FLOTHERM Technical Papers

LIQUID COOLING OF BRIGHT LEDS FOR AUTOMOTIVE APPLICATIONS

Yan Lai, Nicolás Cordero, Tyndall National Institute, Cork, Ireland
Frank Barthel, Frank Tebbe, Jörg Kuhn, Robert Apfelbeck, and Dagmar Würtenberger, Schefenacker Vision Systems GmbH, Schwaikheim, Germany

Cooling System for a Ka Band Transmit Antenna Array

Björn J. Döring, Institute of Communications and Navigation, Oberpfaffenhofen

Thermal Management of OSTAR® Projection Light Source

Andreas Stich, Dr. Nicole Breidenassel, Rainer Huber

Thermal Design Considerations for LTCC Microwave Packages

Jens Müller, Matthias Mach, BMBF Center for Innovation, Competence MacroNano®, TU Ilmenau
Heiko Thust, Microperipheric Group, TU Ilmenau
Christoph Kluge, Dieter Schwanke, Micro Systems Engineering GmbH & Co.
EMPS, 21-24 May 2006, Slovenia

CONTACTLESS THERMAL CHARACTERIZATION METHOD OF PCB-S USING AN IR SENSOR ARRAY

Gy. Bognár, Budapest University of Technology, Hungary
V. Székely, Budapest University of Technology, Hungary
M. Rencz, Budapest University of Technology, Hungary / MicReD, Budapest, Hungary
THERMINIC Conference, 27-29 September 2006, Nice, France

THERMAL MEASUREMENT AND MODELING OF MULTI-DIE PACKAGES

András Poppe, Budapest University of Technology, Department of Electron Devices, Hungary / MicReD Ltd, Hungary
Gábor Farkas, MicReD Ltd, Hungary
Péter Szabó, MicReD Ltd, Hungary
Yan Zhang, Flomerics Inc., USA
John Wilson, Flomerics Inc., USA
John Parry, Flomerics Ltd., UK
THERMINIC Conference, 27-29 September 2006, Nice, France

Use of Computer Simulation to Optimise Thermal Design of Military Electronics Systems

Paul Rose, Principal Consultant Engineer, Flomerics Ltd,
Military & Aerospace Electronics Conference, 26 September 2006, UK

Thermal Management of High Power Memory Module

Heejin Lee, Haehyung Lee, Joonghyun Baek, Taegyeong Chung and Seyong Oh
22nd IEEE SEMI-THERM Symposium

Thermal Simulation Models for More Accurate Prediction of MOSFET Operating Temperature in Mobile Devices

Christoper Hill, Philips Semiconductors

Bottom-side cooling of LFPAK power MOSFETs

Christoper Hill, Philips Semiconductors

BladeCenter Packaging, Power, and Cooling

M. J. Crippen, R. K. Alo, D. Champion, R. M. Clemo, C. M. Grosser, N. J. Gruendler,M. S. Mansuria, J. A. Matteson, M. S. Miller and B. A. Trumbo, IBM

Numerical Analysis of Thermo-Electric Coolers (TEC) Using FLOTHERM

States Chiwanga , Solectron Corporation

System Cooling of Outdoor Wi-Fi Antenna

Robert Raos, Solectron Corporation
MEPTEC Thermal Symposium February 16, 2005

Application of Computational Fluid Dynamics (CFD) Technique in Thermal and Airflow Improvements of TM's Type A Outdoor Cabinets, Battery Compartment

R. Wan, K.N.A.Wahib, K.Yusoff, B.M Shariff
TM Research & Development Sdn Bhd

The effect of fan swirl to PSU cooling

Mr. Jimmy Li—Senior Engineer, Emerson Network Power Co.

