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Home | Products & Services | FloTHERM | Applications   » FloTHERM Home   » Demo/Info Request   » About FloTHERM   » Applications   » Customer Testimonials   » Events   » News   » Support   » System Requirements   » Version 7 Highlights   » Why Invest in Thermal Simulation?   » Evaluating Thermal Analysis Software FloTHERM Achieves 95% Customer Satisfaction in New Survey Ultra Electronics FloTHERM.PACKSIM from Flomerics Accelerates Thermal Characterization of Semiconductor Packages System-in-Package Technologies? - The need for DfX Hewlett-Packard Keeps Processors Cool New Standards, Techniques for Package Thermal Modeling, Semiconductor International, June 2007 Liquid Cooling of Bright Leds for Automotive Applications FloTHERM Enables Faster Design Process Agilent Speeds Thermal Design for its Customers by Providing Compact Models FloTHERM Helps Tecnobit Ensure Reliability of Avionics Equipment Tekelec Incorporates Emerging Requirements for Telecom Switching Equipment Using FloTHERM One Cool Machine Alcatel Solves Thermal Issues Early with FloTHERM Certifying Design of Video Control Cabinet for 747 In-Flight Entertainment System Voxdale and Conquest Racing in Top Gear for 2009 Thermal Simulation Helps Design New Telecom Platform That Delivers 40Gbps Bandwidth Thermal Simulation Helps Design New Telecom Platform that Delivers 40Gbps Bandwidth AMCC Uses FloTHERM & FloTHERM.PACK to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance Webinar: Critical Succss Factors in Chassis Design "Avoiding meltdown", Machine Design, August 2007 The Changing Role of CFD in Electronics Thermal Design PCB Design Valeo Uses FloTHERM Thermal Simulation Software to Ensure Reliability of Automotive Control System Pressure Drop Coefficients for Thin Perforated Plates Thermal Design Process At Teradyne's Industrial Consumer Division Analysis of a Heat Pipe Assisted Heat Sink The Development of Libraries of Physical Models of Electronic Components for an Integrated Design Environment Thermal limits of flip chip package-experimentally validated, CFD supported case studies Thermal design for Fujitsu FCS-1000 outdoor telecommunications cabinet Thermal design of telecommunications mini cabinet Cooling design of a sealed Optical Network Unit (ONU) enclosure Using CFD to Predict the Flow Behaviour of the UHP Lamp. Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications Thermal Analysis of MAXITE Micro Base Station Simplified Analytical Models for Forced Convection Heat Transfer from Cuboids of Arbitrary Shape Heat Spreading and Conduction in Compressed Heatsinks DELPHI Compact Models Revolutionize Thermal Design Modeling Large-Scale Electronic Systems Using Computational Fluid Dynamics Through a“Zoom-in” Approach Investigating Limits in Naturally Cooled Systems Using FloTHERM Simulation-based Design Optimization Methodologies applied to CFD An Experimental Assessment of Compact Thermal Models for the Prediction of Board-Mounted Electronic Component Heat Transfer Turbulence Modelling and it's Impact on CFD Predictions for Cooling of Electronic Components Optimizing Next-Generation Signaling and Switching Equipment Ensuring Reliability of Automotive Control System Significant Savings in Development of New ADSL Telecommunications Enclosure Optimizing Thermal Performance of a Dictionary Size Multimedia Projector Thermal Simulation Helps Redback Networks Creat First Million-Subscriber Platform for Triple-Play Broadband, Phone and TV Services Flow Simulation Improves Photovoltaic Solar Performance Webinar: PCB Thermal Simulation - The State of the Art "Solving System Level Thermal Management Challenges in LED Systems", Printed-Circuit Design & Manufacture magazine, July 2008 Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50% Webinar: Thermal Investigations on Micro Fuel Cells FloTHERM Helps Redback Networks on Triple-Play Platform, Printed-Circuit Design & Fab magazine, June 2008 Webinar: Anti-Moisture Methodology for Electronics Enclosures in Harsh Storage Environments Webinar: Integrated Design for High Reliability Power Electronics Cool running, New Electronics magazine (UK), 10 June 2008 Webinar: Achieving High Functional Density Electronics: The ADEPT-SiP Project Thermal Simulation Speeds Design of Versatile Vertical/Horizontal Heatsink Webinar: OneBTS Base Station Thermal Simulation vs Thermal Test Results Simulation Helps Solve Difficult Thermal Challenge in Tower Mounted Amplifier Webinar: Automating Semiconductor Package Thermal Characterization and Design World Electronic Thermal Management Market to Witness Healthy Growth and Reach $5.8 Billion by 