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Flomerics' software is used by almost all the world's leading electronics companies, including all major manufacturers of computers,
telecommunications and networking equipment, automotive and aerospace electronics, consumer electronics and all the world's leading
semiconductor manufacturers. Each new generation of electronic devices runs at higher clock speeds and dissipates more power per device,
leading to ever-increasing challenges in thermal and
electromagnetic design and making cooling for electronics even more essential.
Flomerics provides integrated solutions for the cooling of electronics through thermal and electromagnetic design for individual
components,
PCB boards, and complete electronic systems.
Our flagship software, FLOTHERM, has been the clear market leader in thermal analysis
of electronic equipment since 1989. Our EFD software creates heat
transfer and fluid flow simulations directly from 3D MCAD models, and is ideally suited for solving thermal problems in electronics enclosures
containing complex, curvilinear geometry, including thin curved shells.
Flomerics software optimizes electronics cabinet cooling, improves data center cooling, solves electronics thermal problems and improves printed
circuit board designs. Flomerics assists with thermal simulation of electronic equipment with thermal management consultancy services and cooling
software. We also offer thermal test and measurement equipment as a complement to our simulation software. The argument for implementing thermal
simulation software into your design process is compelling. With Flomerics software you can get your thermal design right the first time with
fewer redesigns needed, saving you a great deal of time and money during the design process.
A recent survey by Aberdeen Research found that Flomerics’ customers achieve thermal design verification 3 times faster, and are 5 times less
likely to need design “re-spins”. Need we say more?
Ultra Electronics
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Solving the System-Level Thermal Management Challenges of LEDs
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ThermPaq from Flomerics Accelerates Thermal Characterization of Semiconductor Packages
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Thales Air Systems Division Selects EFD.Pro Engineering Fluid Dynamics Software Embedded in Pro/ENGINEER
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Flomerics’ MicReD Subsidiary to Play Major Role in Microelectronics Thermal Research Project “NANOPACK”
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FLOTHERM Enables Faster Design Process
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Thales Air Systems Division
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Dialight PLC Chooses EFD.Pro Engineering Fluid Dynamics Software for Pro/ENGINEER
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"Embed with CFD", MCAD Online, Feb 2008
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EFD Meshing Technology White Paper
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The Changing Role of CFD in Electronics Thermal Design
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Targeted Airflow - EFD.Lab Used for Flow Simulation at Océ
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Analysis of a Heat Pipe Assisted Heat Sink
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Thermal Design Process At Teradyne's Industrial Consumer Division
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DELPHI Compact Models Revolutionize Thermal Design
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Investigating Limits in Naturally Cooled Systems Using FLOTHERM
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An Experimental Assessment of Compact Thermal Models for the Prediction of Board-Mounted Electronic Component Heat Transfer
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Thermal Simulation Speeds Design of Versatile Vertical/Horizontal Heatsink
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OneBTS Base Station Thermal Simulation vs Thermal Test Results
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Automating Semiconductor Package Thermal Characterization and Design
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Dialight PLC
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Sharp Laboratories Europe
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World Electronic Thermal Management Market to Witness Healthy Growth and Reach $5.8 Billion by 2010, According to New Report by Global Industry Analysts, Inc.
