Issue 5 - May 2003

Thermal and Electromagnetic Modeling combined in Flomerics' latest software, Version 4.1

Electronic Design Engineers can now for the very first time simultaneously conduct thermal and electromagnetic analyses - two design issues that impact on one another - using the latest FLOTHERM and FLO/EMC v4.1 software.

In addition to this ground-breaking capabilities, which will significantly reduce time-to-market for electronics companies, FLOTHERM v4.1 incorporates a number of other important enhancements.

Free Web-Based Design Database accelerates the Design Process for Electronic Engineers
A new free web-based database created to radically speed up the design verification process for thermal design engineers
www.smartparts3d.com

Numerical Modeling and Experimental Verification of High-density Servers
David S. De Lorenzo, Intel Corporation
Electronics Cooling Magazine, November 2002

Transient Performance of Common Modeling Assumptions Used in Detailed Thermal Package Models
John Parry, Flomerics Ltd.
Heinz Pape, Dirk Schweitzer, Infineon Technologies, Munich, Germany
John Janssen, Philips Semiconductors, Nijmegen, The Netherlands