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Home | Applications | Electronics Cooling | News   » Electronics Cooling (Home)   » Demo/Info Request   » News   » Technical papers   » Testimonials » Thermal Simulation Helps Design New Telecom Platform That Delivers 40Gbps Bandwidth » "Solving System Level Thermal Management Challenges in LED Systems", Printed-Circuit Design & Manufacture magazine, July 2008 » Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50% Dr. Thomas Zahner, Quality Manager FLOTHERM Achieves 95% Customer Satisfaction in New Survey ThermPaq from Flomerics Accelerates Thermal Characterization of Semiconductor Packages Flomerics’ MicReD Subsidiary to Play Major Role in Microelectronics Thermal Research Project “NANOPACK” Flomerics Releases FLO/PCB Version 4.1 New Standards, Techniques for Package Thermal Modeling, Semiconductor International, June 2007 Thermal Simulation Helps Design New Telecom Platform That Delivers 40Gbps Bandwidth AMCC Uses Flotherm & Flopack to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance "Avoiding meltdown", Machine Design, August 2007 Valeo Uses Flotherm Thermal Simulation Software to Ensure Reliability of Automotive Control System "Solving System Level Thermal Management Challenges in LED Systems", Printed-Circuit Design & Manufacture magazine, July 2008 Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50% Flotherm Helps Redback Networks on Triple-Play Platform, Printed-Circuit Design & Fab magazine, June 2008 Cool running, New Electronics magazine (UK), 10 June 2008 Thermal Simulation Speeds Design of Versatile Vertical/Horizontal Heatsink Simulation Helps Solve Difficult Thermal Challenge in Tower Mounted Amplifier World Electronic Thermal Management Market to Witness Healthy Growth and Reach $5.8 Billion by 2010, According to New Report by Global Industry Analysts, Inc. Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System "Software takes the heat off electronics", Machine Design magazine, 12 Sept 2007 "Improved Thermal Design of PCBs Using Surface Optimization Modeling", Printed Circuit Design & Manufacture, August 2007 Hot Predictions, New Electronics, July 2007 Flomerics Releases Flotherm Version 7 with Unrivalled Design Optimization Capability Thermal Simulation Helps Cool Aircraft Electronic Equipment at 50,000 Feet ALSTOM Slashes Development Costs For Variable Speed Drives Using FLOTHERM Thermal Analysis Software "Reducing Thermal Risk is a Key Factor for any Programs Success", Military Embedded Systems, March 2008 "Model PCB Thermals with Greater Accuracy", Power Electronics Technology magazine, Feb 2008 Thermal Simulation Validates Motor Design and Reduces Heatsink Weight Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts "Keeping Cool at 50,000ft", Machine Design, Oct 2007 Real-world power tests model FPGA’s thermal characteristics, EDN, April 2007 Aberdeen Group Survey Shows Flomerics’ Customers Get Products to Market Faster and With Fewer Respins Flomerics’ FLO/PCB Thermal Software is Finalist in IEC’s 2007 DesignVision Awards Building the System-in-Package Design Infrastructure Modeling Thermal Properties of Stacked-die Packages - Advanced Packaging, September 2006 Coping with the New Crop of Hot Boards - PKG Magazine, August 2006 The basics of fluid flow and heat transfer and how they can be applied to electronics cooling applications - Printed Circuit Design & Manufacture - July 2006 Taking the Heat Out Of Electronics - Desktop Engineering - July 2006 Flomerics and Gradient Design Automation Partner to Address Die-Level Thermal Issues Thermal Simulation Speeds Quieter, Smaller BTX PCs to Market MicReD and Inphora launch TERALED for power LED-s CADENCE/FLOMERICS Joint Solution helps CISCO bring Leading-Edge Switch to Market Texas Instruments Uses Thermal Simulation to Speed Disk Drive Time to Market "Thermal Simulation Helps Cool Aircraft Electronic Equipment at 50,000 Feet", Airforce Technology magazine, April 2007 Simulating Pb-Free Reflow - Circuits Assembly, October 2006 MicReD Offers TERALED Tester for Optical and Thermal LED Measurements