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Home | Products & Services | Electronics Cooling | Technical papers   » Electronics Cooling (Home)   » Demo/Info Request   » Customers   » Events   » Evaluating Thermal Analysis Software   » News   » Technical papers   » Testimonials   » Why Invest in Thermal Simulation? Liquid Cooling of Bright Leds for Automotive Applications Thermal Design Process At Teradyne's Industrial Consumer Division Analysis of a Heat Pipe Assisted Heat Sink The Development of Libraries of Physical Models of Electronic Components for an Integrated Design Environment Modelling of IC/Packages based on thermal characteristics Thermal limits of flip chip package-experimentally validated, CFD supported case studies Thermal design for Fujitsu FCS-1000 outdoor telecommunications cabinet Thermal design of telecommunications mini cabinet Cooling design of a sealed Optical Network Unit (ONU) enclosure Using CFD to Predict the Flow Behaviour of the UHP Lamp. Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications Thermal Analysis of MAXITE Micro Base Station A Comparative Study of the Performance of Compact Model Topologies and their Implementation in CFD for a Plastic Ball Grid Array Simplified Analytical Models for Forced Convection Heat Transfer from Cuboids of Arbitrary Shape Heat Spreading and Conduction in Compressed Heatsinks DELPHI Compact Models Revolutionize Thermal Design Modeling Large-Scale Electronic Systems Using Computational Fluid Dynamics Through a“Zoom-in” Approach Investigating Limits in Naturally Cooled Systems Using FLOTHERM Simulation-based Design Optimization Methodologies applied to CFD An Experimental Assessment of Compact Thermal Models for the Prediction of Board-Mounted Electronic Component Heat Transfer Turbulence Modelling and it's Impact on CFD Predictions for Cooling of Electronic Components Cooling System for a Ka Band Transmit Antenna Array Fan Swirl and Planar Resistances Don't Mix Thermal Analysis of a Telecommunications Rack System Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: the C4/Ceramic-ball-Grid Array Interconnect Technology A Study on the Optimal Design Technique of Cabinet Ventilation System by Neural Network Estimating the Influence of PCB and Component Thermal conductivity on component temperatures in natural convection Cooling of a CPU Board with Two Lines of Four Microprocessors in the Mean Flow Numerical and Experimental Study of Forced Convection Over Power Supply Heat Sinks Application of a Numerical Tool for Thermal Evaluation of Printed Boards in Communication Systems Thermal Modelling and Experimental Characterization of the C4/Surface-Mount-Array Interconnect Technologies. IEEE, March 1995 Simple Temperature Measurements to Calibrate a CFD Model of CPGA/Heatsink Assemblies to Optimise Heatsink Performance Development of a high performance low pressure drop water cold-plate for electronic packaging applications Thermal Performance of Air-Cooled Hybrid Heat Sinks for a low Velocity Environment Numerical Simuation of Natural Convection Heat Transfer in a Television Set Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603 and PowerPC 604 RISC Microprocessor The Development of Three-dimensional Computational-Fluid-Dynamics Models of PBGA Interconnect Technology for Moderate Air-cooled Systems Experimental validation methods for thermal models CFD modelling for component-level and board-level thermal analysis; a PBGA interconnect technology for low-velocity air-cooling Thermal Evaluation of a Power PC 620 Multi-Processor Computer Thermal Evaluation of Standard and Power TQFP The Development of Component-Level Thermal Compact Models of a C4/CBGA Interconnect Technology: The Motorola Power PC 603TM and Power PC 604TM RISC Microprocessors Thermal Analysis of a PC chassis The optimum selection of the Broadband Network Unit cabinet walls thickness. Thermal Model of a Bench-Top Microprocessor-Based Unit System-level thermal model of an audio set Thermal Modelling of sealed equipment enclosures in outdoor environments Thermal Analysis of an integrated motor and finned housing Thermal Analysis and reliability prediction for airborne digital audio system The Performance of Displacement-Cooling Systems in Telecom Applications Thermal Sub-Modeling of the Wirebonded Plastic Ball Grid Array Package Supporting experiments for CFD based thermal design of telecommunications equipment Issues in Validating Package Compact Thermal