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Thermal Management of OSTAR® Projection Light Source
The recently introduced high-power LED OSTAR® Projection rings in a new era for compact semiconductor light sources.
With a luminous flux of more than 200 lumens at RGB-white, it pushes the standard to a new record level regarding brightness, and surpasses customary LED light sources by great lengths.
Authors: Andreas Stich, Dr. Nicole Breidenassel, Rainer Huber |
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FLOTHERM Helps Tecnobit Ensure Reliability of Avionics Equipment
The power and heat dissipation of modern avionics equipment is increasing rapidly, and designing appropriate cooling systems is now an absolute necessity to ensure reliability. Weight minimization and space optimization are key design goals and thermal management is often the main design bottleneck.
Author: Jorge Giménez Romo, Hardware Engineer, Tecnobit |
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Thermal Design Considerations for LTCC Microwave Packages
LTCC is being widely used for MMIC packaging due to its excellent microwave behaviour (low or moderate dielectric loss, highly conductive inks) and its hermeticity. The latter is often required to protect bare dies against the impact of harsh working conditions in the field. Costs are also a driving factor to package a single or multiple dies together with matching networks and decoupling circuits (System-in-Package, SiP) instead of using an expensive application specific Multi-Chip-Module (MCM).
Authors: Jens Müller, Matthias Mach, BMBF Center for Innovation, Competence MacroNano®, TU Ilmenau
Heiko Thust, Microperipheric Group, TU Ilmenau
Christoph Kluge, Dieter Schwanke, Micro Systems Engineering GmbH & Co.
EMPS, 21-24 May 2006, Slovenia |
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Contactless Thermal Characterization Method of PCBs using an IR Sensor Array
In this paper the methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation is introduced.
Authors: Gy. Bognár, V. Székely, M. Rencz, Budapest University of Technology, Hungary / MicReD, Budapest, Hungary
THERMINIC Conference, 27-29 September 2006, Nice, France |
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