalled Design Optimization Capability Thermal Simulation Helps Cool Aircraft Electronic Equipment at 50,000 Feet Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: the C4/Ceramic-ball-Grid Array Interconnect Technology Application of a Numerical Tool for Thermal Evaluation of Printed Boards in Communication Systems Numerical Simuation of Natural Convection Heat Transfer in a Television Set Development of a high performance low pressure drop water cold-plate for electronic packaging applications Thermal Performance of Air-Cooled Hybrid Heat Sinks for a low Velocity Environment System-level thermal model of an audio set CFD modelling for component-level and board-level thermal analysis; a PBGA interconnect technology for low-velocity air-cooling Thermal Evaluation of a Power PC 620 Multi-Processor Computer Thermal Analysis of a PC chassis The optimum selection of the Broadband Network Unit cabinet walls thickness. Thermal Model of a Bench-Top Microprocessor-Based Unit Thermal Analysis of an integrated motor and finned housing Thermal Analysis and reliability prediction for airborne digital audio system Concurrent Design of a PowerPCtm Microcomputer: EDA and CFD Tool Interoperability Flotherm Thermal Analysis of Heat Sink Design for Pentium Processor in Tape Carrier Packages Supporting experiments for CFD based thermal design of telecommunications equipment Development and Application of Compact Models of Packages Based on DELPHI Methodology Compact Transient Thermal Models for the Polymer Stud Grid Array (PSGATM) Package System-Level Thermal Modeling of a Compact, High-Efficiency Cooling Device for the PA8000 Processor Optimizing the Integration of a Electronics System into an Existing Enclosure Using CFD Modeling Techniques 3D Model to Analyse the Thermal Behaviour of a Digital Rectifier The Significance of Radiation in a Central Office Chassis: A Case Study Validating Numerical Predictions of Component Thermal Interaction on Electronic Pronted Circuit Boards In Forced Convection Airflows By Experimental Analysis An Optical And Numerical Investigation Of The Thermal Interaction Between An Isothermal Cylinder And Its Isothermal Enclosure Creation and Validation of a Two-Resistor Compact Model of a Plastic Quad Flat Pack (PQFP) Using CFD Modeling Phase Change Material in Electronics using CFD – A Case Study A Study of Compact Thermal Model Topologies in CFD for a Flip Chip Plastic Ball Grid Array Package Simulation of Steady State and Transient Solar Loading of Outdoor Fiber Optic Enclosure Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications Power stage thermal design for DDX Amplifiers Thermal Design Methodology for Electronic Systems Thermal Management of OSTAR® Projection Light Source The Extraction of a Two-Resistor/Two-Capacitor Model for Common IC Packages and their Implementation in CFD Transient Performance of Common Modeling Assumptions Used in Detailed Thermal Package Models Thermal Characterization of High Speed DDR Devices in System Environments Thermal Transient Modeling And Experimental Validation In The European Project PROFIT Thermal Optimization of Electronic Systems Using Design of Experiments Based on Numerical Inputs Numerical Investigation of Enclosure Effects on Spot Cooling Devices A Modified Pressure Drop Analytical Method for Heat Sink Simulation-Based Design Optimization Methodologies Applied to CFD The effect of fan swirl to PSU cooling System Level Thermal Simulation of a Computer Chassis using FLOTHERM Software Thermal Simulation Speeds Smaller, Quieter BTX PCs to Market Intersil Gains Competitive Advantage Through Thermal Analysis Graphics and Digital Media Processors Design Speeding Thermal Design for Customers by Providing Compact Models Cooling Design of a Sealed Optical Networking Unit Numerical and Experimental Study of Forced Convection Over Power Supply Heat Sinks "Reducing Thermal Risk is a Key Factor for any Programs Success", Military Embedded Systems, March 2008 Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts Pipinghot Networks Knocks 3 Months off Development Time Using Flotherm FICO trim&form RAPA Rausch & Pausch Elektrotechnische Spezialfabrik GmbH The basics of fluid flow and heat transfer and how they can be applied to electronics cooling applications - Printed Circuit Design & Manufacture - July 2006 Flomerics and Gradient Design Automation Partner to Address Die-Level Thermal Issues CADENCE/FLOMERICS Joint Solution helps CISCO bring Leading-Edge Switch to Market Texas Instruments Uses Thermal Simulation to Speed Disk Drive Time to Market Using Computational Fluid Dynamics to design Heat Transfer Enhancement methods for cooling channels Motorola's Handheld Portable Technology - Validating CFD Technology Surface-Mount Heat Sink Thermal Analysis Using FLOTHERM and the Command Center to Exploit the Principle of Superposition Display Panel Thermal Design and Analysis Package Geometry Considerations in Thermal Compact Modeling Strategies Thermal Characterization and Modelling of EFD Transformers, Applying DELPHI Methodology Thermal Characterisation of SSOP Packages Thermal Design for Flip-Chip on Board in Natural Convection Software Simulation of a Double-Sided PCB Design and Thermal Analysis of the SunRay1 Network Terminal CFD System Level Modeling of a Large Telecommunications Enclosure Application of CFD Technique in Thermal Design of a Telecommunication Base Station A Design Approach to Thermal Characterization of Forced Convection Systems using Superposition in CFD Comparison of Numerical Predictions and Experimental Measurements for the Transient Thermal Behavior of a Board-Mounted Electronic Component Prediction of Thermal Performance of Flip Chip - Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Substrate Physical Design Integration of Flotherm Within HS Marston Aerospace Ltd Thermal Modeling and Measurement of Large High Power Silicon Devices With Asymmetric Power Distribution Thermal Analysis of Sealed Enclosure for over the Ocean Application Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future Requirements Thermal Performance Evaluation for a Microelectronics Motor Control System Incorporating Dynamic Heat Sources Application of Low-Reynolds Number Turbulent Flow Models to the Prediction of Electronic Component Heat Transfer Thermal Characterization of a 3-Dimensional Memory Module Use of FLOTHERM within PTT Telecom A 3-D, Thermal Analysis of Microprocessors The Use of FLOTHERM During the Development of a New Telecommunication Equipment Thermal Modelling of a Hewlett Packard Workstation from Concept to Finished Product Solving the Thermal Design Concerns of a Low-Voltage Power Supply using CFD Modeling Two Thermal Simulation Approaches for Electronic Equipment Cambridge Broadband Optimizes VectaStar 3500 Using Flomerics’ Thermal Design Services What Do These World-Leading Electronic Products Have In Common? PQFP + Heatsink = ? Solving Thermal Design Problems in the Pentium Microprocessor Series T-Wing Heat Spreader on a PQFP Thermal Modeling of Ball Grid Arrays Benard Convection in a Rectangular Cavity ALSTOM Slashes Development Costs For Variable Speed Drives Thermal Simulation Using Flomerics' Software Thermal characterisation of a power module Flomerics Technologists’ Paper Selected as Best of 2005 by IEEE Publication Imbera Optimizes Thermal Design Using Flotherm & T3Ster Thermal design tool provides link to Allegro PCB Editor - EE Times - February 2006 NVIDIA® Uses Compact Thermal Models to Speed Design of NVIDIA nForceTM 4-based Systems Thermal Modelling of the Pentium Processor FLOTHERM Simulations of Consumer Electronics Products during the Development Process at ITCL - Philips Application of a CFD Tool for System-level Thermal Simulation Experimental and computational studies on the thermal management of electronics enclosures using natural convection Using FLOTHERM on thermal design of an optical transmission Application of the FLOTHERM Thermal Analysis Software to Telecommunication Equipment Cooling analysis of Digital's ATMswitch 