Flomerics Technologists’ Paper Selected as Best of 2005 by IEEE Publication Imbera Optimizes Thermal Design Using Flotherm & T3Ster Modelling to standards - Components in Electronics - April 2006 Streamlined Thermal Modeling - Advanced Packaging - March 2006 Enhance MOSFET Cooling with Thermal Vias - Power Electronics Technology - February 2006 Thermal design tool provides link to Allegro PCB Editor - EE Times - February 2006 Extension box for T3Ster NVIDIA® Uses Compact Thermal Models to Speed Design of NVIDIA nForceTM 4-based Systems Flomerics Adds Thermal Models of Sunon “Mighty Mini” Fans to SmartParts3D Website Compact Thermal Modeling: Impacting the industry, Advanced Packaging, April 2007 Concurrent Engineering Helps Meet Thermal Challenges of High Speed Design FLO/PCB Software Saves 4-6 Week PCB Re-Spin - Circuits Assembley - June 2006 Anritsu Company Saves 4-6 Week PCB Re-Spin by Thermal Modeling in Early Design Stage Flomerics Presentation at DesignCon: “EEs Should Be More Thermally Proactive” Flomerics announces FLO/PCB for Allegro, Offering Bi-directional Interface to Cadence Allegro PCB Editor Galileo Avionica Standardizes on Thermal Simulation Software from Flomerics Speed Thermal Design Using Compact Models - Desktop Engineering - October 2005 New USB interface for T3Ster Playing it cool, CIE, January 2007 Flomerics Establishes Thermal Test Lab in North America After Acquisition of MicReD 'SEED' Project Signals Major Advance in Thermal Modeling of Electronic Equipment Delphi Project Partners Announce New, Highly Accurate Method for Thermal Characterisation of Electronic Components Choosing component locations for optimal cooling - Electronic Products - May 2006 Simulation Saves Solectron 3 Months and $40,000 in Cooling Outdoor Antenna Flomerics is pleased to announce the release of FLOPACK 6.1, with enhanced performance, support for even more package families, and other exciting new features FLOTHERM Thermal Management Software Helps Philips To Create The First Flomerics Reports Sales Up 24%, Profits Up 30%, and Claims World’s Fastest-Growing CFD Software Prof. Marta Rencz Elected Manager of the Modelling and Simulation Workpackage of EU-funded “Network of Excellence” Flomerics opens new office in Singapore to meet needs of rapidly-expanding customer base in south-east Asia FLOTHERM Analysis Helps Cool The Fastest Chip In The World The 1GHz ALPHA Processor Flomerics Further Enhances Productivity of Thermal Design Engineers with Flopack Version 6.2 IEC Announces 2007 DesignVision Finalists Recognizing Best Tools and Products in Semiconductor Industry, PCBCafe, January 2007 Parametric Simulation Helps Optimize Antenna Performance - Microwaves & RF - November 2006 New Flo/PCB Software Helps Solve Lead-Free Manufacturing Problems Imbera optimizes thermal design using Flomerics software - Portable Design - May 2006 Give PC board CAD its due - EE Times - January 2006 Thermal Analyzer Works At Front of Process - Desktop Engineering - January 2006 Solving Thermal Issues Earlier In Updated Board Designs - OnBoard Technology - October 2005 Downstream Thermal Implications Of Component Assembly - OnBoard Technology - September 2005 Testing T3Ster - CAD User - August 2005 Thermal Simulation Helps Silicon Graphics Keep Its New Supercomputer Cool SmartParts3D Models of Optoelectronic Couplers Speed Customers’ Designs Simulation Helps Overcome Thermal Challenges in Metro Networking System New ideas run thermal and emission simulations together - Machine Design - June 2005 Get On Board: SolvingTHERMAL PROBLEMS at Board Level - Printed Circuit Design & Manufacture - June 2005 Philips to offer thermal models of its power semiconductor - Electronic Engineering Times - June 2005 Philips offers customers thermal models of its power semiconductors - Philips Semiconducters - June 2005 Simulation Helps Solve EMC Problem in High-Speed Buses Flomerics Incorporates Thermal Models of Sunon Fans on SmartParts3D Website Flomerics Acquires Microelectronics Research & Development Limited (MicReD) Latest Release of FLO/PCB Features Significant