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The lack of space in today’s mobile devices reduces
internal airflow and external temperature requirements
are usually quite strict. So while the thermal design
of mobile devices has traditional been carried out with
hand calculations and physical testing, thermal simulation
is increasingly becoming necessary for leading-edge
mobile designs.
By Chris Hill, Senior Applications
Engineer, Philips Semiconductors UK
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Tekelec is a leading developer of current and
next-generation signaling and switching
telecommunications solutions. During the design of
a 1U rack-mounted fuse and alarm panel - developed with
Trimm, Inc. - the amperage requirements
more than doubled. The designers had to determine if
the circuits on the power board could handle the increased
current, or if a different approach was necessary.
Diane Busch, Mechanical Design Engineer, Tekelec
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The increase in the market requirements for high speed
and high density has resulted in memory devices that
consume more power. Especially, a memory module accommodated
with many high speed memory devices can reach very high
levels of power consumption, which in turn, can reach
very high junction temperatures. Therefore, the devices
can not operate properly without thermal
management. This paper looks for ways to manage the
heat generated in a high power memory module.
Heejin Lee, Haehyung Lee, Joonghyun Baek, Taegyeong
Chung and Seyong Oh
22nd IEEE SEMI-THERM Symposium
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Thermacore Europe has enabled the advancement and
implementation of many technologies by removing the
restrictive penalty of heat accumulation. The automotive
industry continually battles with the problem of heat
dissipation, particularly in high performance vehicles.
Here the challenge was to passively increase the heat
transfer performance of an air-to-air intercooler typically
used downstream of a turbo.
Bilal Mahmood, R&D Engineer, Thermacore Europe
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