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Home | Industries | Computers | News   » Computers Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » Simulation Helps Meet Thermal Challenges of World’s Fastest Supercomputer » Sharp Laboratories Selects EFD.V5 Engineering Fluid Dynamics Software for CATIA V5 » Hot Predictions, New Electronics, July 2007 Tanja Karila, Thermal Specialist Simulation Helps Meet Thermal Challenges of World’s Fastest Supercomputer Sharp Laboratories Selects EFD.V5 Engineering Fluid Dynamics Software for CATIA V5 Hot Predictions, New Electronics, July 2007 Flomerics Releases Flotherm Version 7 with Unrivalled Design Optimization Capability Coping with the New Crop of Hot Boards - PKG Magazine, August 2006 Taking the Heat Out Of Electronics - Desktop Engineering - July 2006 Thermal Simulation Speeds Quieter, Smaller BTX PCs to Market CADENCE/FLOMERICS Joint Solution helps CISCO bring Leading-Edge Switch to Market Texas Instruments Uses Thermal Simulation to Speed Disk Drive Time to Market Modelling to standards - Components in Electronics - April 2006 Enhance MOSFET Cooling with Thermal Vias - Power Electronics Technology - February 2006 Thermal design tool provides link to Allegro PCB Editor - EE Times - February 2006 Concurrent Engineering Helps Meet Thermal Challenges of High Speed Design Flomerics Presentation at DesignCon: “EEs Should Be More Thermally Proactive” Speed Thermal Design Using Compact Models - Desktop Engineering - October 2005 Choosing component locations for optimal cooling - Electronic Products - May 2006 FLOTHERM Analysis Helps Cool The Fastest Chip In The World The 1GHz ALPHA Processor

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