Issue 11 - November 2005

Features
 
Events

FLOTHERM and FLO/EMC Version 6 Improves Integration of Thermal and EMC Simulation
Flomerics has released Version 6 of its integrated analysis environment for physical design of electronics, with improved communication between thermal and electromagnetic compatibility (EMC) simulation.


Integrated Thermal/EMC Simulation Reduces Design Time for Elevator Controls
The electronics packaging challenges facing the designers of elevator control equipment have significantly increased over the past decade. The market demands for reduced space utilization within the building by the elevator system has driven the design of smaller sized controls, making it possible to place them in the hoistway rather than a separate machine room. Eliminating the machine room benefits building owners by increasing rentable space, but making the controls smaller has substantially increased power density, which makes thermal management more difficult than in the past.

Randy Dube, Principle Mechanical Engineer
Otis Elevator Company


CADENCE/FLOMERICS Joint Solution helps CISCO bring Leading-Edge Switch to Market
Cisco chose to partner with Cadence® and Flomerics for a joint design flow that enabled their design team to address thermal issues early in the physical design of a new switch for optical networking.

from Cadence - Collaborations Newsletter

 

Please submit your comments and articles to Thermal e-News

Update your email address

Unsubscribe from mailing list

 

 

FREE Web Presentations by Thermal Engineers

Copyright ©
Comments and Corrections to the Webmaster