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Characterization and Design of IC Packages
Overview
Deployed over the web at www.thermpaq.com, FloTHERM.PACKSIM is a unique, new software program enabling
semiconductor and packaging companies to streamline and automate the thermal characterization of IC packages.
Based on Flopack, Mentor Graphics’ web-based SmartPart library, FloTHERM.PACKSIM generates fast, accurate thermal models for IC packages, test boards
and standard test harnesses.
Accurate package models can be generated 100 times faster than conventional modeling approaches including emerging de facto industry standard
thermal models such as DELPHI.
Mentor Graphics research reveals that a typical semiconductor thermal group spends approximately 60% of its time on standard package thermal
characterization and the rest on customer-specific simulations. FloTHERM.PACKSIM reduces the time spent on standard package thermal characterization
to almost zero, and saves around 25% of the time spent on customer-specific work. To see the savings for your group use the Return-on-Investment
calculator below.
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FloTHERM.PACKSIM Return-on-Investment Calculator |
Typical Group |
Your Group |
| a |
Number of engineers in group |
3 |
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| b |
Personnel cost per engineer, excluding overheads |
$125,000 |
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| c |
Percentage time spent on standard characterization |
60 |
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| d |
Percentage time on customer-specific work [100-c] |
40 |
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| e |
Saving on std. characterization [80% * a * b * c] |
$180,000 |
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| f |
Saving on customer-specific work [25% * a * b * d] |
$37,500 |
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| g |
Total potential savings from using FloTHERM.PACKSIM |
$217,500 |
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Model Creation
Conceptual Part Definition Driven by SmartPart Wizard
In initial, conceptual stages of the design physical layout data for the package may not be available. That’s when FloTHERM.PACKSIM’s
wizard-driven SmartPart engine is useful. It generates the package model with just a few clicks based on high-level inputs such
as the JEDEC outline, pincount, and power. In-built design rules based on industry inputs ensure that the generated package is
representative of an actual package for the given outline.
Extensive Package Catalogue
FloTHERM.PACKSIM supports an extensive catalog of more than 40 package families – Plastic and Ceramic BGAs (wire-bonded and flip-chip),
leaded families such as PQFP, PLCC, TSOP, Chip Scale and Near-Chip Scale packages such as QFN, MicroBGATM, and MicroStar BGATM,
power electronics packages such as TO-220, DPAK, D2PAK, SOT23, and the more recent stacked-die/MCM families.
Part Definition Imported from Package-Level EDA Software
The entire substrate design can be imported from Cadence Allegro Package Designer through an intelligent wizard that helps
the user select the appropriate package family and populate the relevant FloTHERM.PACKSIM data sheet, automating package model creation.
Once imported the package data is editable, so the process is fully under the user’s control.
Libraries of Parts
FloTHERM.PACKSIM represents the package as a collection of libraries for all package constitutive package elements such as die, die attach,
die pad, encapsulant, bond wires, leadframe, substrate, lid, slug and solder balls. Build up new package models even more quickly
by assembling pre-stored libraries.
Power Map Import
Power maps can be imported to define non-uniform die heating power
Part Definition Driven by XML or CSV
If your package input data is in XML or CSV format, you can import it directly from an XML/CSV file in a one-click operation.
Continuous Update of Package Models
The package models FloTHERM.PACKSIM supports are being continuously updated to capture the rapid advances in packaging technology, particularly
System-in-Package (SiP) and stacked-die.
Thermal Metric and Compact Model Generation
Automatic generation of JEDEC Thermal Metrics
FloTHERM.PACKSIM sets up and runs repeated thermal simulations to generate a complete set of JEDEC thermal data metrics for the package
(Theta-JA, Theta-JMA, Theta-JB, Theta-JC, Psi-JT, Psi-JB). FloTHERM.PACKSIM allows the export of all metrics data as Excel-compatible
CSV files.
Automatic Compact Thermal Model Creation
Two-resistor (2-R) and DELPHI compact thermal models of the package can be generated to support your customers thermal design
activities.
Compact models are available in the form of Compact Component SmartPart and Network Assembly formats. Their availability in
vendor-neutral XML format is being considered.
Design Sensitivity Analysis
Vary leading package parameters such as die size, power, die attach conductivity, lead pitch etc. and let FloTHERM.PACKSIM calculate
any combination of JEDEC metrics and compact models for the multiple scenarios that result in just a few mouse clicks.
Searchable Results Database
FloTHERM.PACKSIM automated and batch features allow extremely rapid generation of large amounts of data for metrics and models. Use the
advanced and extensive Results Database to select the optimal starting point for a new package design from your previous solutions.
Results Visualization
Pack files for all solved cases will also be available and can be visualized in the Stand-Alone Visual Editor included in a FloTHERM.PACKSIM license.
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