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Home | Industries | Semiconductors | Testimonials   » Semiconductors Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50% » Cool running, New Electronics magazine (UK), 10 June 2008 » AMCC Uses FloTHERM & FloTHERM.PACK to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance Dr. Thomas Zahner, Quality Manager Agilent Speeds Thermal Design for its Customers by Providing Compact Models T3Ster Thermal Transient Tester Helps Design and Manufacture Better High-Performance Light-Emitting Diodes (LEDs) FloTHERM and T3Ster Help Imbera Develop New Integrated Module Board (IMB) Technology Harris Corporation Optimizes Power-HFET Devices Using FloTHERM Thermacore Develops Cooling Solutions for High Power IGBTs and MOSFETs Using FloTHERM Intersil Gains Competitive Advantage Through Thermal Analysis NVIDIA Optimizes Thermal Design of Graphics and Digital Media Processors Using FloTHERM Philips Use T3Ster to Develop Thermal Models of Chip Packages FICO trim&form FloTHERM Analysis Helps Cool The Fastest Chip In The World The 1GHz ALPHA Processor

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