Our Products and Services

Flomerics provides simulation software tools and services - primarily to the electronics industry - to improve and accelerate the physical design process. Our software enables engineers to predict the behavior of a proposed design prior to the build and test phase - this is often called "virtual-prototyping".  Our software integrates analysis and design enabling engineers to test  and validate their ideas as they are being developed.  Our software breaks down communication barriers between electrical and mechanical engineers enabling fast resolution of conflicting requirements that are traditionally difficult to resolve.  Finally, our software is designed for specific applications.  This approach – called “Design-Class Analysis - provides the highest levels of specialization and automation available from analysis software and is key to unlocking productivity for experts and  non-experts alike.  Customers achieve significant cost savings and design cycle compression through using our software as point solutions or as an Integrated Analysis Environment.  Our client list includes virtually all of the major electronics companies in the world.

As well as providing software, Flomerics offers a rapid-response consultancy service from industry specialists for companies who wish to outsource some or all of their design, simulation and test work. 

EFD.Lab is a fully-featured general-purpose 3D fluid flow and heat transfer analysis software. EFD stands for Engineering Fluid Dynamics - so named because the software is designed for use by engineers and is radically different from traditional Computational Fluid Dynamics (CFD) software which has evolved for specialists. EFD completely removes the complexities of numerical/mathematical schemes and computational mesh creation from the user, allowing engineers to focus on optimizing their designs in the shortest possible time. EFD is tightly integrated with major MCAD systems including Pro/ENGINEER, SolidWorks, and CATIAv5.

FLOTHERM - our first and most successful analysis software tool – is the undisputed worldwide market leader in thermal analysis of electronic equipment. Heat affects the reliability and lifetime of electronic equipment, and as processing speeds rise, functional density increases, and equipment becomes smaller, thermal problems intensify. Through techniques of computational fluid dynamics (CFD) FLOTHERM predicts airflow and temperatures throughout the equipment. This enables the engineer to identify the source of any over-heating, and to devise and test appropriate design modifications quickly and easily. Typical applications range from computers and telecommunications equipment to less obvious examples such as the control electronics for lifts and domestic hi-fi equipment. Important recent enhancements to FLOTHERM are:

• Integration with FLO/EMC, enabling thermal and EMC design constraints to be satisfied simultaneously
• Automatic Sequential Optimization
• Multi-level localized grid

FLOTHERM is the most established of our products and, together with associated modules and consultancy services, continues to generate the bulk of our revenues.

FLO/EMC is a powerful computational tool for analyzing electromagnetic radiation in and around electronic system enclosures, including the effects of cables, seams and apertures. FLO/EMC solves the Maxwell equations using the Transmission Line Matrix (TLM) method, which has major efficiency advantages over other methods, and provides a broadband solution in a single calculation.

FLO/EMC addresses the problem of electromagnetic radiation and interference in electronic equipment – often referred to as "Electro-Magnetic Compatibility" (EMC). The same design trends that are driving the thermal problem - faster processing and increased functional density - also produce increased electromagnetic emissions. These emissions can interfere with, and affect the performance of, other equipment; hence, for example, the restrictions on using laptop computers and mobile phones on aircraft. Because of this, EMC is governed by stringent EU and US FCC regulations limiting the permitted levels of emissions, and all electrical equipment must be tested and certified before it can be sold. This makes the EMC issue one of the most critical problems facing the electronics industry today.

FLO/EMC is highly complementary to FLOTHERM, because there is usually a compromise required between thermal and EMC design constraints. The most common way to reduce radiated emissions is to shield the equipment in some way - but this also prevents the heat from getting out and so creates a thermal problem. The combination of FLOTHERM and FLO/EMC enables designers to analyze and optimize these competing design constraints quickly and efficiently, leading to dramatic reductions in testing costs and time-to-market.

FLO/PCB is a new software tool for accelerating the conceptual design of high-density printed-circuit boards. FLO/PCB improves communication between product marketing, electrical and mechanical engineers, and enables teams of engineers to work together and consider layout and thermal issues as the functional description is being defined.

FLOPACK is a sophisticated web-based product that creates thermal models of integrated circuit (IC) packages and associated parts. The user inputs the major design parameters via the Internet, and the resulting models are imported directly into FLOTHERM.

FLO/MCAD enables parts and assemblies from Mechanical Computer Aided Design (MCAD) software (e.g. Pro/Engineer, CATIA, SolidWorks, Autocad) to be transferred easily and rapidly to and from FLOTHERM, FLO/EMC or FLOVENT for analysis. FLO/MCAD is more than just an interface program - it intelligently filters the geometrical data for a particular part or assembly and creates a simplified "thermal equivalent" – thus dramatically speeding up the analysis process.

www.SmartParts3D.com is a web-based library containing ready-to-run, validated models of common parts such as fans, heat sinks, enclosures and IC packages from various vendors. SmartParts3D.com saves a great deal of engineering time by eliminating the need to construct models of such parts from scratch.

Flomerics Design Services team provide a quick-response, low-cost consultancy service for customers who wish to outsource their design, simulation and/or testing. Our Design Services cover all aspects of Flomerics operations, including thermal and electromagnetic design for electronic equipment, and heating/ventilation design for buildings.

FLOVENT is a powerful Computational Fluid Dynamics (CFD) software that predicts 3D airflow, heat transfer and contamination distribution in and around buildings of all types and sizes. FLOVENT uses the same software structure and analysis engine as FLOTHERM, but the user interface is tailored specifically for building design. FLOVENT's fast and easy-to-use menu system is designed specifically for the design and optimization of heating, ventilating and air-conditioning (HVAC) systems. Typical applications include data centers and IT rooms, clean rooms, auditoriums, shopping malls, office buildings, underground car parks, passenger comfort in vehicles, airport terminals, etc, air quality and contaminant control in laboratories, research facilities, and hospitals.

Microstripes is a well-established 3D electromagnetic simulator, which also uses the Transmission Line Matrix (TLM) method to solve Maxwell’s equations. Whilst FLO/EMC is primarily concerned with containing unintentional radiation, Microstripes is concerned with directing intentional radiation. It is primarily used in the design of microwave devices and to optimize antenna design.

MicReD (Microelectronics Research and Development) started as a spin-off company created by researchers in the Department of Electron Devices in Budapest University of Technology & Economics (BUTE).  MicReD is now part of Flomerics Group, and focuses on the thermal characterization of integrated circuit packages, MCMs and printed circuit boards. MicReD provides different software and hardware tools in this field as well as measurement services, consulting or contract research. MicReD’s “flagship” product is the T3Ster® (pronounced "Trister") – advanced transient temperature measurement equipment enabling rapid and extremely accurate thermal characterization of IC packages. MicReD’s most recent project is TERALED which provides advanced measurement solutions for power LEDs.