FLO/PCB v2.2 features more than 25 improvements and
enhancements that significantly improve usability and
tighten integration between electrical and mechanical
design of printed circuit boards.
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For SGI, developing a super-fast supercomputer was easy.
The trick was to keep it cool. Here is how they did
it.
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Flomerics claims another “world first” with
the introduction of a new step-by-step guide that integrates
thermal and EMC design to help designers identify and
resolve system-level electromagnetic compatibility (EMC)
issues (www.flomerics.com/floemc/stepbystep/).
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In a presentation at the MicroElectronics Packaging
and Test Engineering Council, Flomerics showcased emerging
boundary-condition-independent thermal modeling standards
in the electronics industry.
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A major Asian engineering consulting organization used
thermal simulation to optimize the design of a heat
sink used in a parallel optical transmitter, dramatically
reducing engineering time and costs.
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