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Active Chilled Beam Cooling Reduces Energy Usage 20% in North Carolina Lab
»
AMCC Uses Flotherm & Flopack to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance
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Flomerics Version 8.2 of EFD Simulation Software Offers Enhanced Usability and Increased Performance
Ultra Electronics
Ultra Electronics
Solving the System-Level Thermal Management Challenges of LEDs
Flomerics Publishes White Paper and Sponsors Webcast on the Latest Meshing Techniques for Flow Simulation
CFD-Online Launches Dedicated User Forum for Flomerics’ CAD-Embedded Simulation Software
ThermPaq from Flomerics Accelerates Thermal Characterization of Semiconductor Packages
Thales Air Systems Division Selects EFD.Pro Engineering Fluid Dynamics Software Embedded in Pro/ENGINEER
TROX INVESTS A FURTHER £100K IN R&D FACILITIES, including “state of the art” engineering fluid dynamics (EFD) software
System-in-Package Technologies? - The need for DfX
Flomerics’ MicReD Subsidiary to Play Major Role in Microelectronics Thermal Research Project “NANOPACK”
EFD Heat Exchanger Demo
EFD Gas Turbine Combustor Demo
Flomerics Celebrates 20th Anniversary, Validating Concept of Simulation for Non-Specialists
EFD.Pro Engineering Fluid Dynamics Will Support PTC® Pro/ENGINEER® Wildfire® 4.0
MARENCO AG Reduces Extractor Hood Design Time
CATIA V5-Embedded CFD Helps Save Four Months in Design of Automotive Valve
Fluid Simulation Reduces Extractor Hood Design Time
"Time Saver - With the use of fluid simulation software, a company reduced valve prototype time from three months to one day", Modern Application News, Jan 2008
"The Myths of CFD: Computational Fluid Dynamics works better, and is easier than you think", Machine Design, Dec 2007
Flomerics Sells Electromagnetics Business to CST GmbH
Practical CAD Geometry Cleanup for CFD Analysis
Flomerics joins NAFEMS CFD Working Group
Natural Ventilation Design with CFD
Thermal Characterization of Solid State Lighting
Flomerics Releases Version 8.1 of EFD Engineering Fluid Dynamics Analysis Software
FloXpress By Flomerics Brings 3D Fluid Dynamics Simulation To All SolidWorks 2008 Users
Saipem UK Selects EFD.Lab Engineering Fluid Dynamics Software for Autodesk Inventor
Flomerics Helps Canadian Schools Pursue F1 Pole Position
EFD.V5 for CATIA Helps Save Four Months in Design of Automotive Valve
Flomerics EFD Products, Review by MCAD magazine, Sept 2007
The Changing Role of CFD in Product Design
Compare Your Fluid Dynamics IQ to the Average Mechanical Engineer
Flomerics Releases FLO/PCB Version 4.1
Bronswerk Heat Transfer BV Develops Groundbreaking Air-Cooled Coolers and Innovative Fans with Massive Environmental Impact
Fluid Simulation Reduces Valve Prototype Development Time from 3 Months to 1 Day
Embedding the Flow
Hewlett-Packard Keeps Processors Cool
Ingersoll Rand Energy Systems Improves Microturbine Using EFD Flow Simulation Software
New Standards, Techniques for Package Thermal Modeling, Semiconductor International, June 2007
Liquid Cooling of Bright Leds for Automotive Applications
T3Ster Validation of Thermal Models of IC Packages... and more
EFD.Lab at Grohe: Flow Simulation Right from the Predevelopment Phase
FLOTHERM Enables Faster Design Process
Agilent Speeds Thermal Design for its Customers by Providing Compact Models