One Cool Machine

Paul E. Teague, Design News, February 7, 2005

Simulation-Based Design Optimization Methodologies Applied to CFD

John Parry, Robin B. Bornoff, Flomerics
Peter Stehouwer, Lonneke T. Driessen, and Erwin Stinstra, Centre for Quantitative Methods
CPMT Transactions June 2004

Development of a New Improved High Performance Flip Chip BGA Package

Desmond Y.R. Chong, B.K. Lim, Kenneth J. Rebibis, S.J. Pan, Krishnamoorthi S., R. Kapoor, Anthony Y.S. Sun, H.B. Tan, United Test & Assembly Center Ltd (UTAC), Packaging & Assembly Technology Group
2004 Electronic Components and Technology Conference Proceedings, New Orleans, 27-30 May 2004

Thermal Impedance Measurements of Junction-Down Mounted Single-Side Contact Laser Diodes

Guy Cohen, Lei Shan, Daniel Kuchta, Bruce Furman, Joanna Rosner, Christian Baks, and Jean Trewhella, IBM T. J. Watson Research Center
Y. Tatsuoka, S. Shirai, K. Takagi, T. Aoyagi, E. Omura' HF & Optical Semiconductor Division, Mitsubishi Electric Corp. Japan
2004 Electronic Components and Technology Conference Proceedings, New Orleans, 27-30 May 2004

An Investigation of Thermal Enhancement of MPM BGA Package

Abe-JM Yang, Cary Yang, Carol Liang, Jeng Yung Lai, Yu-Po Wang, C.S. Hsiao, Siliconware Precision Industries Co., Ltd.
ESim '04 Proceedings, Vancouver, 9-11 June 2004

Comparative Study of Power Module Technologies by means of Thermal Simulation Tools

M.Sc. ME. Peter Hansen, B.Sc. EE Flemming Nielsen, B.Sc. EE Hans S. Nielsen, B.Sc. EE John Jacobsen, Grundfos A/S
ESim '04 Proceedings, Vancouver, 9-11 June 2004

Thermal Management of a Joule-Heating Microreactor using Modelling Tools

Nicolás Cordero, Jonathan West and Helen Berney, NMRC, University College
ESim '04 Proceedings, Vancouver, 9-11 June 2004

Combined Thermal and Thermomechanical Modeling for a Multi-Chip QFN Package with Metal-Core Printed Circuit Board

Xuejun Fan, Philips Research - USA
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

PCB Design Flow Under Thermal Control

Eric Monier-Vinard, Alain Legal, Thales Research & Technology
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

Refrigeration Assisted Spot Cooling of a High Heat Density Data Center

Ali Heydari, Ph.D., Sun Microsystems
Poorya Sabounchi, Department of Mechanical Engineering, University of California
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

A Passive Solution to a Difficult Data Center Environmental Problem

David Wang, Teradata, A Division of NCR Corporation
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

Thermal Evaluation of Power Amplifier Modules and RF Packages in a Handheld Communicator System

Victor Chiriac and Tien-Yu Tom Lee, Motorola, Inc.
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

Substantiation of Numerical Analysis Methodology for CPU Package With Non-Uniform Heat Dissipation and Heat Sink with Simplified Fin Modeling

Vadim Gektin, Ron Zhang, Marlin Vogel, Guoping Xu, Mario Lee, Sun Microsystems, Inc.
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

Application of Low-Reynolds Number Turbulent Flow Models to the Prediction of Electronic Component Heat Transfer

Peter Rodgers, CALCE Electronic Products and Systems Center, University of Maryland
Valérie Eveloy, Electronics Thermal Management Ltd
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

Turbulence Modelling and it's Impact on CFD Predictions for Cooling of Electronic Components

Kulvir K Dhinsa, Chris J Bailey, Koulis A Pericleous, Centre for Numerical Modelling and Process Analysis, University of Greenwich
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

Thermal Performance Evaluation for a Microelectronics Motor Control System Incorporating Dynamic Heat Sources

Victor Chiriac and Tien-Yu Tom Lee, Motorola, Inc.
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

A Modified Pressure Drop Analytical Method for Heat Sink

C.K. Loh, D.J.Chou, Enertron, Inc.
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

