Flotherm Applications
Why a Thermal Standard Is Not a Horse - The World According to the JEDEC JC15 Committee
(Thermacore)
The Changing Role of CFD in Electronics Thermal Design'
(Flomerics)
Flomerics Inc. Consulting Service Aids Smiths Aerospace
(Smiths Aerospace)
Developing Heat-Pipe Electronics Cooling Solutions Through Use of Thermal Simulation
(Thermacore)
Thermal Management of OSTAR® Projection Light Source
(OSRAM)
Hewlett-Packard Keeps Processors Cool with FLOTHERM
(HP)
FLOTHERM Helps Tecnobit Ensure Reliability of Avionics Equipment
(Technobit)
Eaton Hits Thermal Targets on First Prototype with FLOTHERM
(Eaton)
Thermal Simulation in Magneti Marelli Powertrain
(Magneti Marelli)
Alcatel Solves Thermal Issues Early with FLOTHERM
(Alcatel)
Thermal Simulation Using Flomerics' Software
(Hybricon)
RFMD Optimizes High Power Device Testing Chamber with FLOTHERM
(RFMD)
Thermacore Optimizes Thermal Performance of Automotive Intercooler using FLOTHERM
(Thermacore)
Optimizing Next-Generation Signaling and Switching Equipment
(
Tekelec
)
Harris Corporation Optimizes Power-HFET Devices Using FLOTHERM
(Harris Corporation)
Tekelec Incorporates Emerging Requirements for Telecom Switching Equipment Using FLOTHERM
(Tekelec)
FLOTHERM and T3Ster Help Imbera Develop New Integrated Module Board (IMB) Technology
(Imbera Electronics Oy)
Thermal Simulation Speeds Smaller, Quieter BTX PCs to Market
(Intel)
Thermal Loading of RF Antenna for Radar Test Bed
(Advanced Airborne Test Facility)
Thermacore Develops Cooling Solutions for High Power IGBTs and MOSFETs Using FLOTHERM
(Thermacore)
Thermal Simulation Models for More Accurate Prediction of MOSFET Operating Temperature in Mobile Devices
(Philips Semiconductors)
Streamlined
Thermal Modeling
(NVIDIA)
Addressing the Unique Thermal Management Challenges of Mobile Devices
(Philips Semiconductors)
Speeding Thermal Design for Customers by Providing Compact Models
(Agilent)
Bottom-side cooling of LFPAK power MOSFETs
(Philips Semiconductors)
Integrated Thermal/EMC Simulation
(Otis Elevator)
System Cooling of Outdoor Wi-Fi Antenna
(Solectron Corporation)
BladeCenter Packaging, Power, and Cooling
(IBM)
Power Amplifier Design
(Linn)
Intersil Gains Competitive Advantage Through Thermal Analysis
(Intersil)
Graphics and Digital Media Processors Design
(NVIDIA)
One Cool Machine
(SGI)
Data Storage Design
(3ParData)
PCB Design
(Cisco)
Radio Circuit Board Simulation Vs Thermal Test
(Lucent Technologies)
RF Module & Optical Design
(RFMod)
The affect of fan swirl to PSU cooling
(Emerson Network Power Co.)
Overcoming Thermal Design Challenges to Produce Single-Chip Multimedia Solution
(Frontier Silicon & Atlantic Technology)
Design of a Ruggedized Computer for Defense and Avionics
(Barco)
Utilising CFD to Improve Thermal Performance of a Computing Server
(Solectron)
Designing
the box
(New Electronics)
How hot is that chip?
(AMD)
Producing tester for 3G mobile communications networks
(UbiNetics)
Reducing development costs and time-to-market for IFR's new IFR 3410 RF Signal Generators
(IFR)
Ensuring Reliability of Automotive Control System
(Valeo)
Predicting Maximum Junction Temperatures and Thermal Performance in the Design and Development of ASICS
(AMI Semiconductor)
Speeding Thermal Design for Customers by Providing Compact Models
(Agilent)
Certifying Design of Video Control Cabinet for 747 In-Flight Entertainment System
(Thales Avionics)
Numerical Modeling and Experimental Verification of High-density Servers
(Intel)
Optimizing the Thermal Performance of Server Processing Blade
(Egenera)
Creating and Solving CFD and FEA models
(Advanced Micro Devices)
Ensuring Thermal Integrity for The SG100 NAS System
(MaXXan)
Reducing Developmend Time
(Pipinghot Networks)
Thermal Simulation of Telecom Racks
(Alcatel)
Integration of FLOTHERM Within HS Marston Aerospace Ltd
(HS Marston)
What Do These World-Leading Electronic Products Have In Common?
