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What is FloTHERM.PACKSIM?

FloTHERM.PACKSIM is a unique, new software program enabling semiconductor and packaging companies to streamline and automate the thermal characterization of IC packages. FloTHERM.PACKSIM is designed to be used by all those involved in the thermal design and characterization of IC packages, including Thermal Engineers and Package Designers.
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Why Choose FloTHERM.PACKSIM?

Beyond the financial benefits, FloTHERM.PACKSIM also enhances the quality, reliability and availability of package thermal models by providing a fast, simple, proven, automated process that reduces the number of distinct steps required to be performed by thermal experts, reducing the risk of modeling errors to give reliable metrics and design insights.
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Launch FloTHERM.PACKSIM

Launch FloTHERM.PACKSIM version 1.1 to sign in or request a free one-month trial.
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»FloTHERM.PACKSIM from Flomerics Accelerates Thermal Characterization of Semiconductor Packages
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