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Home | Industries | Test & Measurement | News   » Test & Measurement Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » Flomerics’ MicReD Subsidiary to Play Major Role in Microelectronics Thermal Research Project “NANOPACK” » Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System » Hot Predictions, New Electronics, July 2007 ir John H.J. Janssen, Manager Virtual Prototyping Flomerics’ MicReD Subsidiary to Play Major Role in Microelectronics Thermal Research Project “NANOPACK” Actaris Designs Novel Gas Meters using EFD.Lab Flow Simulation Software Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System Hot Predictions, New Electronics, July 2007 Imbera Optimizes Thermal Design Using Flotherm & T3Ster Extension box for T3Ster Anritsu Company Saves 4-6 Week PCB Re-Spin by Thermal Modeling in Early Design Stage New USB interface for T3Ster

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