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Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System
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Sharp Laboratories Selects EFD.V5 Engineering Fluid Dynamics Software for CATIA V5
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Hot Predictions, New Electronics, July 2007
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Eaton Hits Thermal Targets on First Prototype with FLOTHERM
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RFMD Optimizes High Power Device Testing Chamber with FLOTHERM
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Combination of FLO/PCB and FLOTHERM reduces prototyping costs
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FLOPACK saves hours of engineering time
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Novel Approach Offers Significant Improvements in Thermal Interface Material Performance
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Heat Exchanger
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Electronics Enclosure
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Cold Plate
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Projector Lamp
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Flomerics Releases Flotherm Version 7 with Unrivalled Design Optimization Capability
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Thermal Modelling and Experimental Characterization of the C4/Surface-Mount-Array Interconnect Technologies. IEEE, March 1995
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Simple Temperature Measurements to Calibrate a CFD Model of CPGA/Heatsink Assemblies to Optimise Heatsink Performance
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Development of a high performance low pressure drop water cold-plate for electronic packaging applications
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Thermal Performance of Air-Cooled Hybrid Heat Sinks for a low Velocity Environment
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Thermal Analysis of an integrated motor and finned housing
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Development of Optimized Component-Level Thermal Behavioural Models of a Plastic-Ball-Grid Array Interconnect Technology For Air Cooled Applications
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Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in Natural Convection Environments
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Thermal Design and Evaluation Methods for Heat Sinks
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Validating Numerical Predictions of Component Thermal Interaction on Electronic Pronted Circuit Boards In Forced Convection Airflows By Experimental Analysis
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Modeling Phase Change Material in Electronics using CFD – A Case Study
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Thermal Simulations Applied to Embedded Cryptographic Coprocessor Devices
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Thermal Performance Comparison of a Microprocessor using Phase Change Materials in Various Configurations
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Thermal Transient Modeling And Experimental Validation In The European Project PROFIT
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New Correlations Between Electrical Current and Temperature Rise in PCB Traces
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Numerical Investigation of Enclosure Effects on Spot Cooling Devices
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A Modified Pressure Drop Analytical Method for Heat Sink
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Thermal Evaluation of Power Amplifier Modules and RF Packages in a Handheld Communicator System
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Simulation-Based Design Optimization Methodologies Applied to CFD
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The effect of fan swirl to PSU cooling
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Thermal Simulation Reduces IC Cost by Comparing Flip-Chip/Wire Bond Thermal Performance
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"Model PCB Thermals with Greater Accuracy", Power Electronics Technology magazine, Feb 2008
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Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts
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Flomerics Optimizes Thermal Solution for Caltech
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"Keeping Cool at 50,000ft", Machine Design, Oct 2007
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Flomerics’ FLO/PCB Thermal Software is Finalist in IEC’s 2007 DesignVision Awards
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CADENCE/FLOMERICS Joint Solution helps CISCO bring Leading-Edge Switch to Market
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Using Computational Fluid Dynamics to design Heat Transfer Enhancement methods for cooling channels
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Effect of Circuit Board Parameters on Thermal Performance of Electronic Components in Natural Convection Cooling
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Cooling component modelling
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Surface-Mount Heat Sink Thermal Analysis
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Using FLOTHERM and the Command Center to Exploit the Principle of Superposition
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Modeling of Natural Convection in Electronic Enclosures
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Display Panel Thermal Design and Analysis
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Thermal Characterization and Modelling of EFD Transformers, Applying DELPHI Methodology
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CFD Modeling of a Therma-Base(TM) Heat Sink
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A Thermal Design Methodology For Electronic Systems - Part I: Board And Component Level
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A Thermal Design Methodology For Electronic Systems - Part II: System Level
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Linearized Superposition using CFD for Thermal and Power Characterization of Electronic Equipment with Significant Thermal Radiation and Natural Convection
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Thermal Modeling and Measurement of Large High Power Silicon Devices With Asymmetric Power Distribution
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Recent Progress in Compact Thermal Models
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Comparative Analysis of Heat Sink Pressure Drop Using Different Methodologies
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Generation of Subassembly Compact Half Models through Experiment and Modeling for Hard Drive Thermal Characterization
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Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future Requirements
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Thermal Analysis and Modeling of Diode Array Integrated with Directional Liquid-Cooled Heat Sink