Numerical Investigation of Enclsure Effects no Spot Cooling Devices

Damena Agonafer, Mechanical and Aerospace Department, The University of Texas at Arlington
Jason Markell, Bahgat Sammakai & Gary Lehmann, State University of New York at Binghamton
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

Thermal Analysis and Modeling of Diode Array Integrated with Directional Liquid-Cooled Heat Sink

H. Y. Zhang, D. Pinjala, M. K. Iyer & L. Xie, Institute of Microelectronics
P. K. Chan & X. P. Liu, DSO National Laboratories
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

Extension of Air Cooling for High Power Processors

Guoping Xu, Bruce Guenin & Marlin Vogel, Sun Microsystems Inc.
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

Thermal Challenges of a Compact Power Entry Module
with 7,000W Output in a Telecom System

Herman Chu, Procket Networks, Inc.
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

Modeling of Natural Convection in Electronic Enclosures

Peter M. Teertstra, M. Michael Yovanovich and J. Richard Culham, Microelectronics Heat Transfer Laboratory, Department of Mechanical Engineering, University of Waterloo
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

Solder Life Prediction in a Thermal Analysis Software Environment

Matt Warner, John Parry, Flomerics Limited
9th ITHERM Conference, Las Vegas, NV - June 1-4, 2004

Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future Requirements

Peter Rodgers, Ph.D., Electronics Thermal Management, Ltd.
EuroSimE, Aix-en-Provence, France, March 30 – April 2, 2003

New Correlations Between Electrical Current and Temperature Rise in PCB Traces

Johannes Adam, Flomerics Ltd
Semi-Therm Proceedings, San Jose, CA, March 2004

Thermal Interaction of an Array of Flip Chip Components

Bennett Joiner and Tony Montes de Oca, Motorola
Semi-Therm Proceedings, San Jose, CA, March 2004

Generation of Subassembly Compact Half Models through Experiment and Modeling for Hard Drive Thermal Characterization

Jeff Weiss, Ebyson Thomas and Adesoji Dairo, Agere Systems
Bill Rugg, Michael Ries, and Ric Stofflet, Seagate Technology
Semi-Therm Proceedings, San Jose, CA, March 2004

Comparative Analysis of Heat Sink Pressure Drop Using Different Methodologies

C.K. Loh and D.J. Chou, Enertron Inc
Semi-Therm Proceedings, San Jose, CA, March 2004

Thermal Optimization of Electronic Systems Using Design of Experiments Based on Numerical Inputs

Thomas Stewart, Sun Microsystems
David W. Stiver, Flomerics Inc
Semi-Therm Proceedings, San Jose, CA, March 2004

DirectFET™ Thermal Model and Rating Calculator

Doug Butchers, International Rectifier, Hurst Green, Oxted, Surrey

Thermal Management of Golden Dragon LED

Rainer Huber, Osram Opto Semiconductors GmbH

Numerical Study of Heat Pipe Application in Heat Recovery Systems

Song Lin, John Broadbent, Ryan McGlen, Thermacore Europe
8th UK National Heat Transfer Conference, Oxford, 9-10 September 2003

PCB Design Flow Under Thermal Control

Eric Monier-Vinard, Alain le Gal, Thales
Flotherm User Meeting, Paris, France, September 2003

Sense and Nonsense Thermal Requirements

Wendy Luiten, Philips Digital Systems laboratories - Cooling Competence Centre
Semi-Therm Proceedings, San Jose, CA, March 2003

Modelling the Effect of Temperature on Product Reliability

Chris Bailey, Computing and Mathematical Sciences
University of Greenwich
Semi-Therm Proceedings, San Jose, CA, March 2003

Using Compact Models in the Early Thermal Design of Electronics

H.J. Eggink, G.M. Janssen, Philips Centre for Industrial Technology
J .H. J. Janssen, Philips Semiconductors
Semi-Therm Proceedings, San Jose, CA, March 2003