2010, According to New Report by Global Industry Analysts, Inc. "Modeling Copper Concentration Improves PCB Thermal Simulation Accuracy", Byron Blackmore, Flomerics Inc. "Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System" Trevor Moody, Antares Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System "Software takes the heat off electronics", Machine Design magazine, 12 Sept 2007 "Improved Thermal Design of PCBs Using Surface Optimization Modeling", Printed Circuit Design & Manufacture, August 2007 Why a Thermal Standard Is Not a Horse - The World According to the JEDEC JC15 Committee Hot Predictions, New Electronics, July 2007 Intersil Gains Competitive Advantage Through Thermal Analysis NVIDIA Optimizes Thermal Design of Graphics and Digital Media Processors Using FloTHERM Hewlett-Packard Keeps Processors Cool with FloTHERM Ascom Use FloTHERM to Perfect Novel Heat Sink Design & Make Telecom Power Supply Products Smaller FloTHERM helps keep in-car DVD players cool Joint Flomerics/Cadence solution helps Cisco bring next-generation switch to market FloTHERM Helps Tecnobit Ensure Reliability of Avionics Equipment Thermacore Optimizes Thermal Performance of Automotive Intercooler using FloTHERM Eaton Hits Thermal Targets on First Prototype with FloTHERM Tekelec Incorporates Emerging Requirements for Telecom Switching Equipment Using FloTHERM RFMD Optimizes High Power Device Testing Chamber with FloTHERM FloTHERM and T3Ster Help Imbera Develop New Integrated Module Board (IMB) Technology Harris Corporation Optimizes Power-HFET Devices Using FloTHERM Thermacore Develops Cooling Solutions for High Power IGBTs and MOSFETs Using FloTHERM One Cool Machine Combination of FloTHERM.PCB and FloTHERM reduces prototyping costs Alcatel Solves Thermal Issues Early with FloTHERM Thales Avionics Uses Thermal Design Services from Flomerics to Certify Design of Video Control Cabinet for 747 In-Flight Entertainment System Cooling System for a Ka Band Transmit Antenna Array Flomerics Releases FloTHERM Version 7 with Unrivalled Design Optimization Capability Thermal Simulation Helps Cool Aircraft Electronic Equipment at 50,000 Feet ALSTOM Slashes Development Costs For Variable Speed Drives Using FloTHERM Thermal Analysis Software Fan Swirl and Planar Resistances Don't Mix Thermal Analysis of a Telecommunications Rack System Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: the C4/Ceramic-ball-Grid Array Interconnect Technology A Study on the Optimal Design Technique of Cabinet Ventilation System by Neural Network Estimating the Influence of PCB and Component Thermal conductivity on component temperatures in natural convection Cooling of a CPU Board with Two Lines of Four Microprocessors in the Mean Flow Numerical and Experimental Study of Forced Convection Over Power Supply Heat Sinks Application of a Numerical Tool for Thermal Evaluation of Printed Boards in Communication Systems Thermal Modelling and Experimental Characterization of the C4/Surface-Mount-Array Interconnect Technologies. IEEE, March 1995 Simple Temperature Measurements to Calibrate a CFD Model of CPGA/Heatsink Assemblies to Optimise Heatsink Performance Development of a high performance low pressure drop water cold-plate for electronic packaging applications Thermal Performance of Air-Cooled Hybrid Heat Sinks for a low Velocity Environment Numerical Simuation of Natural Convection Heat Transfer in a Television Set Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603 and PowerPC 604 RISC Microprocessor The Development of Three-dimensional Computational-Fluid-Dynamics Models of PBGA Interconnect Technology for Moderate Air-cooled Systems Experimental validation methods for thermal models CFD modelling for component-level and board-level thermal analysis; a PBGA interconnect technology for low-velocity air-cooling Thermal Evaluation of a Power PC 620 Multi-Processor Computer Thermal Evaluation of Standard and Power TQFP The Development of Component-Level Thermal Compact Models of a C4/CBGA Interconnect Technology: The Motorola Power PC 603TM and Power PC 604TM RISC Microprocessors Thermal Analysis of a PC chassis The optimum selection of the Broadband Network Unit cabinet walls thickness. Thermal Model of a Bench-Top Microprocessor-Based Unit System-level thermal model of an audio set Thermal Modelling of sealed equipment enclosures in outdoor environments Thermal Analysis of an integrated motor and finned housing Thermal Analysis and reliability prediction for airborne digital audio system The Performance of Displacement-Cooling Systems in Telecom Applications Thermal Sub-Modeling of the Wirebonded Plastic Ball Grid Array Package Supporting