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Home | Industries | Computers | Electronics Cooling   » Computers Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » Simulation Helps Meet Thermal Challenges of World’s Fastest Supercomputer » Sharp Laboratories Selects FloEFD.V5 Engineering Fluid Dynamics Software for CATIA V5 » Hot Predictions, New Electronics, July 2007 Tanja Karila, Thermal Specialist Hewlett-Packard Keeps Processors Cool One Cool Machine Hot Predictions, New Electronics, July 2007 Hewlett-Packard Keeps Processors Cool with FloTHERM FloTHERM and T3Ster Help Imbera Develop New Integrated Module Board (IMB) Technology One Cool Machine Flomerics Releases FloTHERM Version 7 with Unrivalled Design Optimization Capability Cooling of a CPU Board with Two Lines of Four Microprocessors in the Mean Flow Numerical and Experimental Study of Forced Convection Over Power Supply Heat Sinks CFD modelling for component-level and board-level thermal analysis; a PBGA interconnect technology for low-velocity air-cooling Thermal Evaluation of a Power PC 620 Multi-Processor Computer Thermal Analysis of a PC chassis Thermal Model of a Bench-Top Microprocessor-Based Unit Development of Optimized Component-Level Thermal Behavioural Models of a Plastic-Ball-Grid Array Interconnect Technology For Air Cooled Applications Concurrent Design of a PowerPCtm Microcomputer: EDA and CFD Tool Interoperability FloTHERM Thermal Analysis of Heat Sink Design for Pentium Processor in Tape Carrier Packages Development and Application of Compact Models of Packages Based on DELPHI Methodology System-Level Thermal Modeling of a Compact, High-Efficiency Cooling Device for the PA8000 Processor Optimizing the Integration of a Electronics System into an Existing Enclosure Using CFD Modeling Techniques Thermal Design Methodology for Electronic Systems Thermal Characterization of High Speed DDR Devices in System Environments Thermal Optimization of Electronic Systems Using Design of Experiments Based on Numerical Inputs System Level Thermal Simulation of a Computer Chassis using FloTHERM Software Thermal Simulation Speeds Smaller, Quieter BTX PCs to Market Overcoming Thermal Design Challenges to Produce Single-Chip Multimedia Solution Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts Flomerics Optimizes Thermal Solution for Caltech Coping with the New Crop of Hot Boards - PKG Magazine, August 2006 Taking the Heat Out Of Electronics - Desktop Engineering - July 2006 Thermal Simulation Speeds Quieter, Smaller BTX PCs to Market CADENCE/Flomerics Joint Solution helps CISCO bring Leading-Edge Switch to Market Texas Instruments Uses Thermal Simulation to Speed Disk Drive Time to Market Siemens Nixdorf Informationssystme AG Business Unit Personal Computer Design and Thermal Analysis of the SunRay1 Network Terminal A Design Approach to Thermal Characterization of Forced Convection Systems using Superposition in CFD Thermal Modeling and Measurement of Large High Power Silicon Devices With Asymmetric Power Distribution A 3-D, Thermal Analysis of Microprocessors Thermal Modelling of a Hewlett Packard Workstation from Concept to Finished Product Solving the Thermal Design Concerns of a Low-Voltage Power Supply using CFD Modeling Thermal Simulation Models for More Accurate Prediction of MOSFET Operating Temperature in Mobile Devices What Do These World-Leading Electronic Products Have In Common? Motorola's Handheld Portable Technology - Validating CFD Technology Solving Thermal Design Problems in the Pentium Microprocessor Series Thermal Modeling of Ball Grid Arrays Modelling to standards - Components in Electronics - April 2006 Enhance MOSFET Cooling with Thermal Vias - Power Electronics Technology - February 2006 Thermal design tool provides link to Allegro PCB Editor - EE Times - February 2006 Celestica Application of a CFD Tool for System-level Thermal Simulation Cooling analysis of Digital's ATMswitch 900 Electronic Cooling at IBM Endicott Thermal Design of the Silicon Graphics Indigo 2 Workstation using Physical and Computational Modelling Numerical Simulation Methodology Used for Thermal Design of a Minicomputer Optimizing the Thermal Performance of Server Processing Blade Ensuring Thermal Integrity for The SG100 NAS System Speeding Thermal Design for Customers by Providing Compact Models Reducing Developmend Time FloTHERM Helps Cool The Fastest Chip In The World Thermal Design of the Silicon Graphics Indigo 2 Workstation Radical Redesign of a Desktop PC Enclosure FloTHERM Analysis of a Desktop Computer Egenera Turns to Flomerics to Optimize the Thermal Performance of its Server Processing Blade Months Before the Technology is Available for Testing Concurrent Engineering Helps Meet Thermal Challenges of High Speed Design Flomerics Presentation at DesignCon: “EEs Should Be More Thermally Proactive” Speed Thermal Design Using Compact Models - Desktop Engineering - October 2005 High performance/volume ratio CPU Cooler Design with FloTHERM simulation Linking CFD and EDA tools: The interoperability of FloTHERM and BoardStation/Autotherm during concurrent design of a Motorola PowerPC-based microcomputer Component and Board-Level Thermal Modeling Techniques for XFP Optical Transceivers Philips Create FloTHERM Analysis Helps Cool The Fastest Chip In The World The 1GHz ALPHA Processor A two-level Micro/Macro Approach to the Simulation of Air Flow and Heat Transfer in Typical Convection-Cooled Electronic Systems Choosing component locations for optimal cooling - Electronic Products - May 2006 Thermal Design for Notebook PC by using Thermal Analysis A Numerical Analysis of Three-Dimensional Conjugate Transport in an Electronic Package Thermal-Fluid Simulation of Computer System Cooling and Verification of Simulation Accuracy Cooling Studies of IBM Technology Products Performed by the Endicott Electronic Packaging Organisation FloTHERM Analysis Helps Cool The Fastest Chip In The World The 1GHz ALPHA Processor

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