Homepage
Home | Products & Services | FloTHERM | News
  » FloTHERM Home
  » Demo/Info Request
  » About FloTHERM
  » Applications
  » Customer Testimonials
  » Events
  » News
  » Support
  » System Requirements
  » Version 7 Highlights
  » Why Invest in Thermal
Simulation?

  » Evaluating Thermal
Analysis Software



FloTHERM Achieves 95% Customer Satisfaction in New Survey



FloTHERM.PACKSIM from Flomerics Accelerates Thermal Characterization of Semiconductor Packages


New Standards, Techniques for Package Thermal Modeling, Semiconductor International, June 2007



Voxdale and Conquest Racing in Top Gear for 2009



Thermal Simulation Helps Design New Telecom Platform That Delivers 40Gbps Bandwidth



AMCC Uses FloTHERM & FloTHERM.PACK to Reduce IC Package Development Cost by Comparing Flip-Chip/Wire Bond Thermal Performance


"Avoiding meltdown", Machine Design, August 2007



Valeo Uses FloTHERM Thermal Simulation Software to Ensure Reliability of Automotive Control System


"Solving System Level Thermal Management Challenges in LED Systems", Printed-Circuit Design & Manufacture magazine, July 2008



Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50%


FloTHERM Helps Redback Networks on Triple-Play Platform, Printed-Circuit Design & Fab magazine, June 2008


Cool running, New Electronics magazine (UK), 10 June 2008



Thermal Simulation Speeds Design of Versatile Vertical/Horizontal Heatsink



Simulation Helps Solve Difficult Thermal Challenge in Tower Mounted Amplifier


World Electronic Thermal Management Market to Witness Healthy Growth and Reach $5.8 Billion by 2010, According to New Report by Global Industry Analysts, Inc.



Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System


"Software takes the heat off electronics", Machine Design magazine, 12 Sept 2007


"Improved Thermal Design of PCBs Using Surface Optimization Modeling", Printed Circuit Design & Manufacture, August 2007


Hot Predictions, New Electronics, July 2007



Flomerics Releases FloTHERM Version 7 with Unrivalled Design Optimization Capability



Thermal Simulation Helps Cool Aircraft Electronic Equipment at 50,000 Feet



ALSTOM Slashes Development Costs For Variable Speed Drives Using FloTHERM Thermal Analysis Software


"Reducing Thermal Risk is a Key Factor for any Programs Success", Military Embedded Systems, March 2008


"Model PCB Thermals with Greater Accuracy", Power Electronics Technology magazine, Feb 2008



Thermal Simulation Validates Motor Design and Reduces Heatsink Weight



Thermal Simulation Helps Overcome Challenge of 14U Chassis with 1700 Watts


"Keeping Cool at 50,000ft", Machine Design, Oct 2007


Real-world power tests model FPGA’s thermal characteristics, EDN, April 2007



Aberdeen Group Survey Shows Flomerics’ Customers Get Products to Market Faster and With Fewer Respins


Modeling Thermal Properties of Stacked-die Packages - Advanced Packaging, September 2006


The basics of fluid flow and heat transfer and how they can be applied to electronics cooling applications - Printed Circuit Design & Manufacture - July 2006


Taking the Heat Out Of Electronics - Desktop Engineering - July 2006



Flomerics and Gradient Design Automation Partner to Address Die-Level Thermal Issues



Thermal Simulation Speeds Quieter, Smaller BTX PCs to Market


CADENCE/Flomerics Joint Solution helps CISCO bring Leading-Edge Switch to Market


"Thermal Simulation Helps Cool Aircraft Electronic Equipment at 50,000 Feet", Airforce Technology magazine, April 2007



Flomerics Technologists’ Paper Selected as Best of 2005 by IEEE Publication



Imbera Optimizes Thermal Design Using FloTHERM & T3Ster


Modelling to standards - Components in Electronics - April 2006


Enhance MOSFET Cooling with Thermal Vias - Power Electronics Technology - February 2006



NVIDIA® Uses Compact Thermal Models to Speed Design of NVIDIA nForceTM 4-based Systems



Flomerics Adds Thermal Models of Sunon “Mighty Mini” Fans to SmartParts3D Website


Compact Thermal Modeling: Impacting the industry, Advanced Packaging, April 2007



Anritsu Company Saves 4-6 Week PCB Re-Spin by Thermal Modeling in Early Design Stage



Flomerics Presentation at DesignCon: “EEs Should Be More Thermally Proactive”



Galileo Avionica Standardizes on Thermal Simulation Software from Flomerics


Speed Thermal Design Using Compact Models - Desktop Engineering - October 2005


Playing it cool, CIE, January 2007



Flomerics Establishes Thermal Test Lab in North America After Acquisition of MicReD



'SEED' Project Signals Major Advance in Thermal Modeling of Electronic Equipment



Delphi Project Partners Announce New, Highly Accurate Method for Thermal Characterisation of Electronic Components



