Issue 3 - April 2002 |
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Features
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 Flopack Version 3.1
The latest version of FLOPACK generates instant, ready-to-run thermal models for an ever-increasing range of IC packages.
The web-based SmartPart library enables fast, accurate and reliable creation of IC packages and associated parts. New features contained within Flopack V3.1 include a corporate multi-user function that allows internal workgroups to share the same designs so avoiding duplication; an extended range of DELPHI1 compact models for Cavity-down PBGA2, TBGA3 and ChipArray families; and a new JEDEC4 Test Environment Wizard, that guides Engineers through the creation of standard test environments determined by JEDEC and allows them to import designs directly into Flotherm.
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Pioneering Design-Class Thermal Analysis for Electronics - Part III
Sherman Ikemoto
Dir. Marketing Flomerics Inc.
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Enhanced Electronic System Reliability – Challenges for Temperature Prediction [pdf 250 kB]
John Parry, Flomerics Ltd, UK
Jukka Rantala, Nokia Research Center, Finland
Clemens J.M. Lasance, Philips Research Laboratories, The Netherlands
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© Copyright
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