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Home | Industries | Telecommunications | Electronics Cooling   » Telecommunications Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » AMCC Uses Flotherm & Flopack to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance » Simulation Helps Solve Difficult Thermal Challenge in Tower Mounted Amplifier » Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts Diane Busch, Mechanical Design Engineer Tekelec Incorporates Emerging Requirements for Telecom Switching Equipment Using FLOTHERM Alcatel Solves Thermal Issues Early with FLOTHERM AMCC Uses Flotherm & Flopack to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance Thermal Design Process At Teradyne's Industrial Consumer Division Analysis of a Heat Pipe Assisted Heat Sink Modelling of IC/Packages based on thermal characteristics Thermal design for Fujitsu FCS-1000 outdoor telecommunications cabinet Thermal design of telecommunications mini cabinet Cooling design of a sealed Optical Network Unit (ONU) enclosure Thermal Analysis of MAXITE Micro Base Station Heat Spreading and Conduction in Compressed Heatsinks Modeling Large-Scale Electronic Systems Using Computational Fluid Dynamics Through a“Zoom-in” Approach Investigating Limits in Naturally Cooled Systems Using FLOTHERM Optimizing Next-Generation Signaling and Switching Equipment PCB Design Significant Savings in Development of New ADSL Telecommunications Enclosure Simulation Helps Solve Difficult Thermal Challenge in Tower Mounted Amplifier Hot Predictions, New Electronics, July 2007 Ascom Use FLOTHERM to Perfect Novel Heat Sink Design & Make Telecom Power Supply Products Smaller Joint Flomerics/Cadence solution helps Cisco bring next-generation switch to market Tekelec Incorporates Emerging Requirements for Telecom Switching Equipment Using FLOTHERM Alcatel Solves Thermal Issues Early with FLOTHERM Flomerics Releases Flotherm Version 7 with Unrivalled Design Optimization Capability Fan Swirl and Planar Resistances Don't Mix Thermal Analysis of a Telecommunications Rack System Application of a Numerical Tool for Thermal Evaluation of Printed Boards in Communication Systems The optimum selection of the Broadband Network Unit cabinet walls thickness. Thermal Modelling of sealed equipment enclosures in outdoor environments The Performance of Displacement-Cooling Systems in Telecom Applications Supporting experiments for CFD based thermal design of telecommunications equipment System Level Thermal Analysis of a Telecommunication High Density Echo Canceller Cabinet Significance of Radiation in Telecommunications Racks 3D Model to Analyse the Thermal Behaviour of a Digital Rectifier The Significance of Radiation in a Central Office Chassis: A Case Study Simulation of Steady State and Transient Solar Loading of Outdoor Fiber Optic Enclosure Optimising Environmental Stress Screening using FLOTHERM Radio Circuit Board Simulation Vs Thermal Test Speeding Thermal Design for Customers by Providing Compact Models Cooling Design of a Sealed Optical Networking Unit Natural Convection in a Telecommunications Exchange System Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts Flomerics Optimizes Thermal Solution for Caltech Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts Pipinghot Networks Knocks 3 Months off Development Time Using Flotherm Coping with the New Crop of Hot Boards - PKG Magazine, August 2006 Taking the Heat Out Of Electronics - Desktop Engineering - July 2006 CADENCE/FLOMERICS Joint Solution helps CISCO bring Leading-Edge Switch to Market Application of CFD Technique in Thermal Design of a Telecommunication Base Station Thermal analysis of telephony and video equipment Software Simulation of a Double-Sided PCB CFD System Level Modeling of a Large Telecommunications Enclosure Modeling in Flotherm the effects of airflow impedance produced by several blowers working together on the same plane Thermal Simulations Applied to Embedded Cryptographic Coprocessor Devices Application of Computational Fluid Dynamics (CFD) Technique in Thermal and Airflow Improvements of TM's Type A Outdoor Cabinets, Battery Compartment Use of FLOTHERM within PTT Telecom Software Simulation of the thermal behaviour of Telecommunication Equipment using FLOTHERM The Use of FLOTHERM During the Development of a New Telecommunication Equipment Air Flow Modelling Requirements Nearby Fans Thermal Simulation Using Flomerics' Software Thermal Simulation Models for More Accurate Prediction of MOSFET Operating Temperature in Mobile Devices Power Amplifier Design Cambridge Broadband Optimizes VectaStar 3500 Using Flomerics’ Thermal Design Services Motorola's Handheld Portable Technology - Validating CFD Technology Optimizing the Cooling in a Telecommunications Facility Thermal Modeling of Ball Grid Arrays Modelling to standards - Components in Electronics - April 2006 Streamlined Thermal Modeling - Advanced Packaging - March 2006 Enhance MOSFET Cooling with Thermal Vias - Power Electronics Technology - February 2006 Thermal design tool provides link to Allegro PCB Editor - EE Times - February 2006 How to Improve the Cooling in Schroff - Standard Cases Using FLOTHERM Experimental and computational studies on the thermal management of electronics enclosures using natural convection Using FLOTHERM on thermal design of an optical transmission A Proposed Technique for the Modeling of Radial Blowers in Flotherm A Comparison of CFD Analysis and Experiments: The Case for Heat Pipe in RF Power Amplifier Applications Thermal analysis of a Telecommunications Multi-Service Access Functional Processor Module using CFD Heat Sink Optimization for Optical Transponders A Passive Solution to a Difficult Data Center Environmental Problem Refrigeration Assisted Spot Cooling of a High Heat Density Data Center System Cooling of Outdoor Wi-Fi Antenna Application of the FLOTHERM Thermal Analysis Software to Telecommunication Equipment RFMD Optimizes High Power Device Testing Chamber with FLOTHERM FLOTHERM and T3Ster Help Imbera Develop New Integrated Module Board (IMB) Technology Addressing the Unique Thermal Management Challenges of Mobile Devices Optimizing the Thermal Performance of Server Processing Blade Reducing Developmend Time Thermal Simulation of Telecom Racks Speeding Thermal Design for Customers by Providing Compact Models Reducing Developmend Time Using FLOTHERM to Perfect Novel Heat Sink Design Flomerics Presentation at DesignCon: “EEs Should Be More Thermally Proactive” Speed Thermal Design Using Compact Models - Desktop Engineering - October 2005 Thermal design of an Optical Network Unit (ONU) to be implemented into an outdoor enclosure Thermal Simulation of Telecom Racks Thermal Challenges of a Compact Power Entry Module Working with Flomerics' Thermal Design team pays off One Cool Machine Choosing component locations for optimal cooling - Electronic Products - May 2006 The use of FLOTHERM at Ericsson Radio Systems - Past and Future Thermal Experiment and Analysis of Small Desktop Enclosure Indoor Base Station Space Model Vs Flotherm Simulation of High Efficiency Heatsinks for rectifiers in the Telecommunication Industry- Why a heat sink manufacturer decided to choose Flotherm

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