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Flomerics has introduced a new suite of software products that is the
first to integrate the major contributors to the physical design of electronics
in a single analysis environment.
The Flomerics Version5
integrated suite consists of Flo/PCB for conceptual thermal design
of printed circuit boards, FloTHERM for system-level thermal design and
optimization of electronics systems, Flo/EMC for electromagnetic compatibility
(EMC) simulation, and Flo/STRESS for predicting thermomechanical stresses.
The new suite dramatically reduces design leadtime by addressing many
different aspects of physical design in a single analysis environment,
and eliminating communications barriers between the different people involved
in the process.
This newsletter presents topical research and real-life examples in which
an optimized physical design together with dramatic reductions in design
time and cost have been achieved through the use of integrated simulation
tools.
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FLOTHERM
Version 5 Provides Usability, CAD Import, Compact Modeling Improvements
Staktek
Uses Flotherm Thermal Simulation Software to Optimize Memory Stack
Design 
FLO/EMC Version 5 Offers Unparalleled Ease-of-Use for EMC Design
Designing
for EMC early