Design-Class Thermal Analysis for Electronics

Overview

FLOTHERM is powerful 3D simulation software for thermal design of electronic components and systems. It enables engineers to create virtual models of electronic equipment, perform thermal analysis and test design modifications quickly and easily in the early stages of the design process well before any physical prototypes are built. FLOTHERM uses advanced CFD (computational fluid dynamics) techniques to predict airflow, temperature and heat transfer in components, boards and complete systems.

Unlike other thermal simulation software, FLOTHERM is a Design-Class or industry-specific analysis tool specially designed for a wide range of electronic applications that include:

• computers and data processing,
• telecommunications equipment and network systems
• semiconductor devices, ICs and components
• aerospace and defense systems
• automotive and transportation systems
• consumer electronics

As a Design-Class tool, FLOTHERM features specialization, built-in intelligence and automation not found in traditional analysis software. This functionality maximizes productivity for thermal design experts, minimizes the learning curve for mechanical design engineers and provides the highest levels of return on investment available from analysis software.

In a small to medium-sized company, FLOTHERM can pay for itself several times over in just one year and even faster as the size of the company increases. Experience the benefits of using FLOTHERM for thermal design of electronics, that include:

• solving thermal problems before hardware is built
• reducing design re-spins and product unit costs
• improving reliability and overall engineering design

Model Creation

SmartParts

FLOTHERM features the most complete and technically advanced model creation environment for the thermal design of electronics. Models that range in scale from single ICs on a PCB to full racks of electronics are assembled quickly from a complete set of SmartParts (intelligent model creation macros) that are supplied with FLOTHERM or from SmartParts3D.comTM or from a large list of suppliers from around the globe that use FLOTHERM. SmartParts capture modeling expertise that has been developed within Flomerics over the past 15 years to streamline model creation, minimize solve times and maximize solution accuracy.

Grid in FLOTHERM is associated with SmartParts and is generated as part of the model assembly process with refinement under user control. This methodology is intuitive and straightforward enabling engineers to focus on design rather than analysis. Gridding is instantaneous and reliable in FLOTHERM as compared to traditional tools that require significant time and expertise to master. Finally, FLOTHERM is the only analysis software with object-associated grid that eliminates re-gridding for each model modification.

Integration with MCAD & EDA

FLOTHERM also features the industry’s best solution for integration with MCAD and EDA software. Native data from Pro/Engineer, Solidworks, Catia, Allegro and other MCAD and EDA software can be imported into FLOTHERM. Unlike other CAD to analysis interoperability solutions, FLOTHERM automatically prepares the geometry for efficient and accurate analysis.

Grid

FLOTHERM grid is structured-Cartesian - the most stable and numerically efficient type of grid available. The ability to localize is also included for finer resolution where it is needed, minimizing solution time and avoiding the penalty of grid cells that “bleed”.

Solver and Design Optimization

Automatic Sequential Optimization

SmartPart-based modeling and structuredcartesian grid enable a feature called “automatic sequential optimization” that is unique to FLOTHERM. This allows users to specify a design goal and then let FLOTHERM do the hard work of finding the right combination of design variables that meet the goal. Common applications of this feature include optimization for heat sink design, PCB component placement, fan/blower selection and other common design scenarios. Automatic sequential optimization enables engineers to find design margin or production cost savings that were impractical in the past.

Design of Experiments Parametric Studies

As an alternative to automatic sequential optimization, a design of experiments (DoE) can be constructed that will automatically analyze the full range of all possible combinations of parametric variations. These models can be solved on a distributed network of computers using the unique “Volunteer” solution technology.

Solver

For over 15 years, the FLOTHERM solver has specifically addressed electronics cooling applications. The solver, based on a cartesian gridding system results in the most accurate results possible and the fastest solution time per grid cell. Massive disparency in geometric length scales are resolved using the unique ‘localized-grid’ technique which allows for integrally matched, nested, non-conformal grid interfaces between different parts of the solution domain. The conjugate nature of heat transfer within electronic systems is concurrently solved using a preconditioned conjugate residual solver together with a flexible cycle multi-grid solution technique. Pragmatic, unique and accurate solution termination criteria produce useful results in engineering, not academic, time scales.

Transient Analysis

The powerful transient analysis capabilities in FLOTHERM also allow for prediction of a number of different transient behaviors. Time dependent power dissipation in components can be defined via .csv import of power versus time data. An accurate prediction of the thermal response of the component temperature, in time, may then be produced without the conservative assumption of constant “steady state” power consumption.

Visualization

The FLOTHERM visualization toolset is developed specifically to maximize productivity for cooling design of electronics. Fully rendered models, 3D flow animation and tools for dynamic manipulation of temperature, and flow results, enable engineers to pinpoint thermal issues and visualize design improvements quickly and effectively. Texture mapping and AVI output enables communication of thermal-design concepts with non-technical colleagues.