An Experimental Assessment of Compact Thermal Models for the Prediction of Board-Mounted Electronic Component Heat Transfer

Valérie Eveloy, Peter Rodgers, Electronics Thermal Management Ltd.
Jason DeVoe, Alfonso Ortega, Department of Aerospace and Mechanical Engineering and The Center for Electronic Packaging Research
M.S.J. Hashmi, School of Mechanical and Manufacturing Engineering, Dublin City University
Semi-Therm Proceedings, San Jose, CA, March 2003

Recent Progress in Compact Thermal Models

Clemens J.M. Lasance, Philips Research Laboratories
Semi-Therm Proceedings, San Jose, CA, March 2003

Thermal Transient Modeling And Experimental Validation In The European Project PROFIT

Heinz Pape1, Dirk Schweitzer, Infineon Technologies AG, Corp. Assembly & Test
J. H. J. Janssen, Philips Semiconductors, ATO Innovation
Arianna Morelli, Claudio M. Villa, ST Microelectronics, Corp. Pck. Dev.
Semi-Therm Proceedings, San Jose, CA, March 2003

Thermal Management of Portable Micro Fuel Cell Stacks

Robert Hahn, Michael Krumm, Herbert Reichl, Fraunhofer Institute Reliability and Microintegration
Semi-Therm Proceedings, San Jose, CA, March 2003

Micro Cooling Application on High Density Memory Module

Yunhyeok Im, Minha Kim, Joonghyun Baek, Package Development Group, Samsung Electronics Co., Ltd
Hyejung Cho, MEMS LAB, Samsung Advanced Institute of Technology
Semi-Therm Proceedings, San Jose, CA, March 2003

Development, Validation, and Application of Thermal Modeling for a MCM Power Package

Xuejun Fan, Philips Research USA
Semi-Therm Proceedings, San Jose, CA, March 2003

Thermal Characterization of High Speed DDR Devices in System Environments

Joonghyun Baek, Byungse So, Taekoo Lee, Yunhyeok Im, Seyong Oh, Samsung Electronics Co., LTD.
Semi-Therm Proceedings, San Jose, CA, March 2003

Thermal Analysis of Sealed Enclosure for over the Ocean Application

M. Muthuraj, N. Parameswaran, Sameer-Centre for Electromagnetics
Semi-Therm Proceedings, San Jose, CA, March 2003

Simulation-based Design Optimization Methodologies applied to CFD

John Parry, Robin Bornoff, Flomerics Ltd
Peter Stehouwer, Lonneke Driessen, Erwin Stinstra, CQM BV
Semi-Therm Proceedings, San Jose, CA, March 2003

Screen Characterization Under Fan Induced Swirl Conditions

K. Nevelsteen, M. Baelmans, K. De Troch, M. Mesbah, Department of Mechanical Engineering, Division TME
W. Nelemans, Alcatel-Bell
Semi-Therm Proceedings, San Jose, CA, March 2003

Numerical Modeling and Experimental Verification of High-density Servers

David S. De Lorenzo, Intel Corporation
Electronics Cooling Magazine, November 2002

Transient Performance of Common Modeling Assumptions Used in Detailed Thermal Package Models

John Parry, Flomerics Ltd.
Heinz Pape, Dirk Schweitzer, Infineon Technologies, Munich, Germany
John Janssen, Philips Semiconductors, Nijmegen, The Netherlands
Proceedings of 8th THERMINIC Workshop, Madrid Spain, October 2002, pp. 283-289

Component and Board-Level Thermal Modeling Techniques for XFP Optical Transceivers

Ted Lee, Flomerics Inc.
Ashwin Lodhia, Brocade Communications Systems, Inc.
IMAPS Advanced Technology Workshop on Thermal Management for High Performance Computing and Telcom/Wireless Applications, Palo Alto CA, October 24-26 2002