Simulation Saves Solectron 3 Months and $40,000 in Cooling Outdoor Antenna



FloTHERM Thermal Management Software Helps Philips To Create The First



Flomerics Reports Sales Up 24%, Profits Up 30%, and Claims World’s Fastest-Growing CFD Software



FloTHERM Analysis Helps Cool The Fastest Chip In The World The 1GHz ALPHA Processor


Parametric Simulation Helps Optimize Antenna Performance - Microwaves & RF - November 2006


Imbera optimizes thermal design using Flomerics software - Portable Design - May 2006


Testing T3Ster - CAD User - August 2005



Thermal Simulation Helps Silicon Graphics Keep Its New Supercomputer Cool



SmartParts3D Models of Optoelectronic Couplers Speed Customers’ Designs



Simulation Helps Overcome Thermal Challenges in Metro Networking System


New ideas run thermal and emission simulations together - Machine Design - June 2005


Get On Board: SolvingTHERMAL PROBLEMS at Board Level - Printed Circuit Design & Manufacture - June 2005


Philips to offer thermal models of its power semiconductor - Electronic Engineering Times - June 2005


Philips offers customers thermal models of its power semiconductors - Philips Semiconducters - June 2005



Simulation Helps Solve EMC Problem in High-Speed Buses



Flomerics Incorporates Thermal Models of Sunon Fans on SmartParts3D Website



Flomerics Acquires Microelectronics Research & Development Limited (MicReD)



Latest Release of FloTHERM.PCB Features Significant Enhancements



New Thermal Modeling Standards Emerge



Simulation Used to Optimize Heat Sink Design for Optical Transmitter



Flomerics Endorses MICRED'S Equipment and Software for IC Device Characterisation


One Cool Machine - Design News - February 2005



Application Showcases Downstream Thermal Implications of Component Placement



Stokes Research Institute Releases Guide to Evaluating Thermal Analysis Software



FloTHERM.PACK Version 5 Supports New JEDEC Thermal Testing Standard



FloTHERM.PCB Version2 Speeds Collaboration between Electronic and Mechanical Engineers



Thermal Models for Philips' Power Semiconductors Now Available on SmartParts3D.com



FloTHERM Version 5 Provides Usability, CAD Import, Compact Modeling Improvements



Flomerics Improves "Intelligent Integration" Between Thermal Analysis and MCAD Software



Staktek Uses FloTHERM Thermal Simulation Software to Optimize Memory Stack Design



Simulation Helps Hybricon Design 8U Chassis That Dissipates 30% More Power


Mezzanine Card Assemblies: Where is All That Cooling Air Going? - COTS Journal Online - July 2004


Thermal Simulation Optimizes Chassis Cooling - COTS Journal Online - July 2004


Flomerics Launches New Release Of FLO/EMC Simulation Software - RF Globalnet - June2004


Website Adds 48 Fan Thermal Models - ept.ca - June 2004



Flomerics Adds 48 Thermal Models of JMC Products Fans to SmartParts3D Website


Upfront Analysis Spots Thermal Problems in PC-Board Placement - EDN Europe - May 2004


FloTHERM.PCB Enables Multi-team Cooperation - Embedded.com - May 2004


Tool Improves Collaboration Between Electrical and Mechanical Engineers - reed-electronics.com - May 2004



Flomerics Certifies Design - Aerospace Engineering - April 2004


David Chadwick reviews the new FloTHERM.PCB software from Flomerics for streamlining PCB design - CAD User - April/May 2004


Printdesign som en del af en Storre Helhed - Aktuel Elektronik - April 2004



Thermal Design Without Calling in a Specialist - Electronics Weekly - March 2004



New product, FloTHERM.PCB, brings EE's and ME's together for collaborative conceptual design of high-density PCB's



UbiNetics and Flomerics overcome thermal design challenges to produce tester for 3G mobile communications networks



Compatibilita' Elettromagnetica Pronta All'Uso



Frontier Silicon, Atlantic Technology and Flomerics Overcome Thermal Design Challenges to Produce Single-Chip Multimedia Solution


Hot, Not Bothered - CAD User - October/November 2003


How hot is that chip? - Desktop Engineering - October 2003



Flomerics Develops "Intelligent Integration" Between Thermal Analysis and MCAD Software



AMI Semiconductor Uses FloTHERM and FloTHERM.PACK to Predict Maximum Junction Temperatures and Thermal Performance in the Design and Development of ASICS


Where Does Thermal Design Start - Embedded Systems Europe - June 2003



Designer Database - Electronic Design Europe - May 2003



www.smartparts3d.com Free Web-Based Design Database Accelerates the Design Process for Engineers



Don't Get Your Fingers Burnt - New Electronics - March 2003



MaXXan Systems Uses Thermal Design Services from Flomerics to Ensure Thermal Integrity for The SG100 NAS System



Airspan Miniaturizes and Enhances Performance of DSL Base Station Using FloTHERM



Flomerics Confirms No. 1 Position in Electronics Thermal Analysis



Thales Avionics Uses Thermal Design Services from Flomerics to Certify Design of Video Control Cabinet for 747 In-Flight Entertainment System



Cooking Breakfast on your PC!



