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Home | Industries | Electronics | Electronics Cooling   » Electronics Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » Thermal Simulation Helps Design New Telecom Platform That Delivers 40Gbps Bandwidth » Flomerics Software Used to Create First Real-Time Cooling Calculator for Data Centers » Cool running, New Electronics magazine (UK), 10 June 2008 Markus Wörner, Design engineer ThermPaq from Flomerics Accelerates Thermal Characterization of Semiconductor Packages Flomerics’ MicReD Subsidiary to Play Major Role in Microelectronics Thermal Research Project “NANOPACK” FLOTHERM Enables Faster Design Process Thermal Simulation Helps Design New Telecom Platform That Delivers 40Gbps Bandwidth T3Ster Thermal Transient Tester Helps Design and Manufacture Better High-Performance Light-Emitting Diodes (LEDs) T3Ster Thermal Transient Tester Helps Design and Manufacture Better High-Performance Light-Emitting Diodes (LEDs) The Changing Role of CFD in Electronics Thermal Design Thermal Design Process At Teradyne's Industrial Consumer Division Analysis of a Heat Pipe Assisted Heat Sink DELPHI Compact Models Revolutionize Thermal Design Investigating Limits in Naturally Cooled Systems Using FLOTHERM An Experimental Assessment of Compact Thermal Models for the Prediction of Board-Mounted Electronic Component Heat Transfer Thermal Simulation Helps Redback Networks Creat First Million-Subscriber Platform for Triple-Play Broadband, Phone and TV Services Webinar: PCB Thermal Simulation - The State of the Art Webinar: Anti-Moisture Methodology for Electronics Enclosures in Harsh Storage Environments Webinar: Integrated Design for High Reliability Power Electronics Cool running, New Electronics magazine (UK), 10 June 2008 Webinar: Achieving High Functional Density Electronics: The ADEPT-SiP Project Thermal Simulation Speeds Design of Versatile Vertical/Horizontal Heatsink Webinar: OneBTS Base Station Thermal Simulation vs Thermal Test Results Webinar: Automating Semiconductor Package Thermal Characterization and Design World Electronic Thermal Management Market to Witness Healthy Growth and Reach $5.8 Billion by 2010, According to New Report by Global Industry Analysts, Inc. Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System Hot Predictions, New Electronics, July 2007 Eaton Hits Thermal Targets on First Prototype with FLOTHERM RFMD Optimizes High Power Device Testing Chamber with FLOTHERM Combination of FLO/PCB and FLOTHERM reduces prototyping costs FLOPACK saves hours of engineering time Novel Approach Offers Significant Improvements in Thermal Interface Material Performance Flomerics Releases Flotherm Version 7 with Unrivalled Design Optimization Capability Thermal Modelling and Experimental Characterization of the C4/Surface-Mount-Array Interconnect Technologies. IEEE, March 1995 Simple Temperature Measurements to Calibrate a CFD Model of CPGA/Heatsink Assemblies to Optimise Heatsink Performance Development of a high performance low pressure drop water cold-plate for electronic packaging applications Thermal Performance of Air-Cooled Hybrid Heat Sinks for a low Velocity Environment Thermal Analysis of an integrated motor and finned housing Development of Optimized Component-Level Thermal Behavioural Models of a Plastic-Ball-Grid Array Interconnect Technology For Air Cooled Applications Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in Natural Convection Environments Thermal Design and Evaluation Methods for Heat Sinks Validating Numerical Predictions of Component Thermal Interaction on Electronic Pronted Circuit Boards In Forced Convection Airflows By Experimental Analysis Modeling Phase Change Material in Electronics using CFD – A Case Study Thermal Simulations Applied to Embedded Cryptographic Coprocessor Devices Thermal Performance Comparison of a Microprocessor using Phase Change Materials in Various Configurations Thermal Transient Modeling And Experimental Validation In The European Project PROFIT New Correlations Between Electrical Current and Temperature Rise in PCB Traces Numerical Investigation of Enclosure Effects on Spot Cooling Devices A Modified Pressure Drop Analytical Method for Heat Sink Thermal Evaluation of Power Amplifier Modules and RF Packages in a Handheld Communicator System Simulation-Based Design Optimization Methodologies Applied to CFD The effect of fan swirl to PSU cooling Thermal Simulation Reduces IC Cost by Comparing Flip-Chip/Wire Bond Thermal Performance "Model PCB Thermals with Greater Accuracy", Power Electronics Technology magazine, Feb 2008 Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts Flomerics Optimizes Thermal Solution for Caltech "Keeping Cool at 50,000ft", Machine Design, Oct 2007 Flomerics’ FLO/PCB Thermal Software is Finalist in IEC’s 2007 DesignVision Awards CADENCE/FLOMERICS Joint Solution helps CISCO bring Leading-Edge Switch to Market Using Computational Fluid Dynamics to design Heat Transfer Enhancement methods for cooling channels Effect of Circuit Board Parameters on Thermal Performance of Electronic Components in Natural Convection Cooling Cooling component modelling Surface-Mount Heat Sink Thermal Analysis Display Panel Thermal Design and Analysis Thermal Characterization and Modelling of EFD Transformers, Applying DELPHI Methodology CFD Modeling of a Therma-Base(TM) Heat Sink A Thermal Design Methodology For Electronic Systems - Part I: Board And Component Level A Thermal Design Methodology For Electronic Systems - Part II: System Level Using FLOTHERM and the Command Center to Exploit the Principle