Issue 8 - July 2004

Features

Cross-sectional view of an 8U chassisSimulation Helps Hybricon Design 8U Chassis That Dissipates 30% More Power

Thermal simulation played a key role in helping Hybricon design an 8U chassis that dissipates 30% more power than competitive offerings. With 6U high vertical cards, 8U chassis design is challenging because only 1 U is available above and below the card cage for airflow. The typical approach utilizes 1 U tall blower boxes located directly over the card cages.

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Testing the scaling laws by parameter variationsNew Correlations Between Electrical Current and Temperature Rise in PCB Traces
Johannes Adam, Flomerics Ltd
Semi-Therm XX Proceedings, San Jose, CA, March 2004
Test PCBPrediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future Requirements
Peter Rodgers, Ph.D., CALCE Electronic Products and Systems Center, University of Maryland
Solder ModelSolder Life Prediction in a Thermal Analysis Software Environment
Matt Warner, John Parry, Flomerics Limited
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004


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