900 Case Study of Thermal Management for Mobile Multi-Media (MMM) Applications FLO/STRESS: An Integrated Stress Solver For The CFD Tool FLOTHERM Getting the Most Out of Your CFD Program (255 KB) A Numerical Study of the Thermal Performance of an Impingement Heat Sink - Fin Shape Optimization Heat Sink Optimization for Optical Transponders Micro Cooling Application on High Density Memory Module Thermal Management of Golden Dragon LED Refrigeration Assisted Spot Cooling of a High Heat Density Data Center System Cooling of Outdoor Wi-Fi Antenna Conjugate Heat Transfer of One Component on a PCB in a Small Enclosure Thermal Design of the Silicon Graphics Indigo 2 Workstation using Physical and Computational Modelling Numerical Simulation Methodology Used for Thermal Design of a Minicomputer Addressing the Unique Thermal Management Challenges of Mobile Devices Ensuring Thermal Integrity for The SG100 NAS System Reducing Developmend Time Thermal Design of the Silicon Graphics Indigo 2 Workstation Radical Redesign of a Desktop PC Enclosure The Effect of Thermocouples on Measurements A Pin Fin Heatsink in Angled Flow FLOTHERM Helps Cool The Fastest Chip In The World Using FLOTHERM to Perfect Novel Heat Sink Design FLOTHERM Analysis of a Desktop Computer Egenera Turns to FLOMERICS to Optimize the Thermal Performance of its Server Processing Blade Months Before the Technology is Available for Testing Concurrent Engineering Helps Meet Thermal Challenges of High Speed Design Anritsu Company Saves 4-6 Week PCB Re-Spin by Thermal Modeling in Early Design Stage Galileo Avionica Standardizes on Thermal Simulation Software from Flomerics Linking CFD and EDA tools: The interoperability of Flotherm and BoardStation/Autotherm during concurrent design of a Motorola PowerPC-based microcomputer Some Tricks of the Trade of a FLOTHERM User Thermal characteristics of complex systems An Airspeed Measurement Technique for Accurate Correlation to CFD Simulation Results Modelling Of A Phase Change Material Thermal Battery Modeling, Validation and Thermal Solution Design for a Flip-Chip Plastic Ball Grid Array Package Thermal Management of Palmtop Projector products High performance/volume ratio CPU Cooler Design with FLOTHERM simulation Cooling Analysis for Plasma Display Panel Enclosure Using Cap-Integral Standoffs to Reduce Chip Hot-Spot Temperatures in Electronic Packages Thermal Assessment of RF Integrated LTCC Front End Module (FEM) Component and Board-Level Thermal Modeling Techniques for XFP Optical Transceivers Sense and Nonsense Thermal Requirements PCB Design Flow Under Thermal Control Thermal Challenges of a Compact Power Entry Module PCB Design Flow Under Thermal Control Philips Create Thermal Simulation in Concept Design of a Complex System The Application of FLOTHERM to Solving Air Flow and Heat Transfer problems in Power Supplies and Domestic Appliances Creating and Solving CFD and FEA models Thermal Analysis of Electronics in a Missile System Characterisation of boundary conditions for an aircraft engine electronic control unit Thermal Design Productivity Enhanced With On-line Fan Libraries FLOTHERM Analysis Helps Cool The Fastest Chip In The World The 1GHz ALPHA Processor Working with Flomerics' Thermal Design team pays off Playing it cool, CIE, January 2007 Flomerics Establishes Thermal Test Lab in North America After Acquisition of MicReD 'SEED' Project Signals Major Advance in Thermal Modeling of Electronic Equipment Thermal Analysis of an Electronic Enclosure in a Harsh Working Environment Choosing Fan and Heatsink for a New Generation of AC - AC Converters Thermal Experiment and Analysis of Small Desktop Enclosure A two-level Micro/Macro Approach to the Simulation of Air Flow and Heat Transfer in Typical Convection-Cooled Electronic Systems Convection Cooling in Microelectronic Packages: Comparison with FLOTHERM Simulations Thermal analysis and environment of FLOTHERM Predicting Maximum Junction Temperatures and Thermal Performance in the Design and Development of ASICS