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»AMCC Uses Flotherm & Flopack to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance
»Simulation Helps Solve Difficult Thermal Challenge in Tower Mounted Amplifier
»Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts
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Diane Busch, Mechanical Design Engineer
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Some existing Telecommunications customers

3 COM
ADC Telecommunications
Alcatel Bell
Alcatel SEL
Alcatel Submarine
BT
Cisco
Ericsson
Fujitsu
General Instruments
Intel
Hughes Network Systems
Italtel
Lucent Technologies
Motorola
NEC
Nokia
Nortel
Philips PKI
Qualcomm
Rockwell International
Samsung
Tellabs
Telrad

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