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Cool running, New Electronics magazine (UK), 10 June 2008
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Thermal Simulation Speeds Design of Versatile Vertical/Horizontal Heatsink
»
ThermPaq from Flomerics Accelerates Thermal Characterization of Semiconductor Packages
Markus Wörner, Design engineer
AEG Electric Tools GmbH Creates Cool Power Tools Faster with EFD.Lab Flow Simulation
Ultra Electronics
FLOTHERM Enables Faster Design Process
Thales Air Systems Division
Dialight PLC
Sharp Laboratories Europe
Eaton Hits Thermal Targets on First Prototype with FLOTHERM
RFMD Optimizes High Power Device Testing Chamber with FLOTHERM
Combination of FLO/PCB and FLOTHERM reduces prototyping costs
FLOPACK saves hours of engineering time
Novel Approach Offers Significant Improvements in Thermal Interface Material Performance
Working with Flomerics' Thermal Design team pays off
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