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Requirements for thermal and electromagnetic compatibility
often butt heads. Here's how to reconcile the differences.
from Machine Design, June 2005
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The early bird gets the worm. Instead of waiting to
address thermal issues at the system level, tackle them
at board level instead.
from Printed Circuit Design &
Manufacture, June 2005
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Flomerics announces the acquisition of MicReD - a Hungarian
based company formed in 1997 as a spin-off from Budapest
University of Technology and Economics (BUTE). MicReD’s
main product is the “T3Ster” (pronounced “Trister”),
which provides fast, repeatable and accurate thermal characterization
of IC devices, including stacked-die and system-in-package
devices. |
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| Computer simulation helped engineers at Transmode
Systems AB, Stockholm, Sweden quickly design a metropolitan
area networking system that easily meets all of the company’s
demanding thermal requirements. |
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Flomerics has incorporated thermal models of Sunon fans
into its SmartParts3D website. This means engineers
using or considering Sunon fans can streamline the thermal
design process by downloading fan models and incorporating
them into thermal simulations.
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Flomerics
Acquires Microelectronics Research & Development Limited
(MicReD)
Simulation
Helps Overcome Thermal Challenges in Metro Networking
System