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Home | Industries | Education | Electronics Cooling   » Education Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » Four-Fold Increase in Educational Sites Using Flomerics EFD Software » Flomerics Helps Canadian Schools Pursue F1 Pole Position » “Engineering Fluid Dynamics for Education” Offer by Flomerics Attracts Universities and Technical Colleges Worldwide Simplified Analytical Models for Forced Convection Heat Transfer from Cuboids of Arbitrary Shape Turbulence Modelling and it's Impact on CFD Predictions for Cooling of Electronic Components Hot Predictions, New Electronics, July 2007 An Optical And Numerical Investigation Of The Thermal Interaction Between An Isothermal Cylinder And Its Isothermal Enclosure Transient Performance of Common Modeling Assumptions Used in Detailed Thermal Package Models Using FLOTHERM and the Command Center to Exploit the Principle of Superposition A Design Approach to Thermal Characterization of Forced Convection Systems using Superposition in CFD Linearized Superposition using CFD for Thermal and Power Characterization of Electronic Equipment with Significant Thermal Radiation and Natural Convection Recent Progress in Compact Thermal Models Modeling of Natural Convection in Electronic Enclosures PQFP + Heatsink = ? Energy Fluxes from a Typical PQFP The Effect of Card Mounting Alignment on Component Tests in a Wind Tunnel Benard Convection in a Rectangular Cavity About the Validation of CFD Analysis of Electronic Systems A Numerical study of Buoyancy-Induced Forced Convection on an Isolated Vertical Plate The use of a high-level CFD code in engineering education Getting the Most Out of Your CFD Program Conjugate Heat Transfer of One Component on a PCB in a Small Enclosure The Effect of Thermocouples on Measurements Natural convection heat transfer of metal cuboid flush mounted in a horizontal plate A numerical study on the onset of flow reversal in a vertical channel subject to unequal side wall temperatures Pressure Drop and Heat Transfer in an Isothermal Channel with Impinging Flow Sense and Nonsense Thermal Requirements 'SEED' Project Signals Major Advance in Thermal Modeling of Electronic Equipment Delphi Project Partners Announce New, Highly Accurate Method for Thermal Characterisation of Electronic Components Convection Cooling in Microelectronic Packages: Comparison with FLOTHERM Simulations

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