Developing Heat-Pipe Electronics Cooling Solutions Through Use of Thermal Simulation  (5.23MB) Heat pipes are two-phase heat transfer devices with an extremely high effective thermal conductivity. They can be manufactured in a variety of shapes and sizes and are an ideal choice for space-constrained applications due to their low weight and compactness.
Two case studies are presented whereby conventional cooling solutions are enhanced through the incorporation of heat pipes.
Aboude Haddad, R&D Engineer, Thermacore, UK
Matt Conners, Senior Application Engineer, Thermacore, US |
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Flomerics Inc. Consulting Service Aids Smiths Aerospace
Smiths Aerospace Electrical Power is working on a U.S. Navy hypersonic missile program that explores the feasibility of a better high altitude air vehicle. Smiths Aerospace is investigating the design of a power distribution unit (PDU) that would reside on the air vehicle. |
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Building the System-in-Package Design Infrastructure  The new System-in-Package (SiP) paradigm in electronics product implementation allows the mixing of optimum active and passive device technologies in bare die format within a single package outline for cost effective, high performance, short time-to-market functionality well matched to a wide range of low, medium and high volume electronics product applications. The novel addition of embedded passive component technology within such SiP modules also promises further performance, size, weight and cost benefits. |
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Playing It Cool
Considering thermal management early in a design can save headaches later. The old adage ‘the sooner, the better’ can be applied to the issue of thermal management when it comes to designing electronic products. The sad truth is that many engineers still leave this until late in the process, treating heat problems as add-ons after they have their new designs working the way they want.
Steve Rogerson from COMPONENTS IN ELECTRONICS
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