Language   Chinese  French  German  Italian  Japanese  Korean  Russian  Spanish

Home | Industries | Semiconductors | Technical papers   » Semiconductors Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50% » Cool running, New Electronics magazine (UK), 10 June 2008 » AMCC Uses FloTHERM & FloTHERM.PACK to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance Dr. Thomas Zahner, Quality Manager The Development of Libraries of Physical Models of Electronic Components for an Integrated Design Environment Thermal limits of flip chip package-experimentally validated, CFD supported case studies A Comparative Study of the Performance of Compact Model Topologies and their Implementation in CFD for a Plastic Ball Grid Array DELPHI Compact Models Revolutionize Thermal Design An Experimental Assessment of Compact Thermal Models for the Prediction of Board-Mounted Electronic Component Heat Transfer Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: the C4/Ceramic-ball-Grid Array Interconnect Technology Thermal Modelling and Experimental Characterization of the C4/Surface-Mount-Array Interconnect Technologies. IEEE, March 1995 Simple Temperature Measurements to Calibrate a CFD Model of CPGA/Heatsink Assemblies to Optimise Heatsink Performance Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603 and PowerPC 604 RISC Microprocessor The Development of Three-dimensional Computational-Fluid-Dynamics Models of PBGA Interconnect Technology for Moderate Air-cooled Systems Experimental validation methods for thermal models Thermal Evaluation of Standard and Power TQFP The Development of Component-Level Thermal Compact Models of a C4/CBGA Interconnect Technology: The Motorola Power PC 603TM and Power PC 604TM RISC Microprocessors Thermal Sub-Modeling of the Wirebonded Plastic Ball Grid Array Package Issues in Validating Package Compact Thermal Models for Natural Convection Cooled Electronic Systems Thermal Analysis of a Chip on Board (COB) Development of Optimized Component-Level Thermal Behavioural Models of a Plastic-Ball-Grid Array Interconnect Technology For Air Cooled Applications Compact Transient Thermal Models for the Polymer Stud Grid Array (PSGATM) Package Creation and Validation of a Two-Resistor Compact Model of a Plastic Quad Flat Pack (PQFP) Using CFD Numerical And Experimental Investigation Of A Tape Ball Grid Array Package Thermal Modeling of Chip Scale Packages for Power Applications in Telecommunication Equipment A Study of Compact Thermal Model Topologies in CFD for a Flip Chip Plastic Ball Grid Array Package Power stage thermal design for DDX Amplifiers The Extraction of a Two-Resistor/Two-Capacitor Model for Common IC Packages and their Implementation in CFD Transient Performance of Common Modeling Assumptions Used in Detailed Thermal Package Models Thermal Transient Modeling And Experimental Validation In The European Project PROFIT Development of a New Improved High Performance Flip Chip BGA Package Application of CFD Technology in Electronic Thermal Management Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: C4/Ceramic-ball-grid Array Interconnect Technology The Effect of Solder-Joint Temperature Rise on Ceramic-ball-grid Array to Board Interconnection Reliability: The Motorola PowerPC 603 and PowerPC 604 Interpack, March 95 Achieving Accurate Thermal Characterization Using a CFD Code-A Case Study of Plastic Packages Thermal Characterization of Electronic Devices with Boundary Condition Independent Compact Models Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling Thermal Characterization of a 3-Dimensional Memory Module Thermal Modelling of Ball-Grid-Array Package Geometry Considerations in Thermal Compact Modeling Strategies Thermal Characterisation of SSOP Packages Thermal Design for Flip-Chip on Board in Natural Convection Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling Thermal Characterization of Cavity-Down TBGA (Tape Ball Grid Arrays) Package with FloTHERM simulation Thermal Strategy for Modeling The Wirebonded PBGA Packages Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process Design Characteristics of High Performance and Reduced Cost Chip Scale Package - µBGA Comparison of Numerical Predictions and Experimental Measurements for the Transient Thermal Behavior of a Board-Mounted Electronic Component Prediction of Thermal Performance of Flip Chip - Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Substrate Physical Design Substantiation of Numerical Analysis Methodology for CPU Package With Non-Uniform Heat Dissipation and Heat Sink with Simplified Fin Modeling A 3-D, Thermal Analysis of Microprocessors Flomerics Presentation to JEDEC JC 15 Committee Thermal Analysis of a Ceramic Microelectronics Package using FloTHERM Thermal Modelling of the Pentium Processor Thermal Modeling of high performance packages in Portable Computers Celestica Design-Based Thermal Performance Evaluation of a GaAs MMIC Device in a Plastic Ball Grid Array Package Thermal analysis of a Telecommunications Multi-Service Access Functional Processor Module using CFD FLO/STRESS: An Integrated Stress Solver For The CFD Tool FloTHERM An Integrated Approach to Flow, Thermal and Mechanical Modeling of Electronics Devices Numerical Analysis of an Array of Ball Grid Components Development, Validation, and Application of Thermal Modeling for a MCM Power Package Micro Cooling Application on High Density Memory Module Using Compact Models in the Early Thermal Design of Electronics Thermal Management of Golden Dragon LED An Investigation of Thermal Enhancement of MPM BGA Package Thermal Analysis of a Pin Grid Array Package Development, Validation and Application of a Thermal Model of a Plastic Quad Flat Pack Thermal measurement and modeling of multi-die packages (Therminic 2006) Electrical, thermal and optical characterization of power led assemblies (Therminic 2006) Thermal issues in stacked die packages (Semi-Therm 2005) Thermal transient characterization methodology for single-die and stacked structures (Semi-Therm 2005) Transient junction-to-case thermal resistance measurement methodology of high accuracy and high repeatability (Therminic 2004) Structure function evaluation of stacked dies (Semi-Therm 2004) A procedure to correct the error in the structure function based thermal measuring methods (Semi-Therm 2004) Electric and thermal transient effects in high power optical devices (Semi-Therm 2004) Evaluation issues of thermal measurements based on structure functions (Therminic 2003) Non-linearity issues in the dynamic compact model generation (Semi-Therm 2003) Dynamic compact models of cooling mounts for fast board level design (Semi-Therm 2003) Dynamic Temperature Analysis of Electronic Systems (Future Circuits International 2002) Dynamic temperature measurements (Electronics Cooling - May 2002) Modeling, Validation and Thermal Solution Design for a Flip-Chip Plastic Ball Grid Array Package Thermal characteristics of complex systems Using Cap-Integral Standoffs to Reduce Chip Hot-Spot Temperatures in Electronic Packages Thermal Assessment of RF Integrated LTCC Front End Module (FEM) Modelling the Effect of Temperature on Product Reliability DirectFET™ Thermal Model and Rating Calculator Extension of Air Cooling for High Power Processors Combined Thermal and Thermomechanical Modeling for a Multi-Chip QFN Package with Metal-Core Printed Circuit Board Parametric Study of Thermal Characteristics of Plastic Ball Grid Array by Computational Fluid Dynamics FLO/STRESS: An Integrated Software Module to Predict Stress in Electronic Products

	Home | Contact Us | Company | Products & Services | Industries | Applications | News | Events | Support Copyright © Mentor Graphics Corporation, Mechanical Analysis Division