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Home | Industries | Semiconductors | Electronics Cooling   » Semiconductors Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50% » Cool running, New Electronics magazine (UK), 10 June 2008 » AMCC Uses Flotherm & Flopack to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance Dr. Thomas Zahner, Quality Manager ThermPaq from Flomerics Accelerates Thermal Characterization of Semiconductor Packages Flomerics’ MicReD Subsidiary to Play Major Role in Microelectronics Thermal Research Project “NANOPACK” New Standards, Techniques for Package Thermal Modeling, Semiconductor International, June 2007 Agilent Speeds Thermal Design for its Customers by Providing Compact Models Tekelec Incorporates Emerging Requirements for Telecom Switching Equipment Using FLOTHERM AMCC Uses Flotherm & Flopack to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance T3Ster Thermal Transient Tester Helps Design and Manufacture Better High-Performance Light-Emitting Diodes (LEDs) T3Ster Thermal Transient Tester Helps Design and Manufacture Better High-Performance Light-Emitting Diodes (LEDs) The Development of Libraries of Physical Models of Electronic Components for an Integrated Design Environment Thermal limits of flip chip package-experimentally validated, CFD supported case studies A Comparative Study of the Performance of Compact Model Topologies and their Implementation in CFD for a Plastic Ball Grid Array DELPHI Compact Models Revolutionize Thermal Design An Experimental Assessment of Compact Thermal Models for the Prediction of Board-Mounted Electronic Component Heat Transfer Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50% Cool running, New Electronics magazine (UK), 10 June 2008 Webinar: Automating Semiconductor Package Thermal Characterization and Design "Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System" Trevor Moody, Antares Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System Hot Predictions, New Electronics, July 2007 Intersil Gains Competitive Advantage Through Thermal Analysis NVIDIA Optimizes Thermal Design of Graphics and Digital Media Processors Using FLOTHERM FLOTHERM and T3Ster Help Imbera Develop New Integrated Module Board (IMB) Technology Harris Corporation Optimizes Power-HFET Devices Using FLOTHERM Thermacore Develops Cooling Solutions for High Power IGBTs and MOSFETs Using FLOTHERM Philips Use T3Ster to Develop Thermal Models of Chip Packages Properties of the structure function and its use for structure identification and for compact model generation Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: the C4/Ceramic-ball-Grid Array Interconnect Technology Thermal Modelling and Experimental Characterization of the C4/Surface-Mount-Array Interconnect Technologies. IEEE, March 1995 Simple Temperature Measurements to Calibrate a CFD Model of CPGA/Heatsink Assemblies to Optimise Heatsink Performance Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603 and PowerPC 604 RISC Microprocessor The Development of Three-dimensional Computational-Fluid-Dynamics Models of PBGA Interconnect Technology for Moderate Air-cooled Systems Experimental validation methods for thermal models Thermal Evaluation of Standard and Power TQFP The Development of Component-Level Thermal Compact Models of a C4/CBGA Interconnect Technology: The Motorola Power PC 603TM and Power PC 604TM RISC Microprocessors Thermal Sub-Modeling of the Wirebonded Plastic Ball Grid Array Package Issues in Validating Package Compact Thermal Models for Natural Convection Cooled Electronic Systems Thermal Analysis of a Chip on Board (COB) Development of Optimized Component-Level Thermal Behavioural Models of a Plastic-Ball-Grid Array Interconnect Technology For Air Cooled Applications Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications Compact Transient Thermal Models for the Polymer Stud Grid Array (PSGATM) Package Creation and Validation of a Two-Resistor Compact Model of a Plastic Quad Flat Pack (PQFP) Using CFD Numerical And Experimental Investigation Of A Tape Ball Grid Array Package Thermal Modeling of Chip Scale Packages for Power Applications in Telecommunication Equipment A Study of Compact Thermal Model Topologies in CFD for a Flip Chip Plastic Ball Grid Array Package Power stage thermal design for DDX Amplifiers The Extraction of a Two-Resistor/Two-Capacitor Model for Common IC Packages and their Implementation in CFD Transient Performance of Common Modeling Assumptions Used in Detailed Thermal Package Models Thermal Transient Modeling And Experimental Validation In The European Project PROFIT Development of a New Improved High Performance Flip Chip BGA Package Thermal Management of OSTAR® Projection Light Source Thermacore Develops Cooling Solutions for High Power IGBTs and MOSFETs Using FLOTHERM Streamlined Thermal Modeling Intersil Gains Competitive Advantage Through Thermal Analysis Graphics and Digital Media Processors Design Overcoming Thermal Design Challenges to Produce Single-Chip Multimedia Solution Flomerics Optimizes Thermal Solution for Caltech Real-world power tests model FPGA’s thermal characteristics, EDN, April 2007 Building the System-in-Package Design Infrastructure Coping with the New Crop of Hot Boards - PKG Magazine, August 2006 Taking the Heat Out Of Electronics - Desktop Engineering - July 2006 Flomerics and Gradient Design Automation Partner to Address Die-Level Thermal Issues MicReD and Inphora launch TERALED for power LED-s CADENCE/FLOMERICS Joint Solution helps CISCO bring Leading-Edge Switch to Market Application of CFD Technology in Electronic Thermal Management Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: C4/Ceramic-ball-grid Array Interconnect Technology The Effect of Solder-Joint Temperature Rise on Ceramic-ball-grid Array to Board Interconnection Reliability: The Motorola PowerPC 603 and PowerPC 604 Interpack, March 95 Achieving Accurate Thermal Characterization Using a CFD Code-A Case Study of Plastic Packages Thermal Characterization of Electronic Devices with Boundary Condition Independent