Heat Sink Optimization for Optical Transponders

Z. F. Shi, Albert C.W. LU, Y.M. Tan, K.H.Ang, Singapore Institute of Manufacturing Technology
Ronson Tan, Eric Tan, E20 Communications Pte Ltd
35th International Symposium on Microelectronics, IMAPS Denver, 2002

Thermal Modeling and Measurement of Large High Power Silicon Devices With Asymmetric Power Distribution

Jefferey Deeney, Hewlett-Packard Company
35th International Symposium on Microelectronics, IMAPS Denver, 2002

The Extraction of a Two-Resistor/Two-Capacitor Model for Common IC Packages and their Implementation in CFD

David W. Stiver, Sarang Shidore Flomerics Inc.
35th International Symposium on Microelectronics, IMAPS Denver, 2002

Linearized Superposition using CFD for Thermal and Power Characterization of Electronic Equipment with Significant Thermal Radiation and Natural Convection

Paul Gauché, Flomerics Inc
Wen Wei, Intel Corporation
35th International Symposium on Microelectronics, IMAPS Denver, 2002

FLO/STRESS: An Integrated Software Module to Predict Stress in Electronic Products

M. Warner, J. Parry, C. Marooney, H. Reeves, A. Agha and I. Clark, Flomerics Inc.
C. Bailey and K. Pericleous, University of Greenwich

Thermal Simulation of Telecom Racks

Wim Nelemans, Alcatel
Design-Class Thermal Analysis for Electronics and Design-Class Analysis for Electromagnetic Compatibility Seminar, Antwerp Belgium, June 18 2002

Thermal analysis of an UHP high current driver

Arjan Kole, Thermal & Mechanical Analysis, Philips Centre for Industrial Technology
Design-Class Thermal Analysis for Electronics and Design-Class Analysis for Electromagnetic Compatibility Seminar, Antwerp Belgium, June 18 2002

Numerical Analysis of Thermoelectric Coolers (TEC) Using FLOTHERM

States Chiwanga, Solectron Technical Centre
Design-Class Thermal Analysis for Electronics and Design-Class Analysis for Electromagnetic Compatibility Seminar, Swindon UK, June 13 2002

Indoor Base Station Space Model Vs Flotherm

Lucias Akalanne, Lucent Technologies
Design-Class Thermal Analysis for Electronics and Design-Class Analysis for Electromagnetic Compatibility Seminar, Swindon UK, June 13 2002

Integration of Flotherm Within HS Marston Aerospace Ltd

Adrian Green, HS Marston Aerospace Ltd
Design-Class Thermal Analysis for Electronics and Design-Class Analysis for Electromagnetic Compatibility Seminar, Swindon UK, June 13 2002

Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures of Chilled Air Exiting both the Hot and Cold Aisles

Roger Schmidt, Ethan Cruz, IBM Corporation
8th ITHERM Conference, San Diego CA, May 30 - June 1 2002

Prediction of Thermal Performance of Flip Chip - Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Substrate Physical Design

K.Ramakrishna, T-Y. Tom Lee, Advanced Process Development and External Research, Digital DNA Laboratories, Semiconductor Products Sector, Motorola, Inc.
8th ITHERM Conference, San Diego CA, May 30 - June 1 2002

Thermal Assessment of RF Integrated LTCC Front End Module (FEM)

Victor Adrian Chiriac and Tien-Yu Tom Lee, Final Manufacturing Technology Center, Motorola, Inc.
8th ITHERM Conference, San Diego CA, May 30 - June 1 2002

A Numerical Study of the Thermal Performance of an Impingement Heat Sink - Fin Shape Optimization:

Amit Shah, Bahgat Sammakia and Hari Srihari, The State University of New York at Binghamton
8th ITHERM Conference, San Diego CA, May 30 - June 1 2002

Using Cap-Integral Standoffs to Reduce Chip Hot-Spot Temperatures in Electronic Packages

Michael S. June, Kamal K. Sikka, IBM Microelectronics
8th ITHERM Conference, San Diego CA, May 30 - June 1 2002