(Flomerics)
Optimizing VectaStar 3500 Using Flomerics Thermal Design Services
(Cambridge Broadband)
Using FLOTHERM to Perfect Novel Heat Sink Design
(Ascom Energy Systems)
Integrating Electromagnetic
and Thermal Design
(Avici)
Significant Savings in Development of New ADSL Telecommunications Enclosure
(Advanced Fibre Communications)
FLOTHERM Helps Keep
in-car DVD Players Cool
(Delphi Delco Electronics Systems)
Thermal Challenges in Building
the PowerPC Reference Platform
(Mentor Graphics & Motorola)
Optimizing Thermal Performance
of a Dictionary Size Multimedia Projector
(InFocus)
Thermal Design Productivity Enhanced With On-line Fan Libraries
(Flomerics)
Forced Convection Cooling
of Airborne Electronics
(Thomson-CSF)
FLOTHERM Helps Cool The
Fastest Chip In The World
(Alpha Processor Inc.)
ALSTOM Slashes Development
Costs For Variable Speed Drives
(Alstom Drives and Controls)
Thermal Design of the Silicon
Graphics Indigo 2 Workstation
(Silicon Graphics)
Display Panel Thermal
Design & Analysis
(Wakefield Engineering)
Philips Create "Virtually Silent"
Multimedia Projector
(Philips Creative Display Systems)
Radical Redesign of a
Desktop PC Enclosure
(Intel EUCD)
Thermal Interface Under a PQFP
(Smiths-Industries Aerospace)
Thermal Compact Models of
the Motorola PowerPC
(Motorola & Flomerics)
PQFP + Heatsink = ?
(Flomerics)
Cooling Design of a Sealed
Optical Networking Unit
(Fujitsu Network Communications)
Analysis of an LPX Desktop PC
(Intel)
The Effect of Thermocouples
on Measurements
(Wakefield Engineering)
Natural Convection in a Tele-
communications Exchange System
(Flomerics)
Motorola's Handheld Portable
Technology - Validating CFD Technology
(Motorola)
Solving Thermal Design
Problems in the Pentium
Microprocessor Series
(Sequent Computers)
T-Wing Heat Spreader on a PQFP
(Chomerics)
Predictive Thermal Modelling
Of An Audio Set
(Philips CFT)
Optimizing the Cooling in a Telecommunications Facility
(Flomerics and BT)
Thermal Modeling of
Ball Grid Arrays
(Alcatel SEL)
Energy Fluxes from a Typical PQFP
(DELPHI Research Project by Flomerics)
Thermal Analysis of Electronics
in a Missile System
(Flomerics)
The Effect of Card Mounting Alignment on Component
Tests in a Wind Tunnel
(Flomerics in support of JEDEC Committee JC15.1)
A Pin Fin Heatsink in Angled Flow
(Wakefield Engineering)
Benard Convection in a Rectangular Cavity
(Flomerics)
The Effect of Wind
Tunnel Orientation on
Component Measurements
(Flomerics in support of JEDEC Committee JC15.1)
Using FLOTHERM as a piece of
Thermal Test Equipment
(Tellabs)
Laminar and Turbulet Flow and Heat Transfer between Parallel Surfaces
(Flomerics)
FLOTHERM Analysis of a
Desktop Computer
(Flomerics)
Development, Validation & Application of a Thermal
Model of a PQFP
(Flomerics, Intel and Univ. Limerick, Ireland)
Natural Convection in a Closed Cavity
(Flomerics)
Natural Convection Over a Vertical Flat Plate
(Flomerics)
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