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Home | Industries | Telecommunications | News   » Telecommunications Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » AMCC Uses Flotherm & Flopack to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance » Simulation Helps Solve Difficult Thermal Challenge in Tower Mounted Amplifier » Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts Diane Busch, Mechanical Design Engineer AMCC Uses Flotherm & Flopack to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance Simulation Helps Solve Difficult Thermal Challenge in Tower Mounted Amplifier Hot Predictions, New Electronics, July 2007 Flomerics Releases Flotherm Version 7 with Unrivalled Design Optimization Capability Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts Coping with the New Crop of Hot Boards - PKG Magazine, August 2006 Taking the Heat Out Of Electronics - Desktop Engineering - July 2006 "CFD Software Helps in Redesign of Telecom HVAC, Protecting Electronics ", AEC News, June 2006. Web Article on FLOVENT Application by ANCIS Inc CADENCE/FLOMERICS Joint Solution helps CISCO bring Leading-Edge Switch to Market Modelling to standards - Components in Electronics - April 2006 Streamlined Thermal Modeling - Advanced Packaging - March 2006 Enhance MOSFET Cooling with Thermal Vias - Power Electronics Technology - February 2006 Thermal design tool provides link to Allegro PCB Editor - EE Times - February 2006 "FLOVENT Helps BT Win Environmental Award", Flomerics News Release Flomerics Presentation at DesignCon: “EEs Should Be More Thermally Proactive” Speed Thermal Design Using Compact Models - Desktop Engineering - October 2005 Starting a Data Center Choosing component locations for optimal cooling - Electronic Products - May 2006

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