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»Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50%
»Cool running, New Electronics magazine (UK), 10 June 2008
»AMCC Uses FloTHERM & FloTHERM.PACK to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance
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Dr. Thomas Zahner, Quality Manager
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Some existing Semiconductors customers

Advanced Micro Devices
Agere Systems
Agilent Technologies
Altera
AMI Semiconductor Belgium BVBA
Amkor
Applied Micro Circuits Corporation
Artimi Ltd
ASML
Avago Technologies
ClearSpeed Technology
C-Mac Microcircuits
CommScope Carrier Solutions
CSR UK (Cambridge Silicon Radio)
Emerson Energy Systems
Freescale Semiconductor
Fujitsu Laboratories Limited
Hynix Semiconductor Inc.
Ikanos
Imbera Electronics Oy
Infineon Technologies AG
Intel
Intersil
Kulicke & Soffa
Melcor
Micron Technology
Mindspeed Technologies Inc.
MKS ASTeX
MKS Instruments, Inc.
Molex Incorporated
National Semiconductor
NEC Electronics
nVIDIA Corporation
NXP
Osram Opto Semiconductors GmbH
Paratek Microwave, Inc.
PMC-Sierra
Qimonda AG
Rambus, Inc.
RF Micro Devices
Samsung Electronics Co Ltd
SEM S.r.l.
Semelab Plc
Skyworks Solutions Inc.
ST Microelectronics
STATS Chipac
Sun Microsystems
Teradyne Inc.
Tessera, Inc.
Texas Instruments
Transmeta Corporation
UTAC
Vishay Semiconductor GmbH
Vossloh-Schwabe Optoelectronics GmbH & Co. KG
Wolfson Microelectronics plc
Xilinx, Inc.

 


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