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Home | Industries | Test & Measurement | Testimonials   » Test & Measurement Home   » Demo/Info request » Electronics Cooling » Fluid Dynamics   » Customers   » News   » Technical papers   » Testimonials » Flomerics’ MicReD Subsidiary to Play Major Role in Microelectronics Thermal Research Project “NANOPACK” » Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System » Hot Predictions, New Electronics, July 2007 ir John H.J. Janssen, Manager Virtual Prototyping Philips Use T3Ster to Develop Thermal Models of Chip Packages Novel Approach Offers Significant Improvements in Thermal Interface Material Performance

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