Models for Natural Convection Cooled Electronic Systems Thermal Analysis of a Chip on Board (COB) Development of Optimized Component-Level Thermal Behavioural Models of a Plastic-Ball-Grid Array Interconnect Technology For Air Cooled Applications Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications Concurrent Design of a PowerPCtm Microcomputer: EDA and CFD Tool Interoperability Flotherm Thermal Analysis of Heat Sink Design for Pentium Processor in Tape Carrier Packages System Level Thermal Analysis of a Telecommunication High Density Echo Canceller Cabinet Development and Application of Compact Models of Packages Based on DELPHI Methodology Compact Transient Thermal Models for the Polymer Stud Grid Array (PSGATM) Package System-Level Thermal Modeling of a Compact, High-Efficiency Cooling Device for the PA8000 Processor Optimizing the Integration of a Electronics System into an Existing Enclosure Using CFD Modeling Techniques Significance of Radiation in Telecommunications Racks Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in Natural Convection Environments Thermal Design and Evaluation Methods for Heat Sinks 3D Model to Analyse the Thermal Behaviour of a Digital Rectifier The Significance of Radiation in a Central Office Chassis: A Case Study Validating Numerical Predictions of Component Thermal Interaction on Electronic Pronted Circuit Boards In Forced Convection Airflows By Experimental Analysis An Optical And Numerical Investigation Of The Thermal Interaction Between An Isothermal Cylinder And Its Isothermal Enclosure Creation and Validation of a Two-Resistor Compact Model of a Plastic Quad Flat Pack (PQFP) Using CFD Modeling Phase Change Material in Electronics using CFD – A Case Study Numerical And Experimental Investigation Of A Tape Ball Grid Array Package Thermal Modeling of Chip Scale Packages for Power Applications in Telecommunication Equipment A Study of Compact Thermal Model Topologies in CFD for a Flip Chip Plastic Ball Grid Array Package Simulation of Steady State and Transient Solar Loading of Outdoor Fiber Optic Enclosure Thermal Simulations Applied to Embedded Cryptographic Coprocessor Devices Power stage thermal design for DDX Amplifiers Thermal Performance Comparison of a Microprocessor using Phase Change Materials in Various Configurations Thermal Design Methodology for Electronic Systems The Extraction of a Two-Resistor/Two-Capacitor Model for Common IC Packages and their Implementation in CFD Transient Performance of Common Modeling Assumptions Used in Detailed Thermal Package Models Thermal Characterization of High Speed DDR Devices in System Environments Thermal Transient Modeling And Experimental Validation In The European Project PROFIT Thermal Optimization of Electronic Systems Using Design of Experiments Based on Numerical Inputs New Correlations Between Electrical Current and Temperature Rise in PCB Traces Numerical Investigation of Enclosure Effects on Spot Cooling Devices A Modified Pressure Drop Analytical Method for Heat Sink Thermal Evaluation of Power Amplifier Modules and RF Packages in a Handheld Communicator System Development of a New Improved High Performance Flip Chip BGA Package Simulation-Based Design Optimization Methodologies Applied to CFD The effect of fan swirl to PSU cooling System Level Thermal Simulation of a Computer Chassis using FLOTHERM Software Optimising Environmental Stress Screening using FLOTHERM Application of CFD Technique in Thermal Design of a Telecommunication Base Station Heat Transfer Co-efficients in FLOTHERM Application of CFD Technology in Electronic Thermal Management Siemens Nixdorf Informationssystme AG Business Unit Personal Computer Thermal Laboratory Design and Measurements Using Computational Fluid Dynamics to design Heat Transfer Enhancement methods for cooling channels Effect of Circuit Board Parameters on Thermal Performance of Electronic Components in Natural Convection Cooling Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: C4/Ceramic-ball-grid Array Interconnect Technology The Effect of Solder-Joint Temperature Rise on Ceramic-ball-grid Array to Board Interconnection Reliability: The Motorola PowerPC 603 and PowerPC 604 Interpack, March 95 Thermal characterisation of electronic devices by means of improved boundary condition Independent compact models Modelling of axial fans for electronic equipment A case study for treating FLOTHERM as a piece of thermal test equipment Thermal analysis