Compact Models Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling Thermal Characterization of a 3-Dimensional Memory Module Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process Thermal Modelling of Ball-Grid-Array Package Geometry Considerations in Thermal Compact Modeling Strategies Thermal Characterisation of SSOP Packages Thermal Design for Flip-Chip on Board in Natural Convection Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling Thermal Characterization of Cavity-Down TBGA (Tape Ball Grid Arrays) Package with FLOTHERM simulation Thermal Strategy for Modeling The Wirebonded PBGA Packages Design Characteristics of High Performance and Reduced Cost Chip Scale Package - µBGA Comparison of Numerical Predictions and Experimental Measurements for the Transient Thermal Behavior of a Board-Mounted Electronic Component Prediction of Thermal Performance of Flip Chip - Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Substrate Physical Design Substantiation of Numerical Analysis Methodology for CPU Package With Non-Uniform Heat Dissipation and Heat Sink with Simplified Fin Modeling Flomerics Presentation to JEDEC JC 15 Committee A 3-D, Thermal Analysis of Microprocessors Thermal Analysis of a Ceramic Microelectronics Package using FLOTHERM Thermal Simulation Models for More Accurate Prediction of MOSFET Operating Temperature in Mobile Devices Power Amplifier Design What Do These World-Leading Electronic Products Have In Common? PQFP + Heatsink = ? Thermal Modeling of Ball Grid Arrays Energy Fluxes from a Typical PQFP The Effect of Card Mounting Alignment on Component Tests in a Wind Tunnel Agilent Speeds Thermal Design for its Customers by Providing Compact Models MicReD Offers TERALED Tester for Optical and Thermal LED Measurements Imbera Optimizes Thermal Design Using Flotherm & T3Ster Modelling to standards - Components in Electronics - April 2006 Streamlined Thermal Modeling - Advanced Packaging - March 2006 Enhance MOSFET Cooling with Thermal Vias - Power Electronics Technology - February 2006 Extension box for T3Ster Celestica Thermal Modelling of the Pentium Processor Thermal Modeling of high performance packages in Portable Computers Development, Validation and Application of a Thermal Model of a Plastic Quad Flat Pack Design-Based Thermal Performance Evaluation of a GaAs MMIC Device in a Plastic Ball Grid Array Package Thermal analysis of a Telecommunications Multi-Service Access Functional Processor Module using CFD FLO/STRESS: An Integrated Stress Solver For The CFD Tool FLOTHERM An Integrated Approach to Flow, Thermal and Mechanical Modeling of Electronics Devices Numerical Analysis of an Array of Ball Grid Components Development, Validation, and Application of Thermal Modeling for a MCM Power Package Micro Cooling Application on High Density Memory Module Using Compact Models in the Early Thermal Design of Electronics Thermal Management of Golden Dragon LED An Investigation of Thermal Enhancement of MPM BGA Package Thermal Analysis of a Pin Grid Array Package FLOTHERM and T3Ster Help Imbera Develop New Integrated Module Board (IMB) Technology Bottom-side cooling of LFPAK power MOSFETs Speeding Thermal Design for Customers by Providing Compact Models Speeding Thermal Design for Customers by Providing Compact Models Reducing Developmend Time FLOTHERM Helps Cool The Fastest Chip In The World The Effect of Thermocouples on Measurements Compact Thermal Modeling: Impacting the industry, Advanced Packaging, April 2007 Thermal measurement and modeling of multi-die packages (Therminic 2006) Electrical, thermal and optical characterization of power led assemblies (Therminic 2006) Flomerics Presentation at DesignCon: “EEs Should Be More Thermally Proactive” Flomerics announces FLO/PCB for Allegro, Offering Bi-directional Interface to Cadence Allegro PCB Editor Speed Thermal Design Using Compact Models - Desktop Engineering - October 2005 New USB interface for T3Ster Thermal issues in stacked die packages (Semi-Therm 2005) Thermal transient characterization methodology for single-die and stacked structures (Semi-Therm 2005) Transient junction-to-case thermal resistance measurement methodology of high accuracy and high repeatability (Therminic 2004) Electric and thermal transient effects in high power optical devices (Semi-Therm 2004) A procedure to correct the error in the structure function based thermal measuring methods (Semi-Therm 2004) Evaluation issues of thermal measurements based on structure functions (Therminic 2003) Non-linearity issues in the dynamic compact model generation (Semi-Therm 2003) Dynamic compact models of cooling mounts for fast board level design (Semi-Therm 2003) Dynamic Temperature Analysis of Electronic Systems (Future Circuits International 2002) Determining partial thermal resistances with transient measurements and using the method to detect die attach discontinuities (Semi-Therm 2002) Dynamic temperature measurements (Electronics Cooling - May 2002) Modeling, Validation and Thermal Solution Design for a Flip-Chip Plastic Ball Grid Array Package Thermal characteristics of complex systems Using Cap-Integral Standoffs to Reduce Chip Hot-Spot Temperatures in Electronic Packages Thermal Assessment of RF Integrated LTCC Front End Module (FEM) Modelling the Effect of Temperature on Product Reliability DirectFET™ Thermal Model and Rating Calculator Extension of Air Cooling for High Power Processors Combined Thermal and Thermomechanical Modeling for a Multi-Chip QFN Package with Metal-Core Printed Circuit Board Creating and Solving CFD and FEA models FLOTHERM Analysis Helps Cool The Fastest Chip In The World The 1GHz ALPHA Processor Predicting Maximum Junction Temperatures and Thermal Performance in the Design and Development of ASICS Parametric Study of Thermal Characteristics of Plastic Ball Grid Array by Computational Fluid Dynamics FLO/STRESS: An Integrated Software Module to Predict Stress in Electronic Products FLOTHERM Analysis Helps Cool The Fastest Chip In The World The 1GHz ALPHA Processor

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