Enhancements New Thermal Modeling Standards Emerge Simulation Used to Optimize Heat Sink Design for Optical Transmitter FLOMERICS Endorses MICRED'S Equipment and Software for IC Device Characterisation One Cool Machine - Design News - February 2005 Application Showcases Downstream Thermal Implications of Component Placement Stokes Research Institute Releases Guide to Evaluating Thermal Analysis Software Flopack Version 5 Supports New JEDEC Thermal Testing Standard FLO/PCB Version2 Speeds Collaboration between Electronic and Mechanical Engineers Thermal Models for Philips' Power Semiconductors Now Available on SmartParts3D.com FLOTHERM Version 5 Provides Usability, CAD Import, Compact Modeling Improvements Flomerics Improves "Intelligent Integration" Between Thermal Analysis and MCAD Software Staktek Uses Flotherm Thermal Simulation Software to Optimize Memory Stack Design Simulation Helps Hybricon Design 8U Chassis That Dissipates 30% More Power Mezzanine Card Assemblies: Where is All That Cooling Air Going? - COTS Journal Online - July 2004 Thermal Simulation Optimizes Chassis Cooling - COTS Journal Online - July 2004 Flomerics Launches New Release Of FLO/EMC Simulation Software - RF Globalnet - June2004 Tool Improves Collaboration Between Electrical and Mechanical Engineers - EDN - May 2004 Website Adds 48 Fan Thermal Models - ept.ca - June 2004 Flomerics Adds 48 Thermal Models of JMC Products Fans to SmartParts3D Website Upfront Analysis Spots Thermal Problems in PC-Board Placement - EDN Europe - May 2004 FLO/PCB Enables Multi-team Cooperation - Embedded.com - May 2004 Tool Improves Collaboration Between Electrical and Mechanical Engineers - reed-electronics.com - May 2004 Flomerics Certifies Design - Aerospace Engineering - April 2004 David Chadwick reviews the new FLO/PCB software from Flomerics for streamlining PCB design - CAD User - April/May 2004 Printdesign som en del af en Storre Helhed - Aktuel Elektronik - April 2004 Alla Kan Kolla Varmen - Elektronik Tidningen - March 2004 Thermal Design Without Calling in a Specialist - Electronics Weekly - March 2004 New product, FLO/PCB, brings EE's and ME's together for collaborative conceptual design of high-density PCB's UbiNetics and Flomerics overcome thermal design challenges to produce tester for 3G mobile communications networks Compatibilita' Elettromagnetica Pronta All'Uso Frontier Silicon, Atlantic Technology and Flomerics Overcome Thermal Design Challenges to Produce Single-Chip Multimedia Solution Hot, Not Bothered - CAD User - October/November 2003 How hot is that chip? - Desktop Engineering - October 2003 Flomerics Develops "Intelligent Integration" Between Thermal Analysis and MCAD Software AMI Semiconductor Uses FLOTHERM and FLOPACK to Predict Maximum Junction Temperatures and Thermal Performance in the Design and Development of ASICS Where Does Thermal Design Start - Embedded Systems Europe - June 2003 Designer Database - Electronic Design Europe - May 2003 www.smartparts3d.com Free Web-Based Design Database Accelerates the Design Process for Engineers Don't Get Your Fingers Burnt - New Electronics - March 2003 MaXXan Systems Uses Thermal Design Services from Flomerics to Ensure Thermal Integrity for The SG100 NAS System Airspan Miniaturizes and Enhances Performance of DSL Base Station Using FLOTHERM FLOMERICS Confirms No. 1 Position in Electronics Thermal Analysis Thales Avionics Uses Thermal Design Services from FLOMERICS to Certify Design of Video Control Cabinet for 747 In-Flight Entertainment System Cooking Breakfast on your PC! FLOTHERM - Upfront CFD for the Masses - MCAD - March 2002 FLOMERICS Helps ASML Ensure Thermal Integrity of Industry's First Lithography System for 300mm Wafer Processing With 100nm Resolution Thermal modelling heats up for the mainstream - EDN Europe - June 2002 Delphi and Profit Aim to Standardise Compact Models - EDN Europe - June 2002 Validating and Optimising Design - Asia - Pacific Engineer - June 2002 Thermal Performance Optimised - Components in Electronics - May 2002 EM Analysis Tool Enhanced - Components in Electronics - May 