HNC Develops Innovative Cleanroom Designs with FLOVENT
Modelling Smoke and Fire in a Hotel Bedroom
CEEMO Engineering Uses EFD.Lab to Fine-Tune New Race Car Design in 8 Weeks
Watts Industries Netherlands Ensures Safe Drinking Water by Using Engineering Fluid Dynamics
Laser Cutting System from Fico Achieves 40x Performance Enhancement after Engineering Fluid Dynamics Analysis
Miniature Precision Uses EFD.V5 Flow Simulation to Optimize Hydrocarbon Trap
CAD-Integrated CFD Software Helps Design Innovative Flush Valve in Less Time
"APC Uses Airflow Simulation to Solve Data Center Cooling Problem", Customer Case Study by American Power Conversion (APC)
FLOTHERM Helps Tecnobit Ensure Reliability of Avionics Equipment
Alcatel Solves Thermal Issues Early with FLOTHERM
Certifying Design of Video Control Cabinet for 747 In-Flight Entertainment System
One Cool Machine
Tekelec Incorporates Emerging Requirements for Telecom Switching Equipment Using FLOTHERM
CFD in Ventilation Design
Active Chilled Beam Cooling Reduces Energy Usage 20% in North Carolina Lab
AMCC Uses Flotherm & Flopack to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance
Flomerics Version 8.2 of EFD Simulation Software Offers Enhanced Usability and Increased Performance
Critical Succss Factors in Chassis Design
EFD Webinar: Analysis of a Variable Turbine Geometry Turbocharger
Thales Air Systems Division
Dialight PLC Chooses EFD.Pro Engineering Fluid Dynamics Software for Pro/ENGINEER
"Embed with CFD", MCAD Online, Feb 2008
F1 Limitation on Use of CFD Software Could Benefit More Productive Software Providers
"Integrating CFD into Mechanical Design", Industrial Equipment News, Jan 2008
EFD Meshing Technology White Paper
Survey Shows 95% of Flomerics’ EFD Fluid Flow Software Users Recommend It
Fluid Simulation Reduces Valve Prototype Development Time from 3 Months to 1 Day
"Avoiding meltdown", Machine Design, August 2007
The Changing Role of CFD in Electronics Thermal Design
Eclipse Combustion Optimizes Industrial Air Heaters with Gas Burners in Two Weeks
Heating, Ventilating and Air Conditioning (HVAC) System for Vehicles
Flomerics Releases Flovent Version 7 with Unrivalled Design Optimization Capability
Windshield Wiper System Design
Airflow inside Heavy Goods Vehicle Cabin
Race Car Design
Variable Geometry Turbochargers
Side Pipe
Catalytic Converter
External Aerodynamics
Actaris Designs Novel Gas Meters using EFD.Lab Flow Simulation Software
"ANCIS Optimizes Data Center Cooling with Flovent CFD Software", Customer Case Study by ANCIS Inc
Valeo Uses Flotherm Thermal Simulation Software to Ensure Reliability of Automotive Control System
Thermal Design Process At Teradyne's Industrial Consumer Division
Analysis of a Heat Pipe Assisted Heat Sink
Application of Lagrangian particle transport model to tuberculosis (TB) bacteria UV dosing in a ventilated isolation room
The Development of Libraries of Physical Models of Electronic Components for an Integrated Design Environment
Modelling of IC/Packages based on thermal characteristics
Thermal limits of flip chip package-experimentally validated, CFD supported case studies
Thermal design for Fujitsu FCS-1000 outdoor telecommunications cabinet
Thermal design of telecommunications mini cabinet
Cooling design of a sealed Optical Network Unit (ONU) enclosure
Using CFD to Predict the Flow Behaviour of the UHP Lamp.
Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications
Thermal Analysis of MAXITE Micro Base Station
A Comparative Study of the Performance of Compact Model Topologies and their Implementation in CFD for a Plastic Ball Grid Array
Simplified Analytical Models for Forced Convection Heat Transfer from Cuboids of Arbitrary Shape
Heat Spreading and Conduction in Compressed Heatsinks
DELPHI Compact Models Revolutionize Thermal Design
Modeling Large-Scale Electronic Systems Using Computational Fluid Dynamics Through a“Zoom-in” Approach
Investigating Limits in Naturally Cooled Systems Using FLOTHERM
Simulation-based Design Optimization Methodologies applied to CFD
An Experimental Assessment of Compact Thermal Models for the Prediction of Board-Mounted Electronic Component Heat Transfer
Turbulence Modelling and it's Impact on CFD Predictions for Cooling of Electronic Components
Ensuring Reliability of Automotive Control System
PCB Design
Optimizing Next-Generation Signaling and Switching Equipment
Harris Corporation Optimizes Power-HFET Devices Using FLOTHERM
Significant Savings in Development of New ADSL Telecommunications Enclosure
Optimizing Thermal Performance of a Dictionary Size Multimedia Projector
Paris Charles de Gaulle Airport
The Louvre Museum uses FLOVENT to improve ventilation of underground service areas
"Optimizing Data Center Airflow Reduces Risk of Equipment Failure", Flomerics White Paper
"Hewlett-Packard Company and Emerson Energy Systems Validate Use of FLOVENT for Data Center Analysis", Customer Case Study
Angle Grinder Design
OneBTS Base Station Thermal Simulation vs Thermal Test Results
It's not all about the Hall - Designing the Datacenter, Inside and Out
Flomerics software predicts thermal performance of data centers
Simulation Helps Solve Difficult Thermal Challenge in Tower Mounted Amplifier
Automating Semiconductor Package Thermal Characterization and Design
On the Application of CFD for Marine Heavy Transport and Lifting Projects
Simulation Helps Meet Thermal Challenges of World’s Fastest Supercomputer
JAZO Zevenaar B.V.
Watts Industries
Miniature Precision Components
Dialight PLC
Eclipse Combustion
Sharp Laboratories Europe
Bronswerk Heat Transfer
CEEMO Engineering
Marenco AG
Saipem UK
VENTREX Automotive GmbH
Shaw Aero Devices, Inc.
Ingersoll Rand Energy Systems
TROX UK
World Electronic Thermal Management Market to Witness Healthy Growth and Reach $5.8 Billion by 2010, According to New Report by Global Industry Analysts, Inc.
"Modeling Copper Concentration Improves PCB Thermal Simulation Accuracy", Byron Blackmore, Flomerics Inc.
"Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System" Trevor Moody, Antares
Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System
Flovent CFD Software Used in Design of First Illinois University Residence to Achieve LEED Gold Status
Sharp Laboratories Selects EFD.V5 Engineering Fluid Dynamics Software for CATIA V5
Airflow Simulation Ensures +/-1 F Temperature Range in Pharmaceutical Warehouse, Controlled Environments magazine, Sept 2007
"Software takes the heat off electronics", Machine Design magazine, 12 Sept 2007
"Improved Thermal Design of PCBs Using Surface Optimization Modeling", Printed Circuit Design & Manufacture, August 2007
"Ventilation Strategy for Laboratories", HPAC magazine, August 2007
New Diffuser Models Improve Airflow Simulation in the Built Environment
Why a Thermal Standard Is Not a Horse - The World According to the JEDEC JC15 Committee
Embedding the Flow, Desktop Engineering, August 2007
“Engineering Fluid Dynamics for Education” Offer by Flomerics Attracts Universities and Technical Colleges Worldwide
Hot Predictions, New Electronics, July 2007
Hewlett-Packard Keeps Processors Cool with FLOTHERM
FLOTHERM helps keep in-car DVD players cool
Ascom Use FLOTHERM to Perfect Novel Heat Sink Design & Make Telecom Power Supply Products Smaller
Joint Flomerics/Cadence solution helps Cisco bring next-generation switch to market
NVIDIA Optimizes Thermal Design of Graphics and Digital Media Processors Using FLOTHERM
Intersil Gains Competitive Advantage Through Thermal Analysis
One Cool Machine
Thermacore Develops Cooling Solutions for High Power IGBTs and MOSFETs Using FLOTHERM
Harris Corporation Optimizes Power-HFET Devices Using FLOTHERM
