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Home | Industries | Semiconductors | News   » Semiconductors Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50% » Cool running, New Electronics magazine (UK), 10 June 2008 » AMCC Uses Flotherm & Flopack to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance Dr. Thomas Zahner, Quality Manager ThermPaq from Flomerics Accelerates Thermal Characterization of Semiconductor Packages Flomerics’ MicReD Subsidiary to Play Major Role in Microelectronics Thermal Research Project “NANOPACK” New Standards, Techniques for Package Thermal Modeling, Semiconductor International, June 2007 AMCC Uses Flotherm & Flopack to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50% Cool running, New Electronics magazine (UK), 10 June 2008 Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System Hot Predictions, New Electronics, July 2007 Real-world power tests model FPGA’s thermal characteristics, EDN, April 2007 Building the System-in-Package Design Infrastructure Coping with the New Crop of Hot Boards - PKG Magazine, August 2006 Taking the Heat Out Of Electronics - Desktop Engineering - July 2006 Flomerics and Gradient Design Automation Partner to Address Die-Level Thermal Issues MicReD and Inphora launch TERALED for power LED-s CADENCE/FLOMERICS Joint Solution helps CISCO bring Leading-Edge Switch to Market MicReD Offers TERALED Tester for Optical and Thermal LED Measurements Imbera Optimizes Thermal Design Using Flotherm & T3Ster Modelling to standards - Components in Electronics - April 2006 Streamlined Thermal Modeling - Advanced Packaging - March 2006 Enhance MOSFET Cooling with Thermal Vias - Power Electronics Technology - February 2006 Extension box for T3Ster Compact Thermal Modeling: Impacting the industry, Advanced Packaging, April 2007 Flomerics Presentation at DesignCon: “EEs Should Be More Thermally Proactive” Flomerics announces FLO/PCB for Allegro, Offering Bi-directional Interface to Cadence Allegro PCB Editor Speed Thermal Design Using Compact Models - Desktop Engineering - October 2005 New USB interface for T3Ster Keeping Air Clean in Semiconductor Cleanrooms FLOTHERM Analysis Helps Cool The Fastest Chip In The World The 1GHz ALPHA Processor

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