Semiconductor Thermal Analysis

ThermPaq from Flomerics Accelerates Thermal Characterization of Semiconductor Packages	Flomerics’ MicReD Subsidiary to Play Major Role in Microelectronics Thermal Research Project “NANOPACK”	New Standards, Techniques for Package Thermal Modeling, Semiconductor International, June 2007
Agilent Speeds Thermal Design for its Customers by Providing Compact Models	Laser Cutting System from Fico Achieves 40x Performance Enhancement	Tekelec Incorporates Emerging Requirements for Telecom Switching Equipment Using FLOTHERM
AMCC Uses Flotherm & Flopack to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance	EFD Meshing Technology White Paper	The Development of Libraries of Physical Models of Electronic Components for an Integrated Design Environment
Thermal limits of flip chip package-experimentally validated, CFD supported case studies	A Comparative Study of the Performance of Compact Model Topologies and their Implementation in CFD for a Plastic Ball Grid Array	DELPHI Compact Models Revolutionize Thermal Design
An Experimental Assessment of Compact Thermal Models for the Prediction of Board-Mounted Electronic Component Heat Transfer	Automating Semiconductor Package Thermal Characterization and Design	"Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System" Trevor Moody, Antares
Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System	Hot Predictions, New Electronics, July 2007	FLOTHERM and T3Ster Help Imbera Develop New Integrated Module Board (IMB) Technology
Harris Corporation Optimizes Power-HFET Devices Using FLOTHERM	Thermacore Develops Cooling Solutions for High Power IGBTs and MOSFETs Using FLOTHERM	Intersil Gains Competitive Advantage Through Thermal Analysis
NVIDIA Optimizes Thermal Design of Graphics and Digital Media Processors Using FLOTHERM	Philips Use T3Ster to Develop Thermal Models of Chip Packages	Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications
Thermacore Develops Cooling Solutions for High Power IGBTs and MOSFETs Using FLOTHERM	Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: the C4/Ceramic-ball-Grid Array Interconnect Technology	Thermal Modelling and Experimental Characterization of the C4/Surface-Mount-Array Interconnect Technologies. IEEE, March 1995
Simple Temperature Measurements to Calibrate a CFD Model of CPGA/Heatsink Assemblies to Optimise Heatsink Performance	Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603 and PowerPC 604 RISC Microprocessor	The Development of Three-dimensional Computational-Fluid-Dynamics Models of PBGA Interconnect Technology for Moderate Air-cooled Systems
Experimental validation methods for thermal models	Thermal Evaluation of Standard and Power TQFP	The Development of Component-Level Thermal Compact Models of a C4/CBGA Interconnect Technology: The Motorola Power PC 603TM and Power PC 604TM RISC Microprocessors
Thermal Sub-Modeling of the Wirebonded Plastic Ball Grid Array Package	Issues in Validating Package Compact Thermal Models for Natural Convection Cooled Electronic Systems	Thermal Analysis of a Chip on Board (COB)
Development of Optimized Component-Level Thermal Behavioural Models of a Plastic-Ball-Grid Array Interconnect Technology For Air Cooled Applications	Compact Transient Thermal Models for the Polymer Stud Grid Array (PSGATM) Package	Creation and Validation of a Two-Resistor Compact Model of a Plastic Quad Flat Pack (PQFP) Using CFD
Numerical And Experimental Investigation Of A Tape Ball Grid Array Package	Thermal Modeling of Chip Scale Packages for Power Applications in Telecommunication Equipment	A Study of Compact Thermal Model Topologies in CFD for a Flip Chip Plastic Ball Grid Array Package
Power stage thermal design for DDX Amplifiers	The Extraction of a Two-Resistor/Two-Capacitor Model for Common IC Packages and their Implementation in CFD	Transient Performance of Common Modeling Assumptions Used in Detailed Thermal Package Models
Thermal Transient Modeling And Experimental Validation In The European Project PROFIT	Development of a New Improved High Performance Flip Chip BGA Package	Thermal Management of OSTAR® Projection Light Source
Streamlined Thermal Modeling	Intersil Gains Competitive Advantage Through Thermal Analysis	Graphics and Digital Media Processors Design
Overcoming Thermal Design Challenges to Produce Single-Chip Multimedia Solution	New Standards for Cleanroom Design	Flomerics Optimizes Thermal Solution for Caltech
FICO trim&form	Real-world power tests model FPGA’s thermal characteristics, EDN, April 2007	Building the System-in-Package Design Infrastructure
Coping with the New Crop of Hot Boards - PKG Magazine, August 2006	Taking the Heat Out Of Electronics - Desktop Engineering - July 2006	Flomerics and Gradient Design Automation Partner to Address Die-Level Thermal Issues
MicReD and Inphora launch TERALED for power LED-s	CADENCE/FLOMERICS Joint Solution helps CISCO bring Leading-Edge Switch to Market	Application of CFD Technology in Electronic Thermal Management
Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: C4/Ceramic-ball-grid Array Interconnect Technology	The Effect of Solder-Joint Temperature Rise on Ceramic-ball-grid Array to Board Interconnection Reliability: The Motorola PowerPC 603 and PowerPC 604 Interpack, March 95	Achieving Accurate Thermal Characterization Using a CFD Code-A Case Study of Plastic Packages
Thermal Characterization of Electronic Devices with Boundary Condition Independent Compact Models	Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling	Thermal Characterization of a 3-Dimensional Memory Module
Thermal Modelling of Ball-Grid-Array	Package Geometry Considerations in Thermal Compact Modeling Strategies	Thermal Characterisation of SSOP Packages
Thermal Design for Flip-Chip on Board in Natural Convection	Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling	Thermal Characterization of Cavity-Down TBGA (Tape Ball Grid Arrays) Package with FLOTHERM simulation
Thermal Strategy for Modeling The Wirebonded PBGA Packages	Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process	Design Characteristics of High Performance and Reduced Cost Chip Scale Package - µBGA
Comparison of Numerical Predictions and Experimental Measurements for the Transient Thermal Behavior of a Board-Mounted Electronic Component	Prediction of Thermal Performance of Flip Chip - Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Substrate Physical Design	Substantiation of Numerical Analysis Methodology for CPU Package With Non-Uniform Heat Dissipation and Heat Sink with Simplified Fin Modeling
A 3-D, Thermal Analysis of Microprocessors	Flomerics Presentation to JEDEC JC 15 Committee	Thermal Analysis of a Ceramic Microelectronics Package using FLOTHERM
Thermal Simulation Models for More Accurate Prediction of MOSFET Operating Temperature in Mobile Devices	Power Amplifier Design	What Do These World-Leading Electronic Products Have In Common?
