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Home | Industries | Electronics | Technical papers   » Electronics Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » Thermal Simulation Helps Design New Telecom Platform That Delivers 40Gbps Bandwidth » Flomerics Software Used to Create First Real-Time Cooling Calculator for Data Centers » Cool running, New Electronics magazine (UK), 10 June 2008 Markus Wörner, Design engineer Solving the System-Level Thermal Management Challenges of LEDs Analysis of a Heat Pipe Assisted Heat Sink Thermal Design Process At Teradyne's Industrial Consumer Division DELPHI Compact Models Revolutionize Thermal Design Investigating Limits in Naturally Cooled Systems Using FloTHERM An Experimental Assessment of Compact Thermal Models for the Prediction of Board-Mounted Electronic Component Heat Transfer Thermal Modelling and Experimental Characterization of the C4/Surface-Mount-Array Interconnect Technologies. IEEE, March 1995 Simple Temperature Measurements to Calibrate a CFD Model of CPGA/Heatsink Assemblies to Optimise Heatsink Performance Development of a high performance low pressure drop water cold-plate for electronic packaging applications Thermal Performance of Air-Cooled Hybrid Heat Sinks for a low Velocity Environment Thermal Analysis of an integrated motor and finned housing Development of Optimized Component-Level Thermal Behavioural Models of a Plastic-Ball-Grid Array Interconnect Technology For Air Cooled Applications Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in Natural Convection Environments Thermal Design and Evaluation Methods for Heat Sinks Validating Numerical Predictions of Component Thermal Interaction on Electronic Pronted Circuit Boards In Forced Convection Airflows By Experimental Analysis Modeling Phase Change Material in Electronics using CFD – A Case Study Thermal Simulations Applied to Embedded Cryptographic Coprocessor Devices Thermal Performance Comparison of a Microprocessor using Phase Change Materials in Various Configurations Thermal Transient Modeling And Experimental Validation In The European Project PROFIT New Correlations Between Electrical Current and Temperature Rise in PCB Traces Numerical Investigation of Enclosure Effects on Spot Cooling Devices A Modified Pressure Drop Analytical Method for Heat Sink Thermal Evaluation of Power Amplifier Modules and RF Packages in a Handheld Communicator System Simulation-Based Design Optimization Methodologies Applied to CFD The effect of fan swirl to PSU cooling Using Computational Fluid Dynamics to design Heat Transfer Enhancement methods for cooling channels Effect of Circuit Board Parameters on Thermal Performance of Electronic Components in Natural Convection Cooling Cooling component modelling Surface-Mount Heat Sink Thermal Analysis Using FloTHERM and the Command Center to Exploit the Principle of Superposition Modeling of Natural Convection in Electronic Enclosures Display Panel Thermal Design and Analysis Thermal Characterization and Modelling of EFD Transformers, Applying DELPHI Methodology CFD Modeling of a Therma-Base(TM) Heat Sink A Thermal Design Methodology For Electronic Systems - Part I: Board And Component Level A Thermal Design Methodology For Electronic Systems - Part II: System Level Linearized Superposition using CFD for Thermal and Power Characterization of Electronic Equipment with Significant Thermal Radiation and Natural Convection Thermal Modeling and Measurement of Large High Power Silicon Devices With Asymmetric Power Distribution Recent Progress in Compact Thermal Models Comparative Analysis of Heat Sink Pressure Drop Using Different Methodologies Generation of Subassembly Compact Half Models through Experiment and Modeling for Hard Drive Thermal Characterization Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future Requirements Thermal Analysis and Modeling of Diode Array Integrated with Directional Liquid-Cooled Heat Sink Thermal Performance Evaluation for a Microelectronics Motor Control System Incorporating Dynamic Heat Sources Application of Low-Reynolds Number Turbulent Flow Models to the Prediction of Electronic Component Heat Transfer Simulation of PCB's using FloTHERM Two Thermal Simulation Approaches for Electronic Equipment FloTHERM Simulations of Consumer Electronics Products during the Development Process at ITCL - Philips About the Validation of CFD Analysis of Electronic Systems Board Level Thermal Analysis with AutoTherm A Numerical study of Buoyancy-Induced Forced Convection on an Isolated Vertical Plate Numerical and physical simulation hand in hand to determine the thermal conductivity of a PCB An Integrated Approach to Flow, Thermal and Mechanical Modeling of Electronics Devices Numerical Analysis of an Array of Ball Grid Components (255 KB) A Numerical Study of the Thermal Performance of an Impingement Heat Sink - Fin Shape Optimization Thermal Interaction of an Array of Flip Chip Components Conjugate Heat Transfer of One Component on a PCB in a Small Enclosure NOKIAs Use of FloTHERM Thermal Analysis of a Pin Grid Array Package Thermal measurement and modeling of multi-die packages (Therminic 2006) Electrical, thermal and optical characterization of power led assemblies (Therminic 2006) Thermal issues in stacked die packages (Semi-Therm 2005) Thermal transient characterization methodology for single-die and stacked structures (Semi-Therm 2005) Transient junction-to-case thermal resistance measurement methodology of high accuracy and high repeatability (Therminic 2004) Structure function evaluation of stacked dies (Semi-Therm 2004) A procedure to correct the error in the structure function based thermal measuring methods (Semi-Therm 2004) Electric and thermal transient effects in high power optical devices (Semi-Therm 2004) Evaluation issues of thermal measurements based on structure functions (Therminic 2003) Non-linearity issues in the dynamic compact model generation (Semi-Therm 2003) Dynamic compact models of cooling mounts for fast board level design (Semi-Therm 2003) Dynamic Temperature Analysis of Electronic Systems (Future Circuits International 2002) Dynamic temperature measurements (Electronics Cooling - May 2002) Thermal characterisation and modelling of multi chip modules using standard electronic packages Natural convection heat transfer of metal cuboid flush mounted in a horizontal plate Some Tricks of the Trade of a FloTHERM User Thermal Model of Buried Resistors and Design Gidelines for Buried Components Thermal characteristics of complex systems An Airspeed Measurement Technique for Accurate Correlation to CFD Simulation Results Modelling Of A Phase Change Material Thermal Battery Sense and Nonsense Thermal Requirements PCB Design Flow Under Thermal Control PCB Design Flow Under Thermal Control The Application of FloTHERM to Solving Air Flow and Heat Transfer problems in Power Supplies and Domestic Appliances Thermal Simulation in Concept Design of a Complex System Choosing Fan and Heatsink for a New Generation of AC - AC Converters Thermal Experiment and Analysis of Small Desktop Enclosure Thermal Analysis of an Electronic Enclosure in a Harsh Working Environment Automated Electronic Module Thermal Design Using FloTHERM V.2 and AutoTherm Thermal analysis and environment of FloTHERM Thermal Experiment and Analysis of Small Desktop Enclosure Numerical Analysis of Thermoelectric Coolers (TEC) Using FloTHERM Thermal analysis of an UHP high current driver The Customizing of FloTHERM Modeling Thermal analysis of an UHP high current driver FLO/STRESS: An Integrated Software Module to Predict Stress in Electronic Products

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