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Home | Industries | Test & Measurement | Technical papers   » Test & Measurement Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » Flomerics’ MicReD Subsidiary to Play Major Role in Microelectronics Thermal Research Project “NANOPACK” » Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System » Hot Predictions, New Electronics, July 2007 ir John H.J. Janssen, Manager Virtual Prototyping EFD Meshing Technology White Paper Simulation-based Design Optimization Methodologies applied to CFD An Experimental Assessment of Compact Thermal Models for the Prediction of Board-Mounted Electronic Component Heat Transfer Simple Temperature Measurements to Calibrate a CFD Model of CPGA/Heatsink Assemblies to Optimise Heatsink Performance Thermal Performance of Air-Cooled Hybrid Heat Sinks for a low Velocity Environment Experimental validation methods for thermal models Development of Optimized Component-Level Thermal Behavioural Models of a Plastic-Ball-Grid Array Interconnect Technology For Air Cooled Applications Thermal Simulations Applied to Embedded Cryptographic Coprocessor Devices Thermal Transient Modeling And Experimental Validation In The European Project PROFIT A Modified Pressure Drop Analytical Method for Heat Sink Thermal Laboratory Design and Measurements Modelling of axial fans for electronic equipment Design and testing of a forced-convection loop to ensure rapid heating of an oil tank Thermal Modeling and Simulation of Transmission Equipment Computational and Experimental Studies for Radio Thermal Management Application of CFD Technique in Thermal Design of a Telecommunication Base Station Modeling in Flotherm the effects of airflow impedance produced by several blowers working together on the same plane Thermal Simulations Applied to Embedded Cryptographic Coprocessor Devices Thermal Impedance Measurements of Junction-Down Mounted Single-Side Contact Laser Diodes Optimization of TAB Inner Lead Bonding Process Applications of Electronics Compact Models to the Prediction of Transient Heat Transfer in Tactical Missiles Numerical and physical simulation hand in hand to determine the thermal conductivity of a PCB Thermal analysis of a Telecommunications Multi-Service Access Functional Processor Module using CFD Numerical Analysis of an Array of Ball Grid Components Comparative Study of Power Module Technologies by means of Thermal Simulation Tools System Cooling of Outdoor Wi-Fi Antenna Thermal Analysis of a Pin Grid Array Package Natural convection experiments with cuboids and cylinders of equal area Thermal characterisation and modelling of multi chip modules using standard electronic packages Natural convection heat transfer of metal cuboid flush mounted in a horizontal plate An Airspeed Measurement Technique for Accurate Correlation to CFD Simulation Results Direct Torque Controlled Induction Motor Drive Utilized in an Electrical Vehicle Competitive Analysis: 9 Slot CompactPCI® Development Chassis Thermal Experiment and Analysis of Small Desktop Enclosure

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