PQFP + Heatsink = ?	Thermal Modeling of Ball Grid Arrays	Energy Fluxes from a Typical PQFP
The Effect of Card Mounting Alignment on Component Tests in a Wind Tunnel	Analysis of a Cleanroom area at SGS Thomson, Milan	Agilent Speeds Thermal Design for its Customers by Providing Compact Models
Vishay provides thermal models for optocouplers, SSRs	MicReD Offers TERALED Tester for Optical and Thermal LED Measurements	Imbera Optimizes Thermal Design Using Flotherm & T3Ster
Modelling to standards - Components in Electronics - April 2006	Streamlined Thermal Modeling - Advanced Packaging - March 2006	Enhance MOSFET Cooling with Thermal Vias - Power Electronics Technology - February 2006
Extension box for T3Ster	Thermal Modelling of the Pentium Processor	Thermal Modeling of high performance packages in Portable Computers
Celestica	Design-Based Thermal Performance Evaluation of a GaAs MMIC Device in a Plastic Ball Grid Array Package	Thermal analysis of a Telecommunications Multi-Service Access Functional Processor Module using CFD
FLO/STRESS: An Integrated Stress Solver For The CFD Tool FLOTHERM	An Integrated Approach to Flow, Thermal and Mechanical Modeling of Electronics Devices	Numerical Analysis of an Array of Ball Grid Components
Development, Validation, and Application of Thermal Modeling for a MCM Power Package	Micro Cooling Application on High Density Memory Module	Using Compact Models in the Early Thermal Design of Electronics
Thermal Management of Golden Dragon LED	An Investigation of Thermal Enhancement of MPM BGA Package	Thermal Analysis of a Pin Grid Array Package
FLOTHERM and T3Ster Help Imbera Develop New Integrated Module Board (IMB) Technology	Bottom-side cooling of LFPAK power MOSFETs	Speeding Thermal Design for Customers by Providing Compact Models
Speeding Thermal Design for Customers by Providing Compact Models	Reducing Developmend Time	FLOTHERM Helps Cool The Fastest Chip In The World
The Effect of Thermocouples on Measurements	Development, Validation and Application of a Thermal Model of a Plastic Quad Flat Pack	Compact Thermal Modeling: Impacting the industry, Advanced Packaging, April 2007
Flomerics Presentation at DesignCon: “EEs Should Be More Thermally Proactive”	Flomerics announces FLO/PCB for Allegro, Offering Bi-directional Interface to Cadence Allegro PCB Editor	Speed Thermal Design Using Compact Models - Desktop Engineering - October 2005
New USB interface for T3Ster	Modeling, Validation and Thermal Solution Design for a Flip-Chip Plastic Ball Grid Array Package	Thermal characteristics of complex systems
Using Cap-Integral Standoffs to Reduce Chip Hot-Spot Temperatures in Electronic Packages	Thermal Assessment of RF Integrated LTCC Front End Module (FEM)	Modelling the Effect of Temperature on Product Reliability
DirectFET™ Thermal Model and Rating Calculator	Extension of Air Cooling for High Power Processors	Combined Thermal and Thermomechanical Modeling for a Multi-Chip QFN Package with Metal-Core Printed Circuit Board
Creating and Solving CFD and FEA models	FLOTHERM Analysis Helps Cool The Fastest Chip In The World The 1GHz ALPHA Processor	Predicting Maximum Junction Temperatures and Thermal Performance in the Design and Development of ASICS
Parametric Study of Thermal Characteristics of Plastic Ball Grid Array by Computational Fluid Dynamics	FLO/STRESS: An Integrated Software Module to Predict Stress in Electronic Products	FLOTHERM Analysis Helps Cool The Fastest Chip In The World The 1GHz ALPHA Processor
Innovative Cleanroom Designs