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Ultra Electronics
Flomerics Releases FloTHERM.PCB Version 4.1
"Avoiding meltdown", Machine Design, August 2007
PCB Design
Ensuring Reliability of Automotive Control System
Webinar: PCB Thermal Simulation - The State of the Art
World Electronic Thermal Management Market to Witness Healthy Growth and Reach $5.8 Billion by 2010, According to New Report by Global Industry Analysts, Inc.
"Modeling Copper Concentration Improves PCB Thermal Simulation Accuracy", Byron Blackmore, Flomerics Inc.
"Improved Thermal Design of PCBs Using Surface Optimization Modeling", Printed Circuit Design & Manufacture, August 2007
Hot Predictions, New Electronics, July 2007
Joint Flomerics/Cadence solution helps Cisco bring next-generation switch to market
Combination of FloTHERM.PCB and FloTHERM reduces prototyping costs
Radio Circuit Board Simulation Vs Thermal Test
Cooling Design of a Sealed Optical Networking Unit
"Model PCB Thermals with Greater Accuracy", Power Electronics Technology magazine, Feb 2008
Aberdeen Group Survey Shows Flomerics’ Customers Get Products to Market Faster and With Fewer Respins
Flomerics’ FloTHERM.PCB Thermal Software is Finalist in IEC’s 2007 DesignVision Awards
Modeling Thermal Properties of Stacked-die Packages - Advanced Packaging, September 2006
Coping with the New Crop of Hot Boards - PKG Magazine, August 2006
The basics of fluid flow and heat transfer and how they can be applied to electronics cooling applications - Printed Circuit Design & Manufacture - July 2006
Taking the Heat Out Of Electronics - Desktop Engineering - July 2006
Flomerics and Gradient Design Automation Partner to Address Die-Level Thermal Issues
CADENCE/Flomerics Joint Solution helps CISCO bring Leading-Edge Switch to Market
Thermal Simulation Using Flomerics' Software
PQFP + Heatsink = ?
Motorola's Handheld Portable Technology - Validating CFD Technology
Solving Thermal Design Problems in the Pentium Microprocessor Series
Thermal Modeling of Ball Grid Arrays
Energy Fluxes from a Typical PQFP
The Effect of Card Mounting Alignment on Component Tests in a Wind Tunnel
Simulating Pb-Free Reflow - Circuits Assembly, October 2006
Modelling to standards - Components in Electronics - April 2006
Streamlined Thermal Modeling - Advanced Packaging - March 2006
Enhance MOSFET Cooling with Thermal Vias - Power Electronics Technology - February 2006
Thermal design tool provides link to Allegro PCB Editor - EE Times - February 2006
NVIDIA
®
Uses Compact Thermal Models to Speed Design of NVIDIA nForce
TM
4-based Systems
Speeding Thermal Design for Customers by Providing Compact Models
Speeding Thermal Design for Customers by Providing Compact Models
Compact Thermal Modeling: Impacting the industry, Advanced Packaging, April 2007
Concurrent Engineering Helps Meet Thermal Challenges of High Speed Design
FloTHERM.PCB Software Saves 4-6 Week PCB Re-Spin - Circuits Assembley - June 2006
Anritsu Company Saves 4-6 Week PCB Re-Spin by Thermal Modeling in Early Design Stage
Flomerics Presentation at DesignCon: “EEs Should Be More Thermally Proactive”
Flomerics announces FloTHERM.PCB for Allegro, Offering Bi-directional Interface to Cadence Allegro PCB Editor
Galileo Avionica Standardizes on Thermal Simulation Software from Flomerics
Speed Thermal Design Using Compact Models - Desktop Engineering - October 2005
Flomerics Establishes Thermal Test Lab in North America After Acquisition of MicReD
Choosing component locations for optimal cooling - Electronic Products - May 2006
Flomerics is pleased to announce the release of FloTHERM.PACK 6.1, with enhanced performance, support for even more package families, and other exciting new features
Flomerics Reports Sales Up 24%, Profits Up 30%, and Claims World’s Fastest-Growing CFD Software
Prof. Marta Rencz Elected Manager of the Modelling and Simulation Workpackage of EU-funded “Network of Excellence”
IEC Announces 2007 DesignVision Finalists Recognizing Best Tools and Products in Semiconductor Industry, PCBCafe, January 2007
Parametric Simulation Helps Optimize Antenna Performance - Microwaves & RF - November 2006
New Flo/PCB Software Helps Solve Lead-Free Manufacturing Problems
Give PC board CAD its due - EE Times - January 2006
Thermal Analyzer Works At Front of Process - Desktop Engineering - January 2006
Solving Thermal Issues Earlier In Updated Board Designs - OnBoard Technology - October 2005
Downstream Thermal Implications Of Component Assembly - OnBoard Technology - September 2005
Testing T3Ster - CAD User - August 2005
New ideas run thermal and emission simulations together - Machine Design - June 2005
Get On Board: SolvingTHERMAL PROBLEMS at Board Level - Printed Circuit Design & Manufacture - June 2005
Flomerics Acquires Microelectronics Research & Development Limited (MicReD)
Latest Release of FloTHERM.PCB Features Significant Enhancements
New Thermal Modeling Standards Emerge
Flomerics Endorses MICRED'S Equipment and Software for IC Device Characterisation
Application Showcases Downstream Thermal Implications of Component Placement
FloTHERM.PCB Version2 Speeds Collaboration between Electronic and Mechanical Engineers
Tool Improves Collaboration Between Electrical and Mechanical Engineers - EDN - May 2004
Upfront Analysis Spots Thermal Problems in PC-Board Placement - EDN Europe - May 2004
FloTHERM.PCB Enables Multi-team Cooperation - Embedded.com - May 2004
Tool Improves Collaboration Between Electrical and Mechanical Engineers - reed-electronics.com - May 2004
David Chadwick reviews the new FloTHERM.PCB software from Flomerics for streamlining PCB design - CAD User - April/May 2004
Printdesign som en del af en Storre Helhed - Aktuel Elektronik - April 2004
Alla Kan Kolla Varmen - Elektronik Tidningen - March 2004
Thermal Design Without Calling in a Specialist - Electronics Weekly - March 2004
New product, FloTHERM.PCB, brings EE's and ME's together for collaborative conceptual design of high-density PCB's
Relative Metrics' Library Of Thermal Data Now Offered By Flomerics For Use With FloTHERM
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