2002 Potted Power Poser - New Electronics - May 2002 FLOMERICS Further Enhances Productivity of EMC Design Engineers with FLO/EMC Version 1.2 Finding Where the Heatsink Stalls - Mechanical Engineering April 2002 The Application of Computational Electromagnetics to EMC - EMC Compliance Journal May 2002 Egenera Turns to FLOMERICS to Optimize the Thermal Performance of its Server Processing Blade Months Before the Technology is Available for Testing FLOMERICS' WEBTHERM™ Recognised in Two Major Industry Awards as Core Element of Webench - Winner of EDN's Flomerics Group PLC - Final Results Multipoint Broadband Wireless Access - Designengineer April 2002 FLOMERICS Further Enhances Productivity of IC Design Engineers with Flopack Version 3.1 Design for EMC - Successful Two-day Seminar - EMC Compliance Journal - March 2002 FLOMERICS and Cooling Zone Announce Joint-Marketing Collaboration Powering Heat Sink Development Using CFD Models - PCIM Europe - December 2001 Cambridge Broadband Optimizes VectaStar 3500 Using Flomerics’ Thermal Design Services Ascom Use FLOTHERM to Perfect Novel Heat Sink Design & Make Telecom Power Supply Products Smaller CFD Helps Predict Air Flow & Heat Transfer in Electronic Components Pipinghot Networks Knocks 3 Months off Development Time Using Flotherm Thermal Management Software Helps Car DVD Players to Survive Roof-Mounting Complex-IC packages get simple thermal models Blowing Hot and Cold Webtherm Thermal Simulation Web-based Thermal Simulation of Electronic Components DVD helped to handle the heat FLOTHERM helps keep in-car DVD players cool Integrating Electromagnetic and Thermal Design Flomerics Group PLC - Final Results FLOTHERM helps Advanced Fibre Communications to make significant savings in development of new ADSL telecommunications enclosure Quick Solve (Flotherm V3.1) WebTHERM - The First On-Line Thermal Simulator from a Semiconductor Manufacturer Web-based Flopack IC Package modeling application helps AMCC slash thermal simulation time Thermal simulation on the web Component Modeling Accelerates Thermal Analysis www.flopack.com - Web-Based 'Wizard' Produces Thermal Models Of Electronic Packages In Seconds Neue Lüfterbibliotheken (German) Virtual Prototyping can diagnose and eliminate trouble spots Right for all circumstances Flomerics Announces The use of CFD in electronics systems design within the automotive industry Flotherm Thermal Design Software Contributes to the Cooling System for InFocus' Dragonfly Multimedia Projector (Chinese) Hot Chips Software helps design the cooling system for multimedia projector Electronics enterprise is big hit in Queen's Awards FLOTHERM Thermal Design Software Contributes to the Cooling System for InFocus' Award-Winning LP330 Flomerics Group PLC Preliminary Results For Year Ending 31 December 1998 New ultra-fast version of FLOTHERM thermal management software takes advantage of enhanced computation speeds offered by INTEL's new multi-processor platforms FLOMERICS Announces FLOTHERM Version 2.2 Enhancements Facilitate Thermal Analyses and Boost User Productivity FLOPACK Gains New Thermal Modeling Capability: Compact Models Now Offered via Web New FLOTHERM Solver Speeds Up Design Time For Electronic Engineers Flomerics Establishes New Thermal Design Division FLOMERICS Enhances MCAD Integration For FLOTHERM With FLO/MCAD VERSION 2.2 FLOMERICS & THERMACORE Joint Marketing Agreement Flomerics Introduces FLOPACK For The Thermal Modeling Of Electronic Packages Relative Metrics' Library Of Thermal Data Now Offered By Flomerics For Use With Flotherm Johnson Matthey Electronics Establishes Strategic Joint Marketing Agreement with Flomerics Inc. to Provide Integrated Thermal Solutions FLOMOTION - virtual reality applied to thermal analysis of electronic systems Flotherm version 2 sets a new standard for the thermal analysis and cooling of electronic equipment Collaboration Between BT, in the UK, and SUN Microsystems in the US, Signals New Global Standards in Thermal Design MCAD Simplification Tool Aids Thermal Analysis

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