of telephony and video equipment Cooling component modelling Achieving Accurate Thermal Characterization Using a CFD Code-A Case Study of Plastic Packages Thermal Characterization of Electronic Devices with Boundary Condition Independent Compact Models Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling Thermal Characterization of a 3-Dimensional Memory Module Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process Thermal Modelling of Ball-Grid-Array Surface-Mount Heat Sink Thermal Analysis Thermal characterisation of a power module Design and testing of a forced-convection loop to ensure rapid heating of an oil tank Delphi project. A status report on the EC-funded project to develop libraries of thermal models and define new standards for thermal characterisation of electronic parts Display Panel Thermal Design and Analysis Thermal Modeling and Simulation of Transmission Equipment Package Geometry Considerations in Thermal Compact Modeling Strategies Thermal Characterization and Modelling of EFD Transformers, Applying DELPHI Methodology Thermal Characterisation of SSOP Packages Computational and Experimental Studies for Radio Thermal Management Thermal Design for Flip-Chip on Board in Natural Convection Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling Thermal Characterization of Cavity-Down TBGA (Tape Ball Grid Arrays) Package with FLOTHERM simulation Software Simulation of a Double-Sided PCB CFD Modeling of a Therma-Base(TM) Heat Sink Thermal Strategy for Modeling The Wirebonded PBGA Packages A Thermal Design Methodology For Electronic Systems - Part I: Board And Component Level A Thermal Design Methodology For Electronic Systems - Part II: System Level Design and Thermal Analysis of the SunRay1 Network Terminal Using FLOTHERM and the Command Center to Exploit the Principle of Superposition CFD System Level Modeling of a Large Telecommunications Enclosure Modeling in Flotherm the effects of airflow impedance produced by several blowers working together on the same plane Thermal Simulations Applied to Embedded Cryptographic Coprocessor Devices Design Characteristics of High Performance and Reduced Cost Chip Scale Package - µBGA A Design Approach to Thermal Characterization of Forced Convection Systems using Superposition in CFD Comparison of Numerical Predictions and Experimental Measurements for the Transient Thermal Behavior of a Board-Mounted Electronic Component Prediction of Thermal Performance of Flip Chip - Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Substrate Physical Design Integration of Flotherm Within HS Marston Aerospace Ltd Linearized Superposition using CFD for Thermal and Power Characterization of Electronic Equipment with Significant Thermal Radiation and Natural Convection Thermal Modeling and Measurement of Large High Power Silicon Devices With Asymmetric Power Distribution Thermal Analysis of Sealed Enclosure for over the Ocean Application Thermal Management of Portable Micro Fuel Cell Stacks Recent Progress in Compact Thermal Models Numerical Study of Heat Pipe Application in Heat Recovery Systems Modeling of Natural Convection in Electronic Enclosures Comparative Analysis of Heat Sink Pressure Drop Using Different Methodologies Generation of Subassembly Compact Half Models through Experiment and Modeling for Hard Drive Thermal Characterization Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future Requirements Thermal Analysis and Modeling of Diode Array Integrated with Directional Liquid-Cooled Heat Sink Thermal Performance Evaluation for a Microelectronics Motor Control System Incorporating Dynamic Heat Sources Substantiation of Numerical Analysis Methodology for CPU Package With Non-Uniform Heat Dissipation and Heat Sink with Simplified Fin Modeling Application of Low-Reynolds Number Turbulent Flow Models to the Prediction of Electronic Component Heat Transfer Thermal Impedance Measurements of Junction-Down Mounted Single-Side Contact Laser Diodes Application of Computational Fluid Dynamics (CFD) Technique in Thermal and Airflow Improvements of TM's Type A Outdoor Cabinets, Battery Compartment Simulation of PCB's using FLOTHERM Use of FLOTHERM within PTT Telecom Software Simulation of the thermal behaviour of Telecommunication Equipment using FLOTHERM Flomerics Presentation to JEDEC JC 15 Committee A 3-D, Thermal Analysis of Microprocessors The Use of FLOTHERM During the Development of a New Telecommunication Equipment Thermal Modelling of