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Thermal Performance Evaluation for a Microelectronics Motor Control System Incorporating Dynamic Heat Sources
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Application of Low-Reynolds Number Turbulent Flow Models to the Prediction of Electronic Component Heat Transfer
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Simulation of PCB's using FLOTHERM
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Two Thermal Simulation Approaches for Electronic Equipment
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ALSTOM Slashes Development Costs For Variable Speed Drives
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T-Wing Heat Spreader on a PQFP
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Simulating Pb-Free Reflow - Circuits Assembly, October 2006
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Imbera Optimizes Thermal Design Using Flotherm & T3Ster
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Enhance MOSFET Cooling with Thermal Vias - Power Electronics Technology - February 2006
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New software helps solve lead-free manufacturing - Global-Electronics - February 2006
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Thermal design tool provides link to Allegro PCB Editor - EE Times - February 2006
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FLOTHERM Simulations of Consumer Electronics Products during the Development Process at ITCL - Philips
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About the Validation of CFD Analysis of Electronic Systems
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Board Level Thermal Analysis with AutoTherm
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A Numerical study of Buoyancy-Induced Forced Convection on an Isolated Vertical Plate
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Numerical and physical simulation hand in hand to determine the thermal conductivity of a PCB
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An Integrated Approach to Flow, Thermal and Mechanical Modeling of Electronics Devices
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Numerical Analysis of an Array of Ball Grid Components
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(255 KB) A Numerical Study of the Thermal Performance of an Impingement Heat Sink - Fin Shape Optimization
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Thermal Interaction of an Array of Flip Chip Components
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Conjugate Heat Transfer of One Component on a PCB in a Small Enclosure
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NOKIAs Use of FLOTHERM
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Thermal Analysis of a Pin Grid Array Package
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The Effect of Thermocouples on Measurements
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A Pin Fin Heatsink in Angled Flow
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Flomerics Adds Thermal Models of Sunon “Mighty Mini” Fans to SmartParts3D Website
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FLO/PCB Software Saves 4-6 Week PCB Re-Spin - Circuits Assembley - June 2006
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Thermal characterisation and modelling of multi chip modules using standard electronic packages
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Natural convection heat transfer of metal cuboid flush mounted in a horizontal plate
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Some Tricks of the Trade of a FLOTHERM User
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Thermal Model of Buried Resistors and Design Gidelines for Buried Components
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Thermal characteristics of complex systems
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An Airspeed Measurement Technique for Accurate Correlation to CFD Simulation Results
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Modelling Of A Phase Change Material Thermal Battery
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Sense and Nonsense Thermal Requirements
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PCB Design Flow Under Thermal Control
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PCB Design Flow Under Thermal Control
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The Application of FLOTHERM to Solving Air Flow and Heat Transfer problems in Power Supplies and Domestic Appliances
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Thermal Simulation in Concept Design of a Complex System
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Thermal Design Productivity Enhanced With On-line Fan Libraries
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Working with Flomerics' Thermal Design team pays off
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PROFIT - A New European Project Addressing Thermal Issues In Electronics
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'SEED' Project Signals Major Advance in Thermal Modeling of Electronic Equipment
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Choosing Fan and Heatsink for a New Generation of AC - AC Converters
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Thermal Experiment and Analysis of Small Desktop Enclosure
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Thermal Analysis of an Electronic Enclosure in a Harsh Working Environment
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Automated Electronic Module Thermal Design Using Flotherm V.2 and AutoTherm
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Thermal analysis and environment of FLOTHERM
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Air Foil Improves Chassis Efficiency
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Choosing component locations for optimal cooling - Electronic Products - May 2006
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Thermal Experiment and Analysis of Small Desktop Enclosure
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Numerical Analysis of Thermoelectric Coolers (TEC) Using FLOTHERM
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Thermal analysis of an UHP high current driver
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Siemens AG To Use NIKA Software Worldwide
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The Customizing of FLOTHERM Modeling
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Thermal analysis of an UHP high current driver
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FLO/STRESS: An Integrated Software Module to Predict Stress in Electronic Products
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New Flo/PCB Software Helps Solve Lead-Free Manufacturing Problems
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Relative Metrics' Library Of Thermal Data Now Offered By Flomerics For Use With Flotherm
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Johnson Matthey Electronics Establishes Strategic Joint Marketing Agreement with Flomerics Inc. to Provide Integrated Thermal Solutions
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