FLOTHERM and T3Ster Help Imbera Develop New Integrated Module Board (IMB) Technology
RFMD Optimizes High Power Device Testing Chamber with FLOTHERM
Tekelec Incorporates Emerging Requirements for Telecom Switching Equipment Using FLOTHERM
Eaton Hits Thermal Targets on First Prototype with FLOTHERM
Thermacore Optimizes Thermal Performance of Automotive Intercooler using FLOTHERM
FLOTHERM Helps Tecnobit Ensure Reliability of Avionics Equipment
Combination of FLO/PCB and FLOTHERM reduces prototyping costs
Kling Optimizes Air Distribution in Laboratory with FLOVENT
University of Kansas Optimizes Ventilation Performance Using FLOVENT
FLOVENT reduces bottlenecks and improves engineering performance
Airflow Simulation Solves Cold Air Problem at Bluewater Winter Garden
FLOPACK saves hours of engineering time
Alcatel Solves Thermal Issues Early with FLOTHERM
Philips Use T3Ster to Develop Thermal Models of Chip Packages
Novel Approach Offers Significant Improvements in Thermal Interface Material Performance
Thales Avionics Uses Thermal Design Services from FLOMERICS to Certify Design of Video Control Cabinet for 747 In-Flight Entertainment System
Cooling System for a Ka Band Transmit Antenna Array
Dishwasher Design
Electronics Enclosure
Heat Exchanger
Heat Exchanger
Propeller Design
Cold Plate
Heating, Ventilating and Air Conditioning (HVAC) system
Projector Lamp
Valves / Machinery
Oven
Pipes
Pipes
Tanks
Flomerics Releases Flotherm Version 7 with Unrivalled Design Optimization Capability
Thermal Simulation Helps Cool Aircraft Electronic Equipment at 50,000 Feet
Flomerics Group PLC - Preliminary Results
JAZO Cuts Design Time for Outdoor Transformer Housings from 3 Weeks to 1 Day Using Pro/ENGINEER and EFD.Pro
New Flovent Diffuser Models Improve Airflow Simulation in Buildings
Flomerics Interview, MCAD magazine, Jan 2007
Reducing Nosocomial Infections in ORs - Infection Control Today - June 2003
ALSTOM Slashes Development Costs For Variable Speed Drives Using FLOTHERM Thermal Analysis Software
Fan Swirl and Planar Resistances Don't Mix
Intersil Gains Competitive Advantage Through Thermal Analysis
A Passive Courtyard Home in Jaipur, India:
Flovent CFD as an aid to the measurement of air movement characteristics within buildings
Overview of the use of Flovent in the Swiss energy saving research
Use of computer modeling techniques to investigate aspects involved in cold air distribution systems
Thermal Management of OSTAR® Projection Light Source
Thermal Analysis of a Telecommunications Rack System
Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: the C4/Ceramic-ball-Grid Array Interconnect Technology
A Study on the Optimal Design Technique of Cabinet Ventilation System by Neural Network
Estimating the Influence of PCB and Component Thermal conductivity on component temperatures in natural convection
Cooling of a CPU Board with Two Lines of Four Microprocessors in the Mean Flow
Numerical and Experimental Study of Forced Convection Over Power Supply Heat Sinks
Application of a Numerical Tool for Thermal Evaluation of Printed Boards in Communication Systems
Thermal Modelling and Experimental Characterization of the C4/Surface-Mount-Array Interconnect Technologies. IEEE, March 1995
Simple Temperature Measurements to Calibrate a CFD Model of CPGA/Heatsink Assemblies to Optimise Heatsink Performance
Development of a high performance low pressure drop water cold-plate for electronic packaging applications
Thermal Performance of Air-Cooled Hybrid Heat Sinks for a low Velocity Environment
Numerical Simuation of Natural Convection Heat Transfer in a Television Set
Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603 and PowerPC 604 RISC Microprocessor
The Development of Three-dimensional Computational-Fluid-Dynamics Models of PBGA Interconnect Technology for Moderate Air-cooled Systems
Experimental validation methods for thermal models
CFD modelling for component-level and board-level thermal analysis; a PBGA interconnect technology for low-velocity air-cooling
Thermal Evaluation of a Power PC 620 Multi-Processor Computer
Thermal Evaluation of Standard and Power TQFP
The Development of Component-Level Thermal Compact Models of a C4/CBGA Interconnect Technology: The Motorola Power PC 603TM and Power PC 604TM RISC Microprocessors