a Hewlett Packard Workstation from Concept to Finished Product Thermal Analysis of a Ceramic Microelectronics Package using FLOTHERM Solving the Thermal Design Concerns of a Low-Voltage Power Supply using CFD Modeling Air Flow Modelling Requirements Nearby Fans Thermal Parametric Analysis of an Underground Battery Vault Two Thermal Simulation Approaches for Electronic Equipment Thermal analysis of LED package using FLOTHERM, Microelectronics International Journal, 2006 Case Study of Thermal Management for Mobile Multi-Media (MMM) Applications Numerical and physical simulation hand in hand to determine the thermal conductivity of a PCB Celestica Thermal Modelling of the Pentium Processor FLOTHERM Simulations of Consumer Electronics Products during the Development Process at ITCL - Philips About the Validation of CFD Analysis of Electronic Systems How to Improve the Cooling in Schroff - Standard Cases Using FLOTHERM FLOTHERM Libraries Presentation and Demonstration Board Level Thermal Analysis with AutoTherm A Numerical study of Buoyancy-Induced Forced Convection on an Isolated Vertical Plate Application of a CFD Tool for System-level Thermal Simulation Thermal Modeling of high performance packages in Portable Computers Development, Validation and Application of a Thermal Model of a Plastic Quad Flat Pack Experimental and computational studies on the thermal management of electronics enclosures using natural convection The use of a high-level CFD code in engineering education Thermal modelling and analysis of an aircraft electronics navigation unit under high-altitude conditions Using FLOTHERM on thermal design of an optical transmission Optimization of TAB Inner Lead Bonding Process DELPHI, A status report on the European-funded project for the development of libraries and physical models for an Integrated Design Environment Final report to SEMITHERM XIII on the European-Funded Project DELPHI - the Development of Libraries and Physical Models for an Intergrated Design Environment Cooling analysis of Digital's ATMswitch 900 Applications of Electronics Compact Models to the Prediction of Transient Heat Transfer in Tactical Missiles A Proposed Technique for the Modeling of Radial Blowers in Flotherm A Comparison of CFD Analysis and Experiments: The Case for Heat Pipe in RF Power Amplifier Applications Thermal-Electrical Modeling of Electrical Subsystems Design-Based Thermal Performance Evaluation of a GaAs MMIC Device in a Plastic Ball Grid Array Package Thermal analysis of a Telecommunications Multi-Service Access Functional Processor Module using CFD FLO/STRESS: An Integrated Stress Solver For The CFD Tool FLOTHERM An Integrated Approach to Flow, Thermal and Mechanical Modeling of Electronics Devices Getting the Most Out of Your CFD Program Numerical Analysis of an Array of Ball Grid Components (255 KB) A Numerical Study of the Thermal Performance of an Impingement Heat Sink - Fin Shape Optimization Heat Sink Optimization for Optical Transponders Development, Validation, and Application of Thermal Modeling for a MCM Power Package Micro Cooling Application on High Density Memory Module Using Compact Models in the Early Thermal Design of Electronics Thermal Management of Golden Dragon LED Thermal Interaction of an Array of Flip Chip Components A Passive Solution to a Difficult Data Center Environmental Problem Refrigeration Assisted Spot Cooling of a High Heat Density Data Center Comparative Study of Power Module Technologies by means of Thermal Simulation Tools An Investigation of Thermal Enhancement of MPM BGA Package System Cooling of Outdoor Wi-Fi Antenna Application of the FLOTHERM Thermal Analysis Software to Telecommunication Equipment Electronic Cooling at IBM Endicott Conjugate Heat Transfer of One Component on a PCB in a Small Enclosure Thermal Modelling of a Military Laser System Thermal Design of the Silicon Graphics Indigo 2 Workstation using Physical and Computational Modelling Numerical Simulation Methodology Used for Thermal Design of a Minicomputer NOKIAs Use of FLOTHERM Thermal Analysis of a Pin Grid Array Package High performance/volume ratio CPU Cooler Design with FLOTHERM simulation Thermal Management of Palmtop Projector products Natural convection experiments with cuboids and cylinders of equal area Thermal characterisation and modelling of multi chip modules using standard electronic packages Natural convection heat transfer of metal cuboid flush mounted in a horizontal plate