of Superposition Linearized Superposition using CFD for Thermal and Power Characterization of Electronic Equipment with Significant Thermal Radiation and Natural Convection Thermal Modeling and Measurement of Large High Power Silicon Devices With Asymmetric Power Distribution Recent Progress in Compact Thermal Models Modeling of Natural Convection in Electronic Enclosures Comparative Analysis of Heat Sink Pressure Drop Using Different Methodologies Generation of Subassembly Compact Half Models through Experiment and Modeling for Hard Drive Thermal Characterization Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future Requirements Thermal Analysis and Modeling of Diode Array Integrated with Directional Liquid-Cooled Heat Sink Thermal Performance Evaluation for a Microelectronics Motor Control System Incorporating Dynamic Heat Sources Application of Low-Reynolds Number Turbulent Flow Models to the Prediction of Electronic Component Heat Transfer Simulation of PCB's using FLOTHERM Two Thermal Simulation Approaches for Electronic Equipment ALSTOM Slashes Development Costs For Variable Speed Drives T-Wing Heat Spreader on a PQFP Simulating Pb-Free Reflow - Circuits Assembly, October 2006 Imbera Optimizes Thermal Design Using Flotherm & T3Ster Enhance MOSFET Cooling with Thermal Vias - Power Electronics Technology - February 2006 Thermal design tool provides link to Allegro PCB Editor - EE Times - February 2006 Numerical and physical simulation hand in hand to determine the thermal conductivity of a PCB FLOTHERM Simulations of Consumer Electronics Products during the Development Process at ITCL - Philips About the Validation of CFD Analysis of Electronic Systems Board Level Thermal Analysis with AutoTherm A Numerical study of Buoyancy-Induced Forced Convection on an Isolated Vertical Plate An Integrated Approach to Flow, Thermal and Mechanical Modeling of Electronics Devices Numerical Analysis of an Array of Ball Grid Components (255 KB) A Numerical Study of the Thermal Performance of an Impingement Heat Sink - Fin Shape Optimization Thermal Interaction of an Array of Flip Chip Components Conjugate Heat Transfer of One Component on a PCB in a Small Enclosure NOKIAs Use of FLOTHERM Thermal Analysis of a Pin Grid Array Package The Effect of Thermocouples on Measurements A Pin Fin Heatsink in Angled Flow Flomerics Adds Thermal Models of Sunon “Mighty Mini” Fans to SmartParts3D Website Thermal measurement and modeling of multi-die packages (Therminic 2006) Electrical, thermal and optical characterization of power led assemblies (Therminic 2006) FLO/PCB Software Saves 4-6 Week PCB Re-Spin - Circuits Assembley - June 2006 Thermal issues in stacked die packages (Semi-Therm 2005) Thermal transient characterization methodology for single-die and stacked structures (Semi-Therm 2005) Transient junction-to-case thermal resistance measurement methodology of high accuracy and high repeatability (Therminic 2004) Electric and thermal transient effects in high power optical devices (Semi-Therm 2004) A procedure to correct the error in the structure function based thermal measuring methods (Semi-Therm 2004) Evaluation issues of thermal measurements based on structure functions (Therminic 2003) Non-linearity issues in the dynamic compact model generation (Semi-Therm 2003) Dynamic compact models of cooling mounts for fast board level design (Semi-Therm 2003) Dynamic Temperature Analysis of Electronic Systems (Future Circuits International 2002) Dynamic temperature measurements (Electronics Cooling - May 2002) Thermal characterisation and modelling of multi chip modules using standard electronic packages Natural convection heat transfer of metal cuboid flush mounted in a horizontal plate Some Tricks of the Trade of a FLOTHERM User Thermal Model of Buried Resistors and Design Gidelines for Buried Components Thermal characteristics of complex systems An Airspeed Measurement Technique for Accurate Correlation to CFD Simulation Results Modelling Of A Phase Change Material Thermal Battery Sense and Nonsense Thermal Requirements PCB Design Flow Under Thermal Control PCB Design Flow Under Thermal Control The Application of FLOTHERM to Solving Air Flow and Heat Transfer problems in Power Supplies and Domestic Appliances Thermal Simulation in Concept Design of a Complex System Thermal Design Productivity Enhanced With On-line Fan Libraries Working with Flomerics' Thermal Design team pays off 'SEED' Project Signals Major Advance in Thermal Modeling of Electronic Equipment Choosing Fan and Heatsink for a New Generation of AC - AC Converters Automated Electronic Module Thermal Design Using Flotherm V.2 and AutoTherm Thermal Experiment and Analysis of Small Desktop Enclosure Thermal Analysis of an Electronic Enclosure in a Harsh Working Environment Thermal analysis and environment of FLOTHERM Choosing component locations for optimal cooling - Electronic Products - May 2006 Thermal Experiment and Analysis of Small Desktop Enclosure Numerical Analysis of Thermoelectric Coolers (TEC) Using FLOTHERM Thermal analysis of an UHP high current driver The Customizing of FLOTHERM Modeling Thermal analysis of an UHP high current driver FLO/STRESS: An Integrated Software Module to Predict Stress in Electronic Products New Flo/PCB Software Helps Solve Lead-Free Manufacturing Problems Relative Metrics' Library Of Thermal Data Now Offered By Flomerics For Use With Flotherm Johnson Matthey Electronics Establishes Strategic Joint Marketing Agreement with Flomerics Inc. to Provide Integrated Thermal Solutions

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