FloTHERM - Upfront CFD for the Masses - MCAD - March 2002



Flomerics Helps ASML Ensure Thermal Integrity of Industry's First Lithography System for 300mm Wafer Processing With 100nm Resolution



Thermal modelling heats up for the mainstream - EDN Europe - June 2002



Delphi and Profit Aim to Standardise Compact Models - EDN Europe - June 2002



Validating and Optimising Design - Asia - Pacific Engineer - June 2002



Thermal Performance Optimised - Components in Electronics - May 2002



EM Analysis Tool Enhanced - Components in Electronics - May 2002



Potted Power Poser - New Electronics - May 2002



Flomerics Further Enhances Productivity of EMC Design Engineers with FLO/EMC Version 1.2



Finding Where the Heatsink Stalls - Mechanical Engineering April 2002



The Application of Computational Electromagnetics to EMC - EMC Compliance Journal May 2002



Egenera Turns to Flomerics to Optimize the Thermal Performance of its Server Processing Blade Months Before the Technology is Available for Testing



Flomerics' WEBTHERM™ Recognised in Two Major Industry Awards as Core Element of Webench - Winner of EDN's



Flomerics Group PLC - Final Results



Multipoint Broadband Wireless Access - Designengineer April 2002



Flomerics Further Enhances Productivity of IC Design Engineers with FloTHERM.PACK Version 3.1



Design for EMC - Successful Two-day Seminar - EMC Compliance Journal - March 2002



Flomerics and Cooling Zone Announce Joint-Marketing Collaboration



Powering Heat Sink Development Using CFD Models - PCIM Europe - December 2001



Cambridge Broadband Optimizes VectaStar 3500 Using Flomerics’ Thermal Design Services



Ascom Use FloTHERM to Perfect Novel Heat Sink Design & Make Telecom Power Supply Products Smaller



CFD Helps Predict Air Flow & Heat Transfer in Electronic Components



Pipinghot Networks Knocks 3 Months off Development Time Using FloTHERM



Thermal Management Software Helps Car DVD Players to Survive Roof-Mounting



Complex-IC packages get simple thermal models



Blowing Hot and Cold



Webtherm Thermal Simulation



Web-based Thermal Simulation of Electronic Components



DVD helped to handle the heat



FloTHERM helps keep in-car DVD players cool



Integrating Electromagnetic and Thermal Design



Flomerics Group PLC - Final Results



FloTHERM helps Advanced Fibre Communications to make significant savings in development of new ADSL telecommunications enclosure



Quick Solve (FloTHERM V3.1)



WebTHERM - The First On-Line Thermal Simulator from a Semiconductor Manufacturer



Web-based FloTHERM.PACK IC Package modeling application helps AMCC slash thermal simulation time



Thermal simulation on the web



Component Modeling Accelerates Thermal Analysis



www.flopack.com - Web-Based 'Wizard' Produces Thermal Models Of Electronic Packages In Seconds



Neue Lüfterbibliotheken (German)



Virtual Prototyping can diagnose and eliminate trouble spots



Right for all circumstances



Flomerics Announces



The use of CFD in electronics systems design within the automotive industry



FloTHERM Thermal Design Software Contributes to the Cooling System for InFocus' Dragonfly Multimedia Projector (Chinese)



Hot Chips



Software helps design the cooling system for multimedia projector



Electronics enterprise is big hit in Queen's Awards



FloTHERM Thermal Design Software Contributes to the Cooling System for InFocus' Award-Winning LP330



New ultra-fast version of FloTHERM thermal management software takes advantage of enhanced computation speeds offered by INTEL's new multi-processor platforms



Flomerics Announces FloTHERM Version 2.2 Enhancements Facilitate Thermal Analyses and Boost User Productivity



FloTHERM.PACK Gains New Thermal Modeling Capability: Compact Models Now Offered via Web



New FloTHERM Solver Speeds Up Design Time For Electronic Engineers



Flomerics Establishes New Thermal Design Division



Flomerics Enhances MCAD Integration For FloTHERM With FloMCAD.Bridge VERSION 2.2



Flomerics Introduces FloTHERM.PACK For The Thermal Modeling Of Electronic Packages



Relative Metrics' Library Of Thermal Data Now Offered By Flomerics For Use With FloTHERM



Johnson Matthey Electronics Establishes Strategic Joint Marketing Agreement with Flomerics Inc. to Provide Integrated Thermal Solutions



FLOMOTION - virtual reality applied to thermal analysis of electronic systems



FloTHERM version 2 sets a new standard for the thermal analysis and cooling of electronic equipment



Collaboration Between BT, in the UK, and SUN Microsystems in the US, Signals New Global Standards in Thermal Design



MCAD Simplification Tool Aids Thermal Analysis

 

Home | Contact Us | Company | Products & Services | Industries | Applications | News | Events | Support
Copyright © Mentor Graphics Corporation, Mechanical Analysis Division