experiments for CFD based thermal design of telecommunications equipment Issues in Validating Package Compact Thermal Models for Natural Convection Cooled Electronic Systems Thermal Analysis of a Chip on Board (COB) Development of Optimized Component-Level Thermal Behavioural Models of a Plastic-Ball-Grid Array Interconnect Technology For Air Cooled Applications Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications Concurrent Design of a PowerPCtm Microcomputer: EDA and CFD Tool Interoperability FloTHERM Thermal Analysis of Heat Sink Design for Pentium Processor in Tape Carrier Packages System Level Thermal Analysis of a Telecommunication High Density Echo Canceller Cabinet Development and Application of Compact Models of Packages Based on DELPHI Methodology Compact Transient Thermal Models for the Polymer Stud Grid Array (PSGATM) Package System-Level Thermal Modeling of a Compact, High-Efficiency Cooling Device for the PA8000 Processor Optimizing the Integration of a Electronics System into an Existing Enclosure Using CFD Modeling Techniques Significance of Radiation in Telecommunications Racks Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in Natural Convection Environments Thermal Design and Evaluation Methods for Heat Sinks 3D Model to Analyse the Thermal Behaviour of a Digital Rectifier The Significance of Radiation in a Central Office Chassis: A Case Study Validating Numerical Predictions of Component Thermal Interaction on Electronic Pronted Circuit Boards In Forced Convection Airflows By Experimental Analysis An Optical And Numerical Investigation Of The Thermal Interaction Between An Isothermal Cylinder And Its Isothermal Enclosure Creation and Validation of a Two-Resistor Compact Model of a Plastic Quad Flat Pack (PQFP) Using CFD Modeling Phase Change Material in Electronics using CFD – A Case Study Numerical And Experimental Investigation Of A Tape Ball Grid Array Package Thermal Modeling of Chip Scale Packages for Power Applications in Telecommunication Equipment A Study of Compact Thermal Model Topologies in CFD for a Flip Chip Plastic Ball Grid Array Package Simulation of Steady State and Transient Solar Loading of Outdoor Fiber Optic Enclosure Thermal Simulations Applied to Embedded Cryptographic Coprocessor Devices Power stage thermal design for DDX Amplifiers Thermal Performance Comparison of a Microprocessor using Phase Change Materials in Various Configurations Thermal Design Methodology for Electronic Systems The Extraction of a Two-Resistor/Two-Capacitor Model for Common IC Packages and their Implementation in CFD Transient Performance of Common Modeling Assumptions Used in Detailed Thermal Package Models Thermal Characterization of High Speed DDR Devices in System Environments Thermal Transient Modeling And Experimental Validation In The European Project PROFIT Thermal Optimization of Electronic Systems Using Design of Experiments Based on Numerical Inputs New Correlations Between Electrical Current and Temperature Rise in PCB Traces Numerical Investigation of Enclosure Effects on Spot Cooling Devices A Modified Pressure Drop Analytical Method for Heat Sink Thermal Evaluation of Power Amplifier Modules and RF Packages in a Handheld Communicator System Development of a New Improved High Performance Flip Chip BGA Package Simulation-Based Design Optimization Methodologies Applied to CFD The effect of fan swirl to PSU cooling System Level Thermal Simulation of a Computer Chassis using FloTHERM Software Optimising Environmental Stress Screening using FloTHERM Thermal Management of OSTAR® Projection Light Source Thermal Simulation Speeds Smaller, Quieter BTX PCs to Market Thermacore Develops Cooling Solutions for High Power IGBTs and MOSFETs Using FloTHERM Streamlined Thermal Modeling Graphics and Digital Media Processors Design Radio Circuit Board Simulation Vs Thermal Test Overcoming Thermal Design Challenges to Produce Single-Chip Multimedia Solution Speeding Thermal Design for Customers by Providing Compact Models Cooling Design of a Sealed Optical Networking Unit Natural Convection in a Telecommunications Exchange System Intersil Gains Competitive Advantage Through Thermal Analysis Thermal Simulation Reduces IC Cost by Comparing Flip-Chip/Wire Bond Thermal Performance "Reducing Thermal Risk is a Key Factor for any Programs Success", Military Embedded Systems, March 2008 "Model PCB Thermals with Greater Accuracy", Power Electronics Technology magazine, Feb 2008 Thermal Simulation Validates Motor Design and Reduces Heatsink Weight Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts Flomerics Optimizes Thermal Solution for Caltech Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts "Keeping Cool at 50,000ft", Machine Design, Oct 2007 Pipinghot Networks Knocks 3 Months off Development Time Using FloTHERM Real-world power tests model FPGA’s thermal characteristics, EDN, April 2007 Aberdeen Group Survey Shows Flomerics’ Customers Get Products to Market Faster and With Fewer Respins Modeling Thermal Properties of Stacked-die Packages - Advanced Packaging, September 2006 The basics of fluid flow and heat transfer and how they can be applied to electronics cooling applications - Printed Circuit Design & Manufacture - July 2006 Taking the Heat Out Of Electronics - Desktop Engineering - July 2006 Flomerics and Gradient Design Automation Partner to Address Die-Level Thermal Issues Thermal Simulation Speeds Quieter, Smaller BTX PCs to Market CADENCE/Flomerics Joint Solution helps CISCO bring Leading-Edge Switch to Market Application of CFD Technique in Thermal Design of a Telecommunication Base Station Heat Transfer Co-efficients in FloTHERM Application of CFD Technology in Electronic Thermal Management Siemens Nixdorf Informationssystme AG Business Unit Personal Computer Thermal Laboratory Design and Measurements Using Computational Fluid Dynamics to design Heat Transfer Enhancement methods for cooling channels Effect of Circuit Board Parameters on Thermal Performance of Electronic Components in Natural Convection Cooling Motorola's PowerPC 603 and PowerPC 604 RISC Microprocessor: C4/Ceramic-ball-grid Array Interconnect Technology The Effect of Solder-Joint Temperature Rise on Ceramic-ball-grid Array to Board Interconnection Reliability: The Motorola PowerPC 603 and PowerPC 604 Interpack, March 95 Thermal characterisation of electronic devices by means of improved boundary condition Independent compact models Modelling of axial fans for electronic equipment A case study for treating FloTHERM as a piece of thermal test equipment Thermal analysis of telephony and video equipment Cooling component modelling Achieving Accurate Thermal Characterization Using a CFD Code-A Case Study of Plastic Packages Thermal Characterization of Electronic Devices with Boundary Condition Independent Compact Models Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling Thermal Characterization of a 3-Dimensional Memory Module Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process Thermal Modelling of Ball-Grid-Array Surface-Mount Heat Sink Thermal Analysis Thermal characterisation of a power module Design and testing of a forced-convection loop to ensure rapid heating of an oil tank Delphi project. A status report on the EC-funded project to develop libraries of thermal models and define new standards for thermal characterisation of electronic parts Display Panel Thermal Design and Analysis Thermal Modeling and Simulation of Transmission Equipment Package Geometry Considerations in Thermal Compact Modeling Strategies Thermal Characterization and Modelling of EFD Transformers, Applying DELPHI Methodology Thermal Characterisation of SSOP Packages Computational and Experimental Studies for Radio Thermal Management Thermal Design for Flip-Chip on Board in Natural Convection Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling Thermal Characterization of Cavity-Down TBGA (Tape Ball Grid Arrays) Package with FloTHERM simulation Software Simulation of a Double-Sided PCB CFD Modeling of a Therma-Base(TM) Heat Sink Thermal Strategy for Modeling The Wirebonded PBGA Packages A Thermal Design Methodology For Electronic Systems - Part I: Board And Component Level A Thermal Design Methodology For Electronic Systems - Part II: System Level Design and Thermal Analysis of the SunRay1 Network Terminal Using FloTHERM and the Command Center to Exploit the Principle of Superposition CFD System Level Modeling of a Large Telecommunications Enclosure Modeling in FloTHERM the effects of airflow impedance produced by several blowers working together on the same plane Thermal Simulations Applied to Embedded Cryptographic Coprocessor Devices Design Characteristics of High Performance and Reduced Cost Chip Scale Package - µBGA A Design Approach to Thermal Characterization of Forced Convection Systems using Superposition in CFD Comparison of Numerical Predictions and Experimental Measurements for the Transient Thermal Behavior of a Board-Mounted Electronic Component Prediction of Thermal Performance of Flip Chip - Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Substrate Physical Design Integration of FloTHERM Within HS Marston Aerospace Ltd Linearized Superposition using CFD for Thermal and Power Characterization of Electronic Equipment with Significant Thermal Radiation and Natural Convection