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T-Wing heat spreaders from Chomerics are thin, flexible cooling devices
designed for easy attachment to component packages using pressure-sensitive
adhesive. The T-Wing consists of a thin (0.178mm) copper strip with an
even thinner (0.038mm) layer of electrically insulating black film laminated
on both sides.
Figure 1 - Chomerics T-Wing applied to a Plastic Quad
Flat Pack (PQFP).
In order to evaluate the thermal performance of the T-Wing, a detailed
3-dimensional thermal model of a 208 lead plastic quad flat pack mounted
on a thermal test board was created using FLOTHERM. The thermal model
exactly mimics the experimental setup specified by the JEDEC JC15.1 committee
and has been fully validated by comparisons with both thermocouple and
IR thermography measurements(see reference below).
The package dimensions are 28mm x 28mm x 3mm. It is mounted on a horizontal
test board in a natural convection environment in a cubic enclosure of
side 305mm. In the original JEDEC test case, the component power was 1W.
In the case illustrated here, the component power was 3W.
Figure 2 - Results WITHOUT the T-Wing
The FLOTHERM simulation was run with and without a T-Wing (20267) heat
spreader attached to the top surface of the PQFP.
Figure 3 - Results WITH the T-Wing
Adding the T-Wing dramatically reduces the peak temperature within the
package (i.e. at the silicon die itself) and the temperature gradients
within the plastic encapsulant.
Figure 4 - Comparison of Results With and Without the
T-Wing
Reference:
"Development, Validation and Application of a Thermal Model of
a Plastic Quad Flat Pack" by H I Rosten, J D Parry and J S Addison
(Flomerics); R Viswanath (Intel); M Davies and E Fitzgerald (NMRC, Eire).
Presented at the Electronic Components and Technology Conference (ECTC),
Las Vegas, 22-24 May, 1995.
For copies of this paper, please contact Flomerics.
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