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Home | Industries | Computers | Technical papers   » Computers Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » Simulation Helps Meet Thermal Challenges of World’s Fastest Supercomputer » Sharp Laboratories Selects EFD.V5 Engineering Fluid Dynamics Software for CATIA V5 » Hot Predictions, New Electronics, July 2007 Tanja Karila, Thermal Specialist Cooling of a CPU Board with Two Lines of Four Microprocessors in the Mean Flow Numerical and Experimental Study of Forced Convection Over Power Supply Heat Sinks CFD modelling for component-level and board-level thermal analysis; a PBGA interconnect technology for low-velocity air-cooling Thermal Evaluation of a Power PC 620 Multi-Processor Computer Thermal Analysis of a PC chassis Thermal Model of a Bench-Top Microprocessor-Based Unit Development of Optimized Component-Level Thermal Behavioural Models of a Plastic-Ball-Grid Array Interconnect Technology For Air Cooled Applications Concurrent Design of a PowerPCtm Microcomputer: EDA and CFD Tool Interoperability Flotherm Thermal Analysis of Heat Sink Design for Pentium Processor in Tape Carrier Packages Development and Application of Compact Models of Packages Based on DELPHI Methodology System-Level Thermal Modeling of a Compact, High-Efficiency Cooling Device for the PA8000 Processor Optimizing the Integration of a Electronics System into an Existing Enclosure Using CFD Modeling Techniques Thermal Design Methodology for Electronic Systems Thermal Characterization of High Speed DDR Devices in System Environments Thermal Optimization of Electronic Systems Using Design of Experiments Based on Numerical Inputs System Level Thermal Simulation of a Computer Chassis using FLOTHERM Software Siemens Nixdorf Informationssystme AG Business Unit Personal Computer Design and Thermal Analysis of the SunRay1 Network Terminal A Design Approach to Thermal Characterization of Forced Convection Systems using Superposition in CFD Thermal Modeling and Measurement of Large High Power Silicon Devices With Asymmetric Power Distribution A 3-D, Thermal Analysis of Microprocessors Thermal Modelling of a Hewlett Packard Workstation from Concept to Finished Product Solving the Thermal Design Concerns of a Low-Voltage Power Supply using CFD Modeling Application of a CFD Tool for System-level Thermal Simulation Cooling analysis of Digital's ATMswitch 900 Celestica Electronic Cooling at IBM Endicott Thermal Design of the Silicon Graphics Indigo 2 Workstation using Physical and Computational Modelling Numerical Simulation Methodology Used for Thermal Design of a Minicomputer Linking CFD and EDA tools: The interoperability of Flotherm and BoardStation/Autotherm during concurrent design of a Motorola PowerPC-based microcomputer High performance/volume ratio CPU Cooler Design with FLOTHERM simulation Component and Board-Level Thermal Modeling Techniques for XFP Optical Transceivers A two-level Micro/Macro Approach to the Simulation of Air Flow and Heat Transfer in Typical Convection-Cooled Electronic Systems Thermal Design for Notebook PC by using Thermal Analysis A Numerical Analysis of Three-Dimensional Conjugate Transport in an Electronic Package Thermal-Fluid Simulation of Computer System Cooling and Verification of Simulation Accuracy Cooling Studies of IBM Technology Products Performed by the Endicott Electronic Packaging Organisation

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