Language   Chinese  French  German  Italian  Japanese  Korean  Russian  Spanish

Home | Industries | Lighting | Technical papers   » Lighting Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » News   » Technical papers   » Testimonials » Thermally Efficient Technique for High-Power LED Packages, Nikkei Electronics Asia, July 2008 » "Solving System Level Thermal Management Challenges in LED Systems", Printed-Circuit Design & Manufacture magazine, July 2008 » "Solving the system-level thermal management challenges of LEDs", LEDs Magazine, June 2008 Gordon Routledge Solving the System-Level Thermal Management Challenges of LEDs Using CFD to Predict the Flow Behaviour of the UHP Lamp. Display Panel Thermal Design and Analysis Thermal Impedance Measurements of Junction-Down Mounted Single-Side Contact Laser Diodes Thermal analysis of LED package using FLOTHERM, Microelectronics International Journal, 2006 FLOTHERM Simulations of Consumer Electronics Products during the Development Process at ITCL - Philips Electrical, thermal and optical characterization of power led assemblies (Therminic 2006) Electric and thermal transient effects in high power optical devices (Semi-Therm 2004) Thermal Management in Industrial Product Development Thermal Management of Palmtop Projector products

	Home | Contact Us | Company | Products & Services | Industries | Applications | News | Events | Support Copyright © FLOMERICS Group PLC