Integrated Analysis Environment

FLOTHERM is a central part of Flomerics’ Integrated Analysis Environment - a software suite, that includes: FLOTHERM, FLO/PCB and FLO/EMC.

Integrated Analysis Environment is needed when physical designs are dense and complex, leading to difficult, costly, clashes between mechanicalpackaging, thermal-design and design for EMC. Under these conditions, mechanical and electrical engineers must break through communication and collaboration barriers to avoid excessive re-spins and expensive, late-cycle physical design errors.

Integrated Analysis Environment enables electrical, mechanical, thermal and EMC engineers to perform early-stage design trade-offs without delays or communication errors.

Design studies are based on a common virtual model and streamline the process of eliminating design-responsibility specific issues before they are designed and manufactured into the product.

The Integrated Analysis Environment suite of products also includes FLOPACK, software for IC SmartParts, and T3SterTM, thermal transient testing hardware for thermal model generation from physical packages under test. FLOPACK and T3Ster extend the Integrated Analysis Environment to include IC and component manufacturers who must supply critical, timely, design data to system manufacturers for effective physical design of today’s high performance electronic products.

Technical Support

Not just a software company, Flomerics also offers customers comprehensive training and phone support. In addition, the User Support Area allows licensed users to download the software with the latest documentation and to submit questions and support issues. A wide range of application examples and technical papers are also available on the FLOTHERM website.

Design Services

If you prefer to outsource part or all of your physical design, Flomerics Design Services team is ready to help. When you engage us, you effectively add to your staff some of the world’s most experienced engineers in thermal and EMC analysis of electronics. Starting with any design information you have, we will quickly plan and execute an assessment, regardless of the stage of your product.

Electronics Companies Around the World Depend on FLOMERICS for Design Optimization

Flomerics customers in the electronics industry include every major computer manufacturer, all major telecom switching manufacturers, the top five networking hardware vendors, and the world’s largest semiconductor producers.

Communications

3 COM
ADC Telecommunications
Alcatel Business Systems
Alcatel CIT
Alcatel SEL
Alcatel Submarine
British Telecom
Cisco
Ericsson
Fujitsu
Intel
Huawei Technologies
Hughes Network Systems
Italtel
JDS Uniphase
Lucent Technologies
Marconi
Motorola
NEC
Nokia
Nortel
Philips PKI
QUALCOMM
Rockwell International
Samsung
Scientific Atlanta
Siemens ICN
Tellabs
Telrad
Thales Communications
Tyco Telecommunications

Apple
Bull
Dell Computers
EMC
Fujitsu
Hewlett-Packard
IBM
ICL
Intel
Inventec
Mercury
Motorola
NEC
NCR
Samsung
Seiko-Epson
Siemens
Sony
Storage Technology
Stratus
Sun Microsystems
Toshiba
Unisys
Wistron
Xyratex

Consumer

Blaupunkt-Werke
Bose
Hitachi
InFocus
Konica
LG Electronics
Linn Products
Pace Micro
Philips
Samsung
Sony

Aerospace & Defense

Airbus
Alenia Marconi
Allied Signal
BAE Systems
Ball Aerospace
Bechtel
Boeing
China Aviation
EADS
Elta
ESA
Galileo Avionica
General Dynamics
Harris
Lockheed Martin
Naval Surface Warfare Center
Raytheon
Rockwell International
Siemens
Smiths Industries
THALES
TRW Avionics

Airbus
Alstom Transport
Caterpillar
Chrysler Alcatel
Delphi-Delco
Delphi Packard
Ford Motor Company
Honda
Magneti Marelli
Motorola
Otis Elevator
PSA Peugot-Citroen
Robert Bosch
Seiko-Epson
Siemens Automotive
SNCF
VALEO

Power Electronics

Astec
Celestica
CPI
ELDEC Corp.
Legrand
Lucent Technologies
Marconi
Powerwave
Schneider Electric
Tectrol
Tyco
Ultra

Instrumentation Control & Medical

Agilent
Analogic
General Electric
Hewlett-Packard
Hitachi
Johnson Controls
Mitsubishi
Siemens
Tektronix
Teradyne
Thales

Semiconductors

3M
Agere
Agilent
AMD
Amkor
Fujitsu
IBM
IDC
Infineon
Intel
International Rectifier
Micron
Motorola
Philips Semiconductor
Rockwell Semiconductor
Samsung
Siemens
ST Microelectronics
Texas Instruments

Contract Design & Manufacturing

Celestica
Foxconn
Flextronics
Sanmina
Solectron