Attempting to satisfy an increasing number of PCB design constraints is putting more pressure than ever on designers.  The risk of failure of either functional performance or reliability increases with each new generation of design.  One of the fastest emerging design tradeoffs is between thermal compliance and signal integrity. High clock speed, coupled components need to be close together to ensure no signal degradation.  Unfortunately, such components also dissipate significant power; thus, they need to be as far away from each other as possible to reduce component temperatures.


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Article by Sally Cole Johnson, Contributing Editor Semiconductor International, 06/01/2007

Miniaturization, performance and functionality trends in the semiconductor industry are decreasing thermal design margins at the package and chip levels. New compact thermal modeling standards, which are expected from JEDEC this summer, combined with the emergence of more advanced modeling techniques should help solve future chip and package design challenges.

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Flomerics has added thermal models of Sunon's "Mighty Mini" fans and blowers to its SmartParts3D website. Engineers can streamline thermal design process by downloading these new models and incorporating them into thermal simulations. This approach is more accurate than making rough estimates from a paper chart because SmartParts3D models have the exact point-by-point values of the fan curve. "Many of our customers are already saving time and money by downloading pre-built thermal models of our products for use in their systems models